JP7397061B2 - 金属－ｃｎｔ複合体、それらの製造方法及び材料 - Google Patents
金属－ｃｎｔ複合体、それらの製造方法及び材料 Download PDFInfo
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- JP7397061B2 JP7397061B2 JP2021505408A JP2021505408A JP7397061B2 JP 7397061 B2 JP7397061 B2 JP 7397061B2 JP 2021505408 A JP2021505408 A JP 2021505408A JP 2021505408 A JP2021505408 A JP 2021505408A JP 7397061 B2 JP7397061 B2 JP 7397061B2
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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| LU100919A LU100919B1 (en) | 2018-08-27 | 2018-08-27 | Metal-CNT composite, production method and materials therefor |
| LULU100919 | 2018-08-27 | ||
| PCT/EP2019/072454 WO2020043590A1 (en) | 2018-08-27 | 2019-08-22 | Metal-cnt composite, production method and materials therefor |
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| JP2021535055A JP2021535055A (ja) | 2021-12-16 |
| JPWO2020043590A5 JPWO2020043590A5 (https=) | 2023-09-05 |
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| LU102334B1 (en) | 2020-12-21 | 2022-06-21 | Luxembourg Inst Science & Tech List | Highly compact metal-CNT composites and manufacture thereof |
| LU102368B1 (en) | 2020-12-31 | 2022-06-30 | Luxembourg Inst Science & Tech List | Lightning strike protection material and Structure |
| CN113651315A (zh) | 2021-08-18 | 2021-11-16 | 成都富安纳新材料科技有限公司 | 易于分散的活性纳米碳粉末及其制备方法 |
| CN114751399B (zh) * | 2022-04-29 | 2024-04-09 | 北京航空航天大学 | 一种碳纳米管限域金属纳米线材料及其制备方法和应用 |
| CN115058751A (zh) * | 2022-07-15 | 2022-09-16 | 西安稀有金属材料研究院有限公司 | 一种基于聚多巴胺改性的钛基材料电镀方法 |
| CN117019590B (zh) * | 2023-06-29 | 2025-09-02 | 浙江工业大学 | 一种利用金属离子自组装的氧化石墨烯润滑涂层及制备方法 |
| WO2025030218A1 (en) * | 2023-08-10 | 2025-02-13 | Newsouth Innovations Pty Limited | Solution processable phenolic encapsulation of articles |
| CN117747311B (zh) * | 2024-02-20 | 2024-05-28 | 苏州宝丽迪材料科技股份有限公司 | 一种硫化亚铜/碳纳米管纤维电极及其制备方法和应用 |
| JP2026054950A (ja) * | 2024-09-17 | 2026-03-30 | 晴夫 浜田 | 熱交換部材及びその製造方法 |
| CN120484304B (zh) * | 2025-07-21 | 2025-09-30 | 中国农业科学院农产品加工研究所 | 高阻隔抑菌聚乳酸包装材料及其制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105552A (ja) | 2001-09-28 | 2003-04-09 | Seiren Co Ltd | 無電解メッキの前処理方法及びそれを用いてなる導電性材料 |
| JP2004315297A (ja) | 2003-04-17 | 2004-11-11 | Misuzu Kogyo:Kk | ナノカーボンコンポジット材及びその製造方法 |
| JP2005277096A (ja) | 2004-03-24 | 2005-10-06 | Japan Science & Technology Agency | カーボンナノチューブ含有金属膜を用いてなる半導体配線とその製造方法、およびカーボンナノチューブ含有金属膜の製造方法 |
| WO2012091139A1 (ja) | 2010-12-28 | 2012-07-05 | 独立行政法人産業技術総合研究所 | Ｃｎｔ金属複合材及びその製造方法 |
| JP2017101301A (ja) | 2015-12-03 | 2017-06-08 | トヨタ自動車株式会社 | 銅皮膜の成膜方法 |
| CN107093748A (zh) | 2017-04-12 | 2017-08-25 | 苏州大学 | 一种钴和氮共掺杂碳纳米管催化剂、制备方法及应用 |
| CN107252695A (zh) | 2017-07-26 | 2017-10-17 | 广东医科大学 | 钯基多巴胺包裹磁性碳纳米管催化剂及其制备方法及应用 |
| CN107604419A (zh) | 2017-07-24 | 2018-01-19 | 南昌大学 | 一种基于聚多巴胺表面改性的镍基碳纳米管复合镀层的制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07173636A (ja) * | 1993-12-16 | 1995-07-11 | Toyobo Co Ltd | 無電解メッキ繊維の製造方法 |
| SE523309E (sv) | 2001-06-15 | 2010-03-02 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
| US7491428B2 (en) * | 2002-12-04 | 2009-02-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Controlled deposition and alignment of carbon nanotubes |
| US7651766B2 (en) * | 2005-05-20 | 2010-01-26 | University Of Central Florida Research Foundation, Inc. | Carbon nanotube reinforced metal composites |
| WO2007058605A1 (en) | 2005-11-18 | 2007-05-24 | Replisaurus Technologies Ab | Master electrode and method of forming it |
| WO2008049108A1 (en) * | 2006-10-19 | 2008-04-24 | Northwestern University | Surface-independent, surface-modifying, multifunctional coatings and applications thereof |
| US20100038251A1 (en) * | 2008-08-14 | 2010-02-18 | Snu R&Db Foundation | Carbon nanotube network-based nano-composites |
| CN104080956A (zh) * | 2011-12-02 | 2014-10-01 | 阿尔塔纳股份公司 | 在非导电衬底上制造的导电结构及其制造方法 |
| CN103435027B (zh) * | 2013-08-21 | 2015-01-21 | 浙江大学 | 一种碳纳米管复合薄膜的制备方法及其制备的碳纳米管复合薄膜 |
| KR101610890B1 (ko) * | 2014-08-18 | 2016-04-11 | 한국과학기술연구원 | 탄소나노튜브 복합체 및 그 제조 방법 |
| CN104498935B (zh) * | 2014-12-09 | 2017-02-22 | 浙江大学 | 碳纳米管复合涂层的制备方法 |
| LU92779B1 (en) * | 2015-07-16 | 2017-01-31 | Luxembourg Inst Of Science And Tech (List) | Electrocatalytically active nanocomposite material and a production method therefor |
| FR3051002B1 (fr) * | 2016-05-03 | 2021-01-22 | Nawatechnologies | Materiau composite a base de nanotubes de carbone verticalement alignes et d'une matrice metallique |
| DE102016222943B3 (de) * | 2016-11-21 | 2017-12-28 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Metallisierte Oberflächen und Verfahren zu ihrer Herstellung |
| KR101801859B1 (ko) * | 2017-01-06 | 2017-11-27 | 부산대학교 산학협력단 | 전도성 고분자를 이용한 금속 구조물 및 그 제조 방법 |
| CN107126845B (zh) * | 2017-05-23 | 2019-09-10 | 厦门理工学院 | 一种含改性碳纳米管的复合纳滤膜及其制备方法 |
| CN107331872B (zh) * | 2017-07-02 | 2019-07-02 | 湖南科技大学 | 一种基于石墨烯/碳纳米管的二氧化锰/银复合纳米材料的制备方法及其应用 |
| CN107394218B (zh) * | 2017-07-29 | 2019-07-30 | 湖南科技大学 | 一种钴掺杂双层碳氮复合物纳米材料、制备方法及其应用 |
-
2018
- 2018-08-27 LU LU100919A patent/LU100919B1/en active IP Right Grant
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- 2019-08-22 WO PCT/EP2019/072454 patent/WO2020043590A1/en not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105552A (ja) | 2001-09-28 | 2003-04-09 | Seiren Co Ltd | 無電解メッキの前処理方法及びそれを用いてなる導電性材料 |
| JP2004315297A (ja) | 2003-04-17 | 2004-11-11 | Misuzu Kogyo:Kk | ナノカーボンコンポジット材及びその製造方法 |
| JP2005277096A (ja) | 2004-03-24 | 2005-10-06 | Japan Science & Technology Agency | カーボンナノチューブ含有金属膜を用いてなる半導体配線とその製造方法、およびカーボンナノチューブ含有金属膜の製造方法 |
| WO2012091139A1 (ja) | 2010-12-28 | 2012-07-05 | 独立行政法人産業技術総合研究所 | Ｃｎｔ金属複合材及びその製造方法 |
| JP2017101301A (ja) | 2015-12-03 | 2017-06-08 | トヨタ自動車株式会社 | 銅皮膜の成膜方法 |
| CN107093748A (zh) | 2017-04-12 | 2017-08-25 | 苏州大学 | 一种钴和氮共掺杂碳纳米管催化剂、制备方法及应用 |
| CN107604419A (zh) | 2017-07-24 | 2018-01-19 | 南昌大学 | 一种基于聚多巴胺表面改性的镍基碳纳米管复合镀层的制备方法 |
| CN107252695A (zh) | 2017-07-26 | 2017-10-17 | 广东医科大学 | 钯基多巴胺包裹磁性碳纳米管催化剂及其制备方法及应用 |
Non-Patent Citations (1)
| Title |
|---|
| XU et al.，Thin Solid Films，2016年，Vol.600，p.76-82 |
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| SG11202100001RA (en) | 2021-01-28 |
| JP2021535055A (ja) | 2021-12-16 |
| EP3844325B1 (en) | 2024-04-24 |
| KR20210045419A (ko) | 2021-04-26 |
| EP3844325C0 (en) | 2024-04-24 |
| CN112513338B (zh) | 2024-05-07 |
| US20220363542A1 (en) | 2022-11-17 |
| EP3844325A1 (en) | 2021-07-07 |
| KR102614253B1 (ko) | 2023-12-15 |
| LU100919B1 (en) | 2020-02-27 |
| CN112513338A (zh) | 2021-03-16 |
| WO2020043590A1 (en) | 2020-03-05 |
| US11873570B2 (en) | 2024-01-16 |
| CA3106511A1 (en) | 2020-03-05 |
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