CN115810561B - 供给罐、供给装置、供给系统 - Google Patents

供给罐、供给装置、供给系统 Download PDF

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Publication number
CN115810561B
CN115810561B CN202211077714.3A CN202211077714A CN115810561B CN 115810561 B CN115810561 B CN 115810561B CN 202211077714 A CN202211077714 A CN 202211077714A CN 115810561 B CN115810561 B CN 115810561B
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China
Prior art keywords
region
processing liquid
liquid
pipe
partition plate
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CN202211077714.3A
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English (en)
Chinese (zh)
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CN115810561A (zh
Inventor
古矢正明
小林浩秋
森秀树
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN115810561A publication Critical patent/CN115810561A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202211077714.3A 2021-09-13 2022-09-05 供给罐、供给装置、供给系统 Active CN115810561B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-148834 2021-09-13
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Publications (2)

Publication Number Publication Date
CN115810561A CN115810561A (zh) 2023-03-17
CN115810561B true CN115810561B (zh) 2025-07-08

Family

ID=85479813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211077714.3A Active CN115810561B (zh) 2021-09-13 2022-09-05 供给罐、供给装置、供给系统

Country Status (5)

Country Link
US (1) US12347699B2 (enExample)
JP (1) JP7438171B2 (enExample)
KR (2) KR102658584B1 (enExample)
CN (1) CN115810561B (enExample)
TW (2) TWI847816B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313A (zh) * 2022-06-14 2023-12-22 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
CN107112226A (zh) * 2014-12-16 2017-08-29 东京毅力科创株式会社 基板液处理装置

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JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP3761457B2 (ja) * 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 Shibaura Mechatronics Corp Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
US20120006790A1 (en) * 2009-03-31 2012-01-12 Kurita Water Industries Ltd. Apparatus and method for treating etching solution
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
KR101344915B1 (ko) * 2011-10-31 2013-12-26 세메스 주식회사 기판 처리 장치 및 약액 재생 방법
JP6010457B2 (ja) * 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10510527B2 (en) * 2013-02-01 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Single wafer cleaning tool with H2SO4 recycling
JP6352385B2 (ja) * 2013-03-15 2018-07-04 ティーイーエル エフエスアイ，インコーポレイティド 加熱されたエッチング溶液を供する処理システム及び方法
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2019192863A (ja) * 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) * 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
CN107112226A (zh) * 2014-12-16 2017-08-29 东京毅力科创株式会社 基板液处理装置

Also Published As

Publication number Publication date
US12347699B2 (en) 2025-07-01
TWI847816B (zh) 2024-07-01
KR102658584B1 (ko) 2024-04-17
KR102797838B1 (ko) 2025-04-17
TWI814577B (zh) 2023-09-01
KR20240049263A (ko) 2024-04-16
KR20230039532A (ko) 2023-03-21
CN115810561A (zh) 2023-03-17
JP2023041453A (ja) 2023-03-24
TW202349545A (zh) 2023-12-16
JP7438171B2 (ja) 2024-02-26
US20230077617A1 (en) 2023-03-16
TW202312325A (zh) 2023-03-16

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