JP7438171B2 - 供給タンク、供給装置、供給システム - Google Patents

供給タンク、供給装置、供給システム Download PDF

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Publication number
JP7438171B2
JP7438171B2 JP2021148834A JP2021148834A JP7438171B2 JP 7438171 B2 JP7438171 B2 JP 7438171B2 JP 2021148834 A JP2021148834 A JP 2021148834A JP 2021148834 A JP2021148834 A JP 2021148834A JP 7438171 B2 JP7438171 B2 JP 7438171B2
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JP
Japan
Prior art keywords
region
processing liquid
partition plate
pipe
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021148834A
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English (en)
Japanese (ja)
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JP2023041453A5 (enExample
JP2023041453A (ja
Inventor
正明 古矢
浩秋 小林
秀樹 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2021148834A priority Critical patent/JP7438171B2/ja
Priority to KR1020220109876A priority patent/KR102658584B1/ko
Priority to CN202211077714.3A priority patent/CN115810561B/zh
Priority to TW112128057A priority patent/TWI847816B/zh
Priority to TW111134078A priority patent/TWI814577B/zh
Priority to US17/942,520 priority patent/US12347699B2/en
Publication of JP2023041453A publication Critical patent/JP2023041453A/ja
Publication of JP2023041453A5 publication Critical patent/JP2023041453A5/ja
Application granted granted Critical
Publication of JP7438171B2 publication Critical patent/JP7438171B2/ja
Priority to KR1020240047209A priority patent/KR102797838B1/ko
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021148834A 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム Active JP7438171B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム
KR1020220109876A KR102658584B1 (ko) 2021-09-13 2022-08-31 공급 탱크, 공급 장치, 공급 시스템
CN202211077714.3A CN115810561B (zh) 2021-09-13 2022-09-05 供给罐、供给装置、供给系统
TW111134078A TWI814577B (zh) 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統
TW112128057A TWI847816B (zh) 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統
US17/942,520 US12347699B2 (en) 2021-09-13 2022-09-12 Supply tank, supply device and supply system
KR1020240047209A KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Publications (3)

Publication Number Publication Date
JP2023041453A JP2023041453A (ja) 2023-03-24
JP2023041453A5 JP2023041453A5 (enExample) 2023-06-08
JP7438171B2 true JP7438171B2 (ja) 2024-02-26

Family

ID=85479813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021148834A Active JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Country Status (5)

Country Link
US (1) US12347699B2 (enExample)
JP (1) JP7438171B2 (enExample)
KR (2) KR102658584B1 (enExample)
CN (1) CN115810561B (enExample)
TW (2) TWI847816B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313A (zh) * 2022-06-14 2023-12-22 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168088A1 (en) 2001-12-04 2003-09-11 Kaori Watanabe Chemical solution treatment apparatus for semiconductor substrate
JP2014130954A (ja) 2012-12-28 2014-07-10 Tokyo Electron Ltd 液処理装置および薬液回収方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 Shibaura Mechatronics Corp Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
US20120006790A1 (en) * 2009-03-31 2012-01-12 Kurita Water Industries Ltd. Apparatus and method for treating etching solution
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
KR101344915B1 (ko) * 2011-10-31 2013-12-26 세메스 주식회사 기판 처리 장치 및 약액 재생 방법
US10510527B2 (en) * 2013-02-01 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Single wafer cleaning tool with H2SO4 recycling
JP6352385B2 (ja) * 2013-03-15 2018-07-04 ティーイーエル エフエスアイ，インコーポレイティド 加熱されたエッチング溶液を供する処理システム及び方法
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6454629B2 (ja) * 2014-12-16 2019-01-16 東京エレクトロン株式会社 基板液処理装置
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2019192863A (ja) * 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) * 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168088A1 (en) 2001-12-04 2003-09-11 Kaori Watanabe Chemical solution treatment apparatus for semiconductor substrate
JP2014130954A (ja) 2012-12-28 2014-07-10 Tokyo Electron Ltd 液処理装置および薬液回収方法

Also Published As

Publication number Publication date
US12347699B2 (en) 2025-07-01
TWI847816B (zh) 2024-07-01
KR102658584B1 (ko) 2024-04-17
KR102797838B1 (ko) 2025-04-17
CN115810561B (zh) 2025-07-08
TWI814577B (zh) 2023-09-01
KR20240049263A (ko) 2024-04-16
KR20230039532A (ko) 2023-03-21
CN115810561A (zh) 2023-03-17
JP2023041453A (ja) 2023-03-24
TW202349545A (zh) 2023-12-16
US20230077617A1 (en) 2023-03-16
TW202312325A (zh) 2023-03-16

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