JP7396899B2 - パルスレーザ光を用いた基板の加工、特に分離のための方法 - Google Patents

パルスレーザ光を用いた基板の加工、特に分離のための方法 Download PDF

Info

Publication number
JP7396899B2
JP7396899B2 JP2019558349A JP2019558349A JP7396899B2 JP 7396899 B2 JP7396899 B2 JP 7396899B2 JP 2019558349 A JP2019558349 A JP 2019558349A JP 2019558349 A JP2019558349 A JP 2019558349A JP 7396899 B2 JP7396899 B2 JP 7396899B2
Authority
JP
Japan
Prior art keywords
etching
substrate
product
initial thickness
period
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019558349A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020517570A5 (enExample
JP2020517570A (ja
Inventor
オストホルト・ローマン
アンブロジウス・ノルベルト
ドゥンカー・ダーニエール
シュノール・アルネ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics SE
Original Assignee
LPKF Laser and Electronics SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics SE filed Critical LPKF Laser and Electronics SE
Publication of JP2020517570A publication Critical patent/JP2020517570A/ja
Publication of JP2020517570A5 publication Critical patent/JP2020517570A5/ja
Priority to JP2022084208A priority Critical patent/JP7538175B2/ja
Application granted granted Critical
Publication of JP7396899B2 publication Critical patent/JP7396899B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2019558349A 2017-05-15 2018-04-06 パルスレーザ光を用いた基板の加工、特に分離のための方法 Active JP7396899B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022084208A JP7538175B2 (ja) 2017-05-15 2022-05-24 パルスレーザ光を用いた基板の加工、特に分離のための方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017110542.5 2017-05-15
DE102017110542 2017-05-15
PCT/EP2018/058882 WO2018210484A1 (de) 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022084208A Division JP7538175B2 (ja) 2017-05-15 2022-05-24 パルスレーザ光を用いた基板の加工、特に分離のための方法

Publications (3)

Publication Number Publication Date
JP2020517570A JP2020517570A (ja) 2020-06-18
JP2020517570A5 JP2020517570A5 (enExample) 2021-04-22
JP7396899B2 true JP7396899B2 (ja) 2023-12-12

Family

ID=61972103

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019558349A Active JP7396899B2 (ja) 2017-05-15 2018-04-06 パルスレーザ光を用いた基板の加工、特に分離のための方法
JP2022084208A Active JP7538175B2 (ja) 2017-05-15 2022-05-24 パルスレーザ光を用いた基板の加工、特に分離のための方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022084208A Active JP7538175B2 (ja) 2017-05-15 2022-05-24 パルスレーザ光を用いた基板の加工、特に分離のための方法

Country Status (6)

Country Link
US (1) US11065716B2 (enExample)
EP (1) EP3624982A1 (enExample)
JP (2) JP7396899B2 (enExample)
KR (1) KR102260931B1 (enExample)
CN (1) CN110545948B (enExample)
WO (1) WO2018210484A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс
DE102020114195A1 (de) * 2020-05-27 2021-12-02 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zum Einbringen einer Ausnehmung in ein Substrat
EP4169068A4 (en) 2021-08-30 2024-07-31 Absolics Inc. Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011037707A (ja) 2006-02-22 2011-02-24 Nippon Sheet Glass Co Ltd レーザを用いたガラスの加工方法および加工装置
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
WO2017038075A1 (ja) 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185270A (ja) * 1992-01-16 1993-07-27 Kosaka Kenkyusho:Kk ガラスパネルの割断方法
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
US6709881B2 (en) * 2000-11-28 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor and method for manufacturing semiconductor device
GB0315947D0 (en) * 2003-07-08 2003-08-13 Spectrum Technologies Plc Laser removal of layer or coating from a substrate
US8703517B2 (en) * 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
PL2764376T3 (pl) * 2011-09-27 2017-03-31 Chipworks, Incorporated Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawienia
JP6062287B2 (ja) * 2013-03-01 2017-01-18 株式会社ディスコ ウエーハの加工方法
JP6186016B2 (ja) * 2013-04-04 2017-08-23 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 基板に貫通穴を開ける方法及び装置
CN103264227B (zh) * 2013-04-11 2015-05-13 温州大学 一种激光直接刻蚀聚合物基体表面覆盖金属膜的方法
CN103252262A (zh) * 2013-04-15 2013-08-21 中国人民解放军军事医学科学院卫生学环境医学研究所 一种聚甲基丙烯酸甲酯材料微流控芯片加工技术方法
JP2016534008A (ja) * 2013-08-07 2016-11-04 トルンプフ レーザー− ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツングＴＲＵＭＰＦ Ｌａｓｅｒ− ｕｎｄ Ｓｙｓｔｅｍｔｅｃｈｎｉｋ ＧｍｂＨ 透明の、ガラス状の、ガラス質の、セラミックのかつ／又は結晶質の層を有する板状のワークピースを加工する方法、並びにこのようなワークピース用の分離装置、並びにこのようなワークピースから成る製品
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150243559A1 (en) * 2014-02-27 2015-08-27 Jungrae Park Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etch
JP6383977B2 (ja) * 2014-06-27 2018-09-05 Ａｇｃ株式会社 ガラス基板の切断方法
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
TW201831414A (zh) * 2016-12-13 2018-09-01 美商康寧公司 藉由形成劃痕線來雷射處理透明工件的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011037707A (ja) 2006-02-22 2011-02-24 Nippon Sheet Glass Co Ltd レーザを用いたガラスの加工方法および加工装置
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
WO2017038075A1 (ja) 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法

Also Published As

Publication number Publication date
JP2020517570A (ja) 2020-06-18
CN110545948B (zh) 2022-02-25
KR20190132461A (ko) 2019-11-27
US11065716B2 (en) 2021-07-20
JP7538175B2 (ja) 2024-08-21
EP3624982A1 (de) 2020-03-25
JP2022116133A (ja) 2022-08-09
US20200180068A1 (en) 2020-06-11
WO2018210484A1 (de) 2018-11-22
KR102260931B1 (ko) 2021-06-04
CN110545948A (zh) 2019-12-06

Similar Documents

Publication Publication Date Title
KR102356415B1 (ko) 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
JP7538175B2 (ja) パルスレーザ光を用いた基板の加工、特に分離のための方法
JP6899653B2 (ja) レーザー処理及び温度誘導ストレスを用いた複合ウェハー製造方法
JP6782692B2 (ja) 板状の加工物に少なくとも一つの窪み又は穴を配設する方法
DE102012010635B4 (de) Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
EP2282969B1 (de) Verfahren zur herstellung von vereinzelten, auf einem siliziumsubstrat angeordneten mikromechanischen bauteilen und hieraus hergestellte bauteile
JP2017534458A5 (enExample)
EP1494271A4 (en) PROCESS FOR DISCONNECTING A SUBSTRATE
SG10201709401QA (en) SiC WAFER PRODUCING METHOD
US20220184744A1 (en) Method for machining a workpiece
US20230192535A1 (en) Method for introducing a recess into a substrate
JP2020517570A5 (enExample)
JP2018207109A5 (enExample)
CN112105984B (zh) 液晶面板制造方法
US20180085857A1 (en) Hybrid substrate processing
US11505495B2 (en) Method for microstructuring a glass substrate by means of laser radiation
WO1999034421A1 (de) Verfahren zur herstellung einer porösen schicht mit hilfe eines elektrochemischen ätzprozesses
JP2006332637A5 (enExample)
JP2018157469A (ja) 圧電振動子の周波数調整方法
KR101777772B1 (ko) 금속 마스터 몰드 제조방법 및 그 제조방법에 의해 제조된 마스터 몰드
WO2018193971A1 (ja) 加工対象物切断方法
JP2006018097A (ja) 微細格子作製方法
DE102015004347A1 (de) Erzeugung von physischen Modifikationen mittels LASER im Inneren eines Festkörpers
JP2023062415A (ja) 光学用具の製造方法
JP2005257867A (ja) 三次元形状面への微細格子作製方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191025

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20200707

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201014

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201015

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210112

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20210308

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210707

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220126

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20220524

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20220907

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20221207

C13 Notice of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: C13

Effective date: 20230201

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230327

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20230405

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230529

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230720

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231130

R150 Certificate of patent or registration of utility model

Ref document number: 7396899

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150