JP7425982B2 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents

感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDF

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Publication number
JP7425982B2
JP7425982B2 JP2022562370A JP2022562370A JP7425982B2 JP 7425982 B2 JP7425982 B2 JP 7425982B2 JP 2022562370 A JP2022562370 A JP 2022562370A JP 2022562370 A JP2022562370 A JP 2022562370A JP 7425982 B2 JP7425982 B2 JP 7425982B2
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Prior art keywords
meth
resin composition
photosensitive
acrylate
photosensitive resin
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Japanese (ja)
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JPWO2022113829A5 (https=
JPWO2022113829A1 (https=
Inventor
志歩 田中
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022562370A 2020-11-24 2021-11-16 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Active JP7425982B2 (ja)

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JP2023179342A JP2024008940A (ja) 2020-11-24 2023-10-18 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2020/043605 2020-11-24
PCT/JP2020/043605 WO2022113161A1 (ja) 2020-11-24 2020-11-24 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
PCT/JP2021/042092 WO2022113829A1 (ja) 2020-11-24 2021-11-16 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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JPWO2022113829A5 JPWO2022113829A5 (https=) 2022-12-22
JP7425982B2 true JP7425982B2 (ja) 2024-02-01

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JP2023179342A Pending JP2024008940A (ja) 2020-11-24 2023-10-18 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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JP (2) JP7425982B2 (https=)
KR (1) KR102895226B1 (https=)
CN (2) CN114902137A (https=)
TW (1) TWI877430B (https=)
WO (2) WO2022113161A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024210041A1 (ja) * 2023-04-03 2024-10-10 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及び配線基板の製造方法
JP2025155987A (ja) * 2024-03-29 2025-10-14 旭化成株式会社 感光性樹脂積層体、及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010169934A (ja) 2009-01-23 2010-08-05 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP2010249884A (ja) 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
CN108241259A (zh) 2018-01-24 2018-07-03 浙江福斯特新材料研究院有限公司 一种具有良好孔掩蔽功能可直接描绘曝光成像的抗蚀剂组合物

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JP4461037B2 (ja) * 2005-02-09 2010-05-12 ニチゴー・モートン株式会社 感光性樹脂組成物およびそれを用いてなる感光性樹脂積層体
JP4646759B2 (ja) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2009003000A (ja) * 2007-06-19 2009-01-08 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及び光硬化物の除去方法
JP4924230B2 (ja) 2007-06-21 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TW200908839A (en) * 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
JP5777461B2 (ja) 2011-09-14 2015-09-09 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5853588B2 (ja) * 2011-10-26 2016-02-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JPWO2013141286A1 (ja) * 2012-03-23 2015-08-03 日立化成株式会社 感光性樹脂組成物、及びこれを用いた加工ガラス基板の製造方法、並びにタッチパネル及びその製造方法
US10104781B2 (en) * 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
JP6391121B2 (ja) * 2016-01-20 2018-09-19 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
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TWI882983B (zh) * 2019-02-05 2025-05-11 日商力森諾科股份有限公司 感光性樹脂組成物、感光性元件、阻劑圖案的形成方法及印刷線路板的製造方法
CN111965939B (zh) * 2020-08-11 2023-06-20 杭州福斯特电子材料有限公司 一种感光树脂组合物及其干膜抗蚀剂

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2010169934A (ja) 2009-01-23 2010-08-05 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP2010249884A (ja) 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
CN108241259A (zh) 2018-01-24 2018-07-03 浙江福斯特新材料研究院有限公司 一种具有良好孔掩蔽功能可直接描绘曝光成像的抗蚀剂组合物

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WO2022113161A1 (ja) 2022-06-02
KR102895226B1 (ko) 2025-12-04
CN114902137A (zh) 2022-08-12
CN115167077A (zh) 2022-10-11
JP2024008940A (ja) 2024-01-19
TW202227577A (zh) 2022-07-16
JPWO2022113829A1 (https=) 2022-06-02
WO2022113829A1 (ja) 2022-06-02
KR20230109152A (ko) 2023-07-19
TWI877430B (zh) 2025-03-21

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