JP7428646B2 - 金属張積層板及び回路基板 - Google Patents

金属張積層板及び回路基板 Download PDF

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Publication number
JP7428646B2
JP7428646B2 JP2020532311A JP2020532311A JP7428646B2 JP 7428646 B2 JP7428646 B2 JP 7428646B2 JP 2020532311 A JP2020532311 A JP 2020532311A JP 2020532311 A JP2020532311 A JP 2020532311A JP 7428646 B2 JP7428646 B2 JP 7428646B2
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Japan
Prior art keywords
polyimide
residue
layer
diamine
thickness
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JP2020532311A
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English (en)
Japanese (ja)
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JPWO2020022129A1 (ja
JPWO2020022129A5 (zh
Inventor
芳樹 須藤
智之 鈴木
康弘 安達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical and Materials Co Ltd
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Publication of JPWO2020022129A1 publication Critical patent/JPWO2020022129A1/ja
Publication of JPWO2020022129A5 publication Critical patent/JPWO2020022129A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
JP2020532311A 2018-07-25 2019-07-17 金属張積層板及び回路基板 Active JP7428646B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018139844 2018-07-25
JP2018139844 2018-07-25
PCT/JP2019/027994 WO2020022129A1 (ja) 2018-07-25 2019-07-17 金属張積層板及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2020022129A1 JPWO2020022129A1 (ja) 2021-08-05
JPWO2020022129A5 JPWO2020022129A5 (zh) 2022-07-08
JP7428646B2 true JP7428646B2 (ja) 2024-02-06

Family

ID=69180524

Family Applications (1)

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JP2020532311A Active JP7428646B2 (ja) 2018-07-25 2019-07-17 金属張積層板及び回路基板

Country Status (5)

Country Link
JP (1) JP7428646B2 (zh)
KR (1) KR20210036342A (zh)
CN (1) CN112469560B (zh)
TW (1) TWI804658B (zh)
WO (1) WO2020022129A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240046171A (ko) * 2021-08-13 2024-04-08 엘지전자 주식회사 복합 폴리이미드 기판, 복합 폴리이미드 조성물 및 이를 이용한 인쇄 회로 기판
CN113604045B (zh) * 2021-08-31 2022-09-02 烟台丰鲁精细化工有限责任公司 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016159060A1 (ja) 2015-03-31 2016-10-06 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP2017144730A (ja) 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031396B2 (ja) 1979-03-14 1985-07-22 松下電器産業株式会社 スピ−カシステム
JP3482723B2 (ja) * 1995-02-21 2004-01-06 宇部興産株式会社 多層芳香族ポリイミドフィルム
JP3827859B2 (ja) * 1998-04-13 2006-09-27 三井化学株式会社 ポリイミド−金属積層体及びその製造方法
JP5886027B2 (ja) * 2011-12-21 2016-03-16 新日鉄住金化学株式会社 両面金属張積層板およびその製造方法
JP6473028B2 (ja) 2015-03-31 2019-02-20 日鉄ケミカル＆マテリアル株式会社 銅張積層板、プリント配線板及びその使用方法
JP6427454B2 (ja) 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
WO2016159060A1 (ja) 2015-03-31 2016-10-06 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
JP2017144730A (ja) 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Also Published As

Publication number Publication date
WO2020022129A1 (ja) 2020-01-30
JPWO2020022129A1 (ja) 2021-08-05
TW202010635A (zh) 2020-03-16
TWI804658B (zh) 2023-06-11
CN112469560B (zh) 2023-05-16
CN112469560A (zh) 2021-03-09
KR20210036342A (ko) 2021-04-02

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