KR102658584B1 - 공급 탱크, 공급 장치, 공급 시스템 - Google Patents

공급 탱크, 공급 장치, 공급 시스템 Download PDF

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Publication number
KR102658584B1
KR102658584B1 KR1020220109876A KR20220109876A KR102658584B1 KR 102658584 B1 KR102658584 B1 KR 102658584B1 KR 1020220109876 A KR1020220109876 A KR 1020220109876A KR 20220109876 A KR20220109876 A KR 20220109876A KR 102658584 B1 KR102658584 B1 KR 102658584B1
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processing liquid
liquid
region
area
pipe
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Korean (ko)
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KR20230039532A (ko
Inventor
마사아키 후루야
히로아키 고바야시
히데키 모리
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20230039532A publication Critical patent/KR20230039532A/ko
Priority to KR1020240047209A priority Critical patent/KR102797838B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020220109876A 2021-09-13 2022-08-31 공급 탱크, 공급 장치, 공급 시스템 Active KR102658584B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020240047209A KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-148834 2021-09-13
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020240047209A Division KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Publications (2)

Publication Number Publication Date
KR20230039532A KR20230039532A (ko) 2023-03-21
KR102658584B1 true KR102658584B1 (ko) 2024-04-17

Family

ID=85479813

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020220109876A Active KR102658584B1 (ko) 2021-09-13 2022-08-31 공급 탱크, 공급 장치, 공급 시스템
KR1020240047209A Active KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Family Applications After (1)

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KR1020240047209A Active KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Country Status (5)

Country Link
US (1) US12347699B2 (enExample)
JP (1) JP7438171B2 (enExample)
KR (2) KR102658584B1 (enExample)
CN (1) CN115810561B (enExample)
TW (2) TWI847816B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313A (zh) * 2022-06-14 2023-12-22 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218405A (ja) 2008-03-11 2009-09-24 Dainippon Screen Mfg Co Ltd 処理液供給装置およびそれを備えた基板処理装置
JP2015079884A (ja) 2013-10-17 2015-04-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2019192863A (ja) 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP3761457B2 (ja) * 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 Shibaura Mechatronics Corp Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
CN102356454B (zh) * 2009-03-31 2014-03-26 栗田工业株式会社 蚀刻液的处理装置以及处理方法
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
KR101344915B1 (ko) * 2011-10-31 2013-12-26 세메스 주식회사 기판 처리 장치 및 약액 재생 방법
JP6010457B2 (ja) * 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10510527B2 (en) * 2013-02-01 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Single wafer cleaning tool with H2SO4 recycling
KR102204850B1 (ko) * 2013-03-15 2021-01-18 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 가열된 에칭 용액을 제공하기 위한 시스템
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
JP6454629B2 (ja) * 2014-12-16 2019-01-16 東京エレクトロン株式会社 基板液処理装置
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218405A (ja) 2008-03-11 2009-09-24 Dainippon Screen Mfg Co Ltd 処理液供給装置およびそれを備えた基板処理装置
JP2015079884A (ja) 2013-10-17 2015-04-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2019192863A (ja) 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置

Also Published As

Publication number Publication date
CN115810561B (zh) 2025-07-08
CN115810561A (zh) 2023-03-17
KR102797838B1 (ko) 2025-04-17
JP7438171B2 (ja) 2024-02-26
KR20240049263A (ko) 2024-04-16
TW202349545A (zh) 2023-12-16
TW202312325A (zh) 2023-03-16
US12347699B2 (en) 2025-07-01
US20230077617A1 (en) 2023-03-16
TWI847816B (zh) 2024-07-01
JP2023041453A (ja) 2023-03-24
KR20230039532A (ko) 2023-03-21
TWI814577B (zh) 2023-09-01

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