TWI813852B - 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 - Google Patents

光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 Download PDF

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Publication number
TWI813852B
TWI813852B TW109102578A TW109102578A TWI813852B TW I813852 B TWI813852 B TW I813852B TW 109102578 A TW109102578 A TW 109102578A TW 109102578 A TW109102578 A TW 109102578A TW I813852 B TWI813852 B TW I813852B
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TW
Taiwan
Prior art keywords
resin composition
photocurable resin
component
group
present
Prior art date
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TW109102578A
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English (en)
Chinese (zh)
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TW202035597A (zh
Inventor
帕維爾 克巴羅
行
大友政義
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日商納美仕有限公司
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Publication of TW202035597A publication Critical patent/TW202035597A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Polymerization Catalysts (AREA)
TW109102578A 2019-02-12 2020-01-22 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 TWI813852B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962804337P 2019-02-12 2019-02-12
US62/804,337 2019-02-12

Publications (2)

Publication Number Publication Date
TW202035597A TW202035597A (zh) 2020-10-01
TWI813852B true TWI813852B (zh) 2023-09-01

Family

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Family Applications (1)

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TW109102578A TWI813852B (zh) 2019-02-12 2020-01-22 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置

Country Status (7)

Country Link
US (1) US20220144993A1 (enExample)
EP (1) EP3925993B1 (enExample)
JP (1) JP7401917B2 (enExample)
KR (1) KR102801857B1 (enExample)
CN (1) CN113423750B (enExample)
TW (1) TWI813852B (enExample)
WO (1) WO2020166288A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230229079A1 (en) * 2020-07-01 2023-07-20 Namics Corporation Photosensitive resin composition, cured product thereof, and wiring structure containing cured product
JP7744268B2 (ja) * 2022-03-08 2025-09-25 日本化薬株式会社 硬化性樹脂組成物、その硬化物および半導体装置
WO2025074949A1 (ja) * 2023-10-04 2025-04-10 ダウ・東レ株式会社 紫外線硬化性組成物

Citations (2)

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TW200410623A (en) * 1999-08-12 2004-06-16 Ibiden Co Ltd Multi-layer printed circuit board and semiconductor device
WO2018030112A1 (ja) * 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法

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US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
CN1756655A (zh) * 2003-01-14 2006-04-05 通用电气公司 聚(亚苯基醚)－聚乙烯基热固性粘合剂膜和由其制造的基体
US20040137251A1 (en) * 2003-01-14 2004-07-15 Davis Michael John Poly(phenylene ether)-polyvinyl thermosetting adhesives films, and substrates made therefrom
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP2004294882A (ja) 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd 感光性樹脂組成物及び硬化物
US7595362B2 (en) * 2004-01-30 2009-09-29 Nippon Steel Chemical Co., Ltd. Curable resin composition
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
JP5123477B2 (ja) * 2005-10-18 2013-01-23 パナソニック株式会社 樹脂組成物、プリプレグ、積層体
JP5078648B2 (ja) 2008-02-08 2012-11-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5439075B2 (ja) * 2009-07-21 2014-03-12 太陽ホールディングス株式会社 光硬化性樹脂組成物
US10030133B2 (en) * 2011-12-06 2018-07-24 Kaneka Corporation Black photosensitive resin composition and use of same
CN107108782B (zh) * 2014-12-26 2019-12-03 日铁化学材料株式会社 末端改性可溶性多官能乙烯基芳香族共聚合物及其应用
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
JP2017047648A (ja) * 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
TWI781918B (zh) * 2016-02-02 2022-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、印刷電路板及半導體裝置
JP7203386B2 (ja) * 2017-12-28 2023-01-13 パナソニックＩｐマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
TWI686436B (zh) * 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
CN112646350B (zh) * 2019-10-11 2023-04-25 台光电子材料(昆山)有限公司 一种树脂组合物及其制品

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TW200410623A (en) * 1999-08-12 2004-06-16 Ibiden Co Ltd Multi-layer printed circuit board and semiconductor device
WO2018030112A1 (ja) * 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
US20220144993A1 (en) 2022-05-12
EP3925993A4 (en) 2022-11-09
KR20210127959A (ko) 2021-10-25
WO2020166288A1 (ja) 2020-08-20
CN113423750A (zh) 2021-09-21
TW202035597A (zh) 2020-10-01
EP3925993A1 (en) 2021-12-22
CN113423750B (zh) 2023-11-21
KR102801857B1 (ko) 2025-05-02
EP3925993B1 (en) 2023-09-13
JPWO2020166288A1 (ja) 2021-12-16
JP7401917B2 (ja) 2023-12-20

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