CN114902137A - 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 - Google Patents

感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 Download PDF

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Publication number
CN114902137A
CN114902137A CN202180007845.1A CN202180007845A CN114902137A CN 114902137 A CN114902137 A CN 114902137A CN 202180007845 A CN202180007845 A CN 202180007845A CN 114902137 A CN114902137 A CN 114902137A
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CN
China
Prior art keywords
meth
resin composition
acrylate
photosensitive resin
photosensitive
Prior art date
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Pending
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CN202180007845.1A
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English (en)
Chinese (zh)
Inventor
田中志步
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Resonac Holdings Corp
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Showa Denko KK
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Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to CN202210896651.8A priority Critical patent/CN115167077A/zh
Publication of CN114902137A publication Critical patent/CN114902137A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202180007845.1A 2020-11-24 2021-11-16 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法 Pending CN114902137A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210896651.8A CN115167077A (zh) 2020-11-24 2021-11-16 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2020/043605 2020-11-24
PCT/JP2020/043605 WO2022113161A1 (ja) 2020-11-24 2020-11-24 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
PCT/JP2021/042092 WO2022113829A1 (ja) 2020-11-24 2021-11-16 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Related Child Applications (1)

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CN202210896651.8A Division CN115167077A (zh) 2020-11-24 2021-11-16 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

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Publication Number Publication Date
CN114902137A true CN114902137A (zh) 2022-08-12

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CN202180007845.1A Pending CN114902137A (zh) 2020-11-24 2021-11-16 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法
CN202210896651.8A Pending CN115167077A (zh) 2020-11-24 2021-11-16 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

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JP (2) JP7425982B2 (https=)
KR (1) KR102895226B1 (https=)
CN (2) CN114902137A (https=)
TW (1) TWI877430B (https=)
WO (2) WO2022113161A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024210041A1 (ja) * 2023-04-03 2024-10-10 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及び配線基板の製造方法
JP2025155987A (ja) * 2024-03-29 2025-10-14 旭化成株式会社 感光性樹脂積層体、及びその製造方法

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JP2007086224A (ja) * 2005-09-20 2007-04-05 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2009003000A (ja) * 2007-06-19 2009-01-08 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及び光硬化物の除去方法
JP2013092676A (ja) * 2011-10-26 2013-05-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN105849641A (zh) * 2013-12-27 2016-08-10 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
JP2017191171A (ja) * 2016-04-12 2017-10-19 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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JP4924230B2 (ja) 2007-06-21 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TW200908839A (en) * 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
JP4935833B2 (ja) * 2009-01-23 2012-05-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP2010249884A (ja) * 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
JP5777461B2 (ja) 2011-09-14 2015-09-09 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JPWO2013141286A1 (ja) * 2012-03-23 2015-08-03 日立化成株式会社 感光性樹脂組成物、及びこれを用いた加工ガラス基板の製造方法、並びにタッチパネル及びその製造方法
JP6391121B2 (ja) * 2016-01-20 2018-09-19 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
CN105629662B (zh) * 2015-12-31 2019-09-10 杭州福斯特应用材料股份有限公司 一种干膜光致抗蚀剂
WO2019088268A1 (ja) * 2017-11-06 2019-05-09 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
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JP2007086224A (ja) * 2005-09-20 2007-04-05 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2009003000A (ja) * 2007-06-19 2009-01-08 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及び光硬化物の除去方法
JP2013092676A (ja) * 2011-10-26 2013-05-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN105849641A (zh) * 2013-12-27 2016-08-10 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
JP2017191171A (ja) * 2016-04-12 2017-10-19 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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WO2022113161A1 (ja) 2022-06-02
KR102895226B1 (ko) 2025-12-04
CN115167077A (zh) 2022-10-11
JP2024008940A (ja) 2024-01-19
TW202227577A (zh) 2022-07-16
JPWO2022113829A1 (https=) 2022-06-02
JP7425982B2 (ja) 2024-02-01
WO2022113829A1 (ja) 2022-06-02
KR20230109152A (ko) 2023-07-19
TWI877430B (zh) 2025-03-21

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