JP7401917B2 - 光硬化性樹脂組成物及びそれを硬化させて得られる硬化物 - Google Patents

光硬化性樹脂組成物及びそれを硬化させて得られる硬化物 Download PDF

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JP7401917B2
JP7401917B2 JP2020572139A JP2020572139A JP7401917B2 JP 7401917 B2 JP7401917 B2 JP 7401917B2 JP 2020572139 A JP2020572139 A JP 2020572139A JP 2020572139 A JP2020572139 A JP 2020572139A JP 7401917 B2 JP7401917 B2 JP 7401917B2
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resin composition
component
photocurable resin
group
present
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JPWO2020166288A1 (ja
JPWO2020166288A5 (enExample
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チューバロウ，パウエル
敏行 佐藤
政義 大友
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Namics Corp
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Namics Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Polymerization Catalysts (AREA)
JP2020572139A 2019-02-12 2020-01-22 光硬化性樹脂組成物及びそれを硬化させて得られる硬化物 Active JP7401917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962804337P 2019-02-12 2019-02-12
US62/804,337 2019-02-12
PCT/JP2020/002100 WO2020166288A1 (ja) 2019-02-12 2020-01-22 光硬化性樹脂組成物及びそれを硬化させて得られる硬化物

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JPWO2020166288A1 JPWO2020166288A1 (ja) 2021-12-16
JPWO2020166288A5 JPWO2020166288A5 (enExample) 2022-11-10
JP7401917B2 true JP7401917B2 (ja) 2023-12-20

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US (1) US20220144993A1 (enExample)
EP (1) EP3925993B1 (enExample)
JP (1) JP7401917B2 (enExample)
KR (1) KR102801857B1 (enExample)
CN (1) CN113423750B (enExample)
TW (1) TWI813852B (enExample)
WO (1) WO2020166288A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230229079A1 (en) * 2020-07-01 2023-07-20 Namics Corporation Photosensitive resin composition, cured product thereof, and wiring structure containing cured product
JP7744268B2 (ja) * 2022-03-08 2025-09-25 日本化薬株式会社 硬化性樹脂組成物、その硬化物および半導体装置
WO2025074949A1 (ja) * 2023-10-04 2025-04-10 ダウ・東レ株式会社 紫外線硬化性組成物

Citations (10)

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JP2003515642A (ja) 1999-12-01 2003-05-07 ゼネラル・エレクトリック・カンパニイ ポリ（フェニレンエーテル）−ポリビニル熱硬化性樹脂
WO2005073264A1 (ja) 2004-01-30 2005-08-11 Nippon Steel Chemical Co., Ltd. 硬化性樹脂組成物
JP2006513301A (ja) 2003-01-14 2006-04-20 ゼネラル・エレクトリック・カンパニイ ポリ（フェニレンエーテル）−ポリビニル熱硬化性接着剤、フィルム、及びそれから製造した基板
JP2007112826A (ja) 2005-10-18 2007-05-10 Matsushita Electric Works Ltd 樹脂組成物、プリプレグ、積層体
JP2011026370A (ja) 2009-07-21 2011-02-10 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
WO2016104748A1 (ja) 2014-12-26 2016-06-30 新日鉄住金化学株式会社 末端変性可溶性多官能ビニル芳香族共重合体、硬化性樹脂組成物及びこれを用いた光導波路
JP2017047648A (ja) 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
WO2017135168A1 (ja) 2016-02-02 2017-08-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、プリント配線板及び半導体装置
WO2018030112A1 (ja) 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法
WO2019130735A1 (ja) 2017-12-28 2019-07-04 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板

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CN100387103C (zh) * 1999-08-12 2008-05-07 Ibiden股份有限公司 多层印刷电路板和半导体器件
CN1756655A (zh) * 2003-01-14 2006-04-05 通用电气公司 聚(亚苯基醚)－聚乙烯基热固性粘合剂膜和由其制造的基体
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP2004294882A (ja) 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd 感光性樹脂組成物及び硬化物
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
JP5078648B2 (ja) 2008-02-08 2012-11-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
US10030133B2 (en) * 2011-12-06 2018-07-24 Kaneka Corporation Black photosensitive resin composition and use of same
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
TWI686436B (zh) * 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
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Publication number Priority date Publication date Assignee Title
JP2003515642A (ja) 1999-12-01 2003-05-07 ゼネラル・エレクトリック・カンパニイ ポリ（フェニレンエーテル）−ポリビニル熱硬化性樹脂
JP2006513301A (ja) 2003-01-14 2006-04-20 ゼネラル・エレクトリック・カンパニイ ポリ（フェニレンエーテル）−ポリビニル熱硬化性接着剤、フィルム、及びそれから製造した基板
WO2005073264A1 (ja) 2004-01-30 2005-08-11 Nippon Steel Chemical Co., Ltd. 硬化性樹脂組成物
JP2007112826A (ja) 2005-10-18 2007-05-10 Matsushita Electric Works Ltd 樹脂組成物、プリプレグ、積層体
JP2011026370A (ja) 2009-07-21 2011-02-10 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
WO2016104748A1 (ja) 2014-12-26 2016-06-30 新日鉄住金化学株式会社 末端変性可溶性多官能ビニル芳香族共重合体、硬化性樹脂組成物及びこれを用いた光導波路
JP2017047648A (ja) 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
WO2017135168A1 (ja) 2016-02-02 2017-08-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、プリント配線板及び半導体装置
WO2018030112A1 (ja) 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP2018028078A (ja) 2016-08-10 2018-02-22 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法
WO2019130735A1 (ja) 2017-12-28 2019-07-04 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板

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US20220144993A1 (en) 2022-05-12
EP3925993A4 (en) 2022-11-09
KR20210127959A (ko) 2021-10-25
WO2020166288A1 (ja) 2020-08-20
CN113423750A (zh) 2021-09-21
TW202035597A (zh) 2020-10-01
EP3925993A1 (en) 2021-12-22
CN113423750B (zh) 2023-11-21
KR102801857B1 (ko) 2025-05-02
EP3925993B1 (en) 2023-09-13
JPWO2020166288A1 (ja) 2021-12-16
TWI813852B (zh) 2023-09-01

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