TWI847816B - 供給罐、供給裝置、供給系統 - Google Patents

供給罐、供給裝置、供給系統 Download PDF

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Publication number
TWI847816B
TWI847816B TW112128057A TW112128057A TWI847816B TW I847816 B TWI847816 B TW I847816B TW 112128057 A TW112128057 A TW 112128057A TW 112128057 A TW112128057 A TW 112128057A TW I847816 B TWI847816 B TW I847816B
Authority
TW
Taiwan
Prior art keywords
processing liquid
area
pipe
partition plate
liquid
Prior art date
Application number
TW112128057A
Other languages
English (en)
Chinese (zh)
Other versions
TW202349545A (zh
Inventor
古矢正明
小林浩秋
森秀樹
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202349545A publication Critical patent/TW202349545A/zh
Application granted granted Critical
Publication of TWI847816B publication Critical patent/TWI847816B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW112128057A 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統 TWI847816B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-148834 2021-09-13
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Publications (2)

Publication Number Publication Date
TW202349545A TW202349545A (zh) 2023-12-16
TWI847816B true TWI847816B (zh) 2024-07-01

Family

ID=85479813

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112128057A TWI847816B (zh) 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統
TW111134078A TWI814577B (zh) 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111134078A TWI814577B (zh) 2021-09-13 2022-09-08 供給罐、供給裝置、供給系統

Country Status (5)

Country Link
US (1) US12347699B2 (enExample)
JP (1) JP7438171B2 (enExample)
KR (2) KR102658584B1 (enExample)
CN (1) CN115810561B (enExample)
TW (2) TWI847816B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313A (zh) * 2022-06-14 2023-12-22 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201324662A (zh) * 2011-10-31 2013-06-16 Semes Co Ltd 基板處理裝置和化學回收之方法
US20140216500A1 (en) * 2013-02-01 2014-08-07 Taiwan Semicunductor Manufacturing Co., Ltd. Single Wafer Cleaning Tool with H2SO4 Recycling
TW201448020A (zh) * 2013-03-29 2014-12-16 Shibaura Mechatronics Corp 濕式蝕刻裝置
TW201501195A (zh) * 2013-03-15 2015-01-01 Tel Fsi Inc 用以提供加熱的蝕刻溶液之處理系統及方法
US10249505B2 (en) * 2009-03-31 2019-04-02 Kurita Water Industries Ltd. Method for treating etching solution

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JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP3761457B2 (ja) * 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 Shibaura Mechatronics Corp Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
JP6010457B2 (ja) * 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6454629B2 (ja) * 2014-12-16 2019-01-16 東京エレクトロン株式会社 基板液処理装置
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2019192863A (ja) * 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) * 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10249505B2 (en) * 2009-03-31 2019-04-02 Kurita Water Industries Ltd. Method for treating etching solution
TW201324662A (zh) * 2011-10-31 2013-06-16 Semes Co Ltd 基板處理裝置和化學回收之方法
US20140216500A1 (en) * 2013-02-01 2014-08-07 Taiwan Semicunductor Manufacturing Co., Ltd. Single Wafer Cleaning Tool with H2SO4 Recycling
TW201501195A (zh) * 2013-03-15 2015-01-01 Tel Fsi Inc 用以提供加熱的蝕刻溶液之處理系統及方法
TW201448020A (zh) * 2013-03-29 2014-12-16 Shibaura Mechatronics Corp 濕式蝕刻裝置
TW202029329A (zh) * 2013-03-29 2020-08-01 日商芝浦機械電子裝置股份有限公司 濕式蝕刻裝置

Also Published As

Publication number Publication date
US12347699B2 (en) 2025-07-01
KR102658584B1 (ko) 2024-04-17
KR102797838B1 (ko) 2025-04-17
CN115810561B (zh) 2025-07-08
TWI814577B (zh) 2023-09-01
KR20240049263A (ko) 2024-04-16
KR20230039532A (ko) 2023-03-21
CN115810561A (zh) 2023-03-17
JP2023041453A (ja) 2023-03-24
TW202349545A (zh) 2023-12-16
JP7438171B2 (ja) 2024-02-26
US20230077617A1 (en) 2023-03-16
TW202312325A (zh) 2023-03-16

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