EP3624982A1 - Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen - Google Patents

Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Info

Publication number
EP3624982A1
EP3624982A1 EP18717553.4A EP18717553A EP3624982A1 EP 3624982 A1 EP3624982 A1 EP 3624982A1 EP 18717553 A EP18717553 A EP 18717553A EP 3624982 A1 EP3624982 A1 EP 3624982A1
Authority
EP
European Patent Office
Prior art keywords
substrate
etching
laser
ratio
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18717553.4A
Other languages
German (de)
English (en)
French (fr)
Inventor
Roman Ostholt
Norbert AMBROSIUS
Daniel DUNKER
Arne Schnoor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics SE
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of EP3624982A1 publication Critical patent/EP3624982A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Definitions

  • the invention relates to a method for processing, in particular for separating a particular planar substrate by means of laser-induced depth etching, wherein pulsed laser radiation is directed with a spatial laser pulse distance to the substrate and subsequently an anisotropic material removal by etching with an etch rate and an etching time is performed
  • LIDE Laser Induced Deep Etching
  • a transparent material is conveyed over an elongated region along the beam axis, often across the entire thickness, by means of a laser pulse or pulse train
  • the transparent material e.g. in glass plates, modified so that the modification is anisotropically etched in a subsequent wet-chemical etching bath. If the laser pulses are emitted onto the material at a suitable spatial distance along a contour, the material is separated along the contour during the anisotropic removal of material.
  • the laser energy input serves to excite or trigger a reaction and a modification by conversion, the effect of which leads or is used only in the subsequent process step to the desired material separation.
  • a subsequent anisotropic Materialabtrages done by an etching process no sequential, but a two-dimensional erosion process is used for the separation process, which only makes very low demands on the process. In particular, can be about the
  • the separation surface is formed, the interface is not flat. Rather, a corrugation or a perforation, similar to a connected perforation.
  • This basically unwanted uneven parting surface can be defined by the
  • the two fundamental objectives of a rapid processing progress by large laser pulse intervals on the one hand and a smooth as possible, a planar course approximated course of the cut surface on the other hand contrary.
  • the invention has for its object to provide a way to meet these two objectives in an optimal manner or to agree. This object is achieved by a method according to the features of claim 1.
  • the further embodiment of the invention can be found in the dependent claims.
  • machining parameters are determined according to the following rule:
  • the roughness of the surface as a function of the pulse spacing typically has a local minimum of approximately 1 ⁇ to 3 ⁇ .
  • Minimums depends on the substrate material, the etching chemistry used and other process parameters.
  • an anisotropic material removal in the etching bath is made possible at the locations which have been modified by the laser radiation.
  • structures with large aspect ratios can be produced with the condition
  • the removal of material by the wet-chemical etching described by the product of etch rate R and etching time t, compared to the thickness D of the substrate is low.
  • the substrate material used is preferably glass which is transparent to the wavelength used for the laser-induced deep etching. Particularly high aspect ratios and low roughness can be achieved with quartz glass.
  • the invention allows for various embodiments. To further clarify its basic principle, one of them is shown in the drawing and will be described below. This shows in each case in a schematic representation in
  • Fig. 3 is an illustration of a surface profile of a cut surface in a
  • Fig. 4 shows the ratio of the laser pulse distance (d) and the roughness R a at different material abrasions.
  • Figure 1 shows schematically how different ripples or roughnesses of
  • Pulse distance d and the greater the etching time t is selected.
  • FIG. 4 shows the dependence of the roughness R a (roughness) on the laser pulse distance d (pitch) for different material removal (etch removal).
  • a laser pulse distance d of about 2 to 3 ⁇ a local minimum roughness R a of about 0.05 to 0.08 ⁇ is achieved. This is only slightly influenced by material removal, the product of etch rate and etching time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP18717553.4A 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen Pending EP3624982A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017110542 2017-05-15
PCT/EP2018/058882 WO2018210484A1 (de) 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Publications (1)

Publication Number Publication Date
EP3624982A1 true EP3624982A1 (de) 2020-03-25

Family

ID=61972103

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18717553.4A Pending EP3624982A1 (de) 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Country Status (6)

Country Link
US (1) US11065716B2 (enExample)
EP (1) EP3624982A1 (enExample)
JP (2) JP7396899B2 (enExample)
KR (1) KR102260931B1 (enExample)
CN (1) CN110545948B (enExample)
WO (1) WO2018210484A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020114195A1 (de) * 2020-05-27 2021-12-02 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zum Einbringen einer Ausnehmung in ein Substrat
EP4169068A4 (en) 2021-08-30 2024-07-31 Absolics Inc. Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140248757A1 (en) * 2013-03-01 2014-09-04 Disco Corporation Wafer processing method
WO2015018425A1 (de) * 2013-08-07 2015-02-12 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
WO2016010949A1 (en) * 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185270A (ja) * 1992-01-16 1993-07-27 Kosaka Kenkyusho:Kk ガラスパネルの割断方法
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
US6709881B2 (en) * 2000-11-28 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor and method for manufacturing semiconductor device
GB0315947D0 (en) * 2003-07-08 2003-08-13 Spectrum Technologies Plc Laser removal of layer or coating from a substrate
JP4672689B2 (ja) 2006-02-22 2011-04-20 日本板硝子株式会社 レーザを用いたガラスの加工方法および加工装置
US8703517B2 (en) * 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
PL2764376T3 (pl) * 2011-09-27 2017-03-31 Chipworks, Incorporated Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawienia
JP6186016B2 (ja) * 2013-04-04 2017-08-23 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 基板に貫通穴を開ける方法及び装置
CN103264227B (zh) * 2013-04-11 2015-05-13 温州大学 一种激光直接刻蚀聚合物基体表面覆盖金属膜的方法
CN103252262A (zh) * 2013-04-15 2013-08-21 中国人民解放军军事医学科学院卫生学环境医学研究所 一种聚甲基丙烯酸甲酯材料微流控芯片加工技术方法
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150243559A1 (en) * 2014-02-27 2015-08-27 Jungrae Park Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etch
JP6383977B2 (ja) * 2014-06-27 2018-09-05 Ａｇｃ株式会社 ガラス基板の切断方法
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
TW201831414A (zh) * 2016-12-13 2018-09-01 美商康寧公司 藉由形成劃痕線來雷射處理透明工件的方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140248757A1 (en) * 2013-03-01 2014-09-04 Disco Corporation Wafer processing method
WO2015018425A1 (de) * 2013-08-07 2015-02-12 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
WO2016010949A1 (en) * 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018210484A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс

Also Published As

Publication number Publication date
JP7396899B2 (ja) 2023-12-12
JP2020517570A (ja) 2020-06-18
CN110545948B (zh) 2022-02-25
KR20190132461A (ko) 2019-11-27
US11065716B2 (en) 2021-07-20
JP7538175B2 (ja) 2024-08-21
JP2022116133A (ja) 2022-08-09
US20200180068A1 (en) 2020-06-11
WO2018210484A1 (de) 2018-11-22
KR102260931B1 (ko) 2021-06-04
CN110545948A (zh) 2019-12-06

Similar Documents

Publication Publication Date Title
WO2018162385A1 (de) Verfahren zum einbringen zumindest einer ausnehmung in ein material mittels elektromagnetischer strahlung und anschliessendem ätzprozess
EP3195706B2 (de) Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück
DE102014113339A1 (de) Verfahren zur Erzeugung von Ausnehmungen in einem Material
WO2018210484A1 (de) Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen
DE10219388A1 (de) Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat
WO2015018425A1 (de) Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
EP2848823A1 (de) Strukturbauteil mit einer Ribletoberfläche
EP3528982B1 (de) Verfahren zur werkzeuglosen entfernung von stützstrukturen bei der generativen fertigung von bauteilen
EP4157580A1 (de) Verfahren zum einbringen einer ausnehmung in ein substrat
EP2682219A1 (de) Verfahren zur Werkstückbearbeitung
EP3093123A1 (de) Verfahren zum herstellen einer dreidimensionalen struktur
DE102010027438B4 (de) Verfahren zur Herstellung einer Verbindungsstelle und/oder eines Verbindungsbereiches bei einem Substrat, insbesondere zur Verbesserung der Benetzungs- und/oder Haftungseigenschaften des Substrates
WO2009036744A1 (de) Schneidrädchen
EP3386661A1 (de) Vorrichtung und verfahren zur herstellung eines dreidimensionalen metallischen formkörpers
EP3966157B1 (de) Verfahren zur herstellung von mikrostrukturen in einem glassubstrat
JP2020517570A5 (enExample)
EP3175941B1 (de) Verfahren und vorrichtung zum additiven herstellen zumindest eines bauteilbereichs eines bauteils
DE102021100144A1 (de) Verfahren zur Bearbeitung eines Glases
EP2561987B1 (de) Verfahren zum Gravieren einer Druckplatte
EP2626895B1 (de) Verfahren und Vorrichtung zum parallelen Trennen eines Werkstücks in mehere Teilstücke
EP2484478B1 (de) Verfahren zum Einbringen einer Durchbrechung in ein Substrat
DE4033233C2 (enExample)
WO2013056707A1 (de) Verfahren zur erzeugung von messer- oder laserschwächungen von lederhäutung
WO2018158127A1 (de) Verfahren zur herstellung eines stanzbleches
EP3239362B1 (de) Verfahren zur erzeugung lichtbeugender strukturen auf einem laminierwerkzeug

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20191216

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIN1 Information on inventor provided before grant (corrected)

Inventor name: OSTHOLT, ROMAN

Inventor name: AMBROSIUS, NORBERT

Inventor name: DUNKER, DANIEL

Inventor name: SCHNOOR, ARNE

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20201218

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LPKF LASER & ELECTRONICS SE