KR102260931B1 - 레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법 - Google Patents

레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법 Download PDF

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KR102260931B1
KR102260931B1 KR1020197031695A KR20197031695A KR102260931B1 KR 102260931 B1 KR102260931 B1 KR 102260931B1 KR 1020197031695 A KR1020197031695 A KR 1020197031695A KR 20197031695 A KR20197031695 A KR 20197031695A KR 102260931 B1 KR102260931 B1 KR 102260931B1
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South Korea
Prior art keywords
etching
substrate
processing
deep reactive
laser
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KR20190132461A (ko
Inventor
로만 오슈트홀트
노르베르트 암브로지우스
다니엘 둔커
아르네 슈노어
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엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020197031695A 2017-05-15 2018-04-06 레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법 Active KR102260931B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017110542.5 2017-05-15
DE102017110542 2017-05-15
PCT/EP2018/058882 WO2018210484A1 (de) 2017-05-15 2018-04-06 Verfahren zur bearbeitung, insbesondere zum trennen eines substrates mittels laserinduziertem tiefenätzen

Publications (2)

Publication Number Publication Date
KR20190132461A KR20190132461A (ko) 2019-11-27
KR102260931B1 true KR102260931B1 (ko) 2021-06-04

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KR1020197031695A Active KR102260931B1 (ko) 2017-05-15 2018-04-06 레이저 유도 디프 반응성 에칭을 이용해 기판을 가공하기 위한, 특히 분리하기 위한 방법

Country Status (6)

Country Link
US (1) US11065716B2 (enExample)
EP (1) EP3624982A1 (enExample)
JP (2) JP7396899B2 (enExample)
KR (1) KR102260931B1 (enExample)
CN (1) CN110545948B (enExample)
WO (1) WO2018210484A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2756175C1 (ru) * 2020-03-30 2021-09-28 Акционерное Общество "Государственный Научный Центр Российской Федерации Троицкий Институт Инновационных И Термоядерных Исследований" Роботизированный лазерный комплекс и способ демонтажа металлоконструкций аэс
DE102020114195A1 (de) * 2020-05-27 2021-12-02 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zum Einbringen einer Ausnehmung in ein Substrat
EP4169068A4 (en) 2021-08-30 2024-07-31 Absolics Inc. Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185270A (ja) * 1992-01-16 1993-07-27 Kosaka Kenkyusho:Kk ガラスパネルの割断方法
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
US6709881B2 (en) * 2000-11-28 2004-03-23 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor and method for manufacturing semiconductor device
GB0315947D0 (en) * 2003-07-08 2003-08-13 Spectrum Technologies Plc Laser removal of layer or coating from a substrate
JP4672689B2 (ja) 2006-02-22 2011-04-20 日本板硝子株式会社 レーザを用いたガラスの加工方法および加工装置
US8703517B2 (en) * 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
PL2764376T3 (pl) * 2011-09-27 2017-03-31 Chipworks, Incorporated Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawienia
JP6062287B2 (ja) * 2013-03-01 2017-01-18 株式会社ディスコ ウエーハの加工方法
JP6186016B2 (ja) * 2013-04-04 2017-08-23 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 基板に貫通穴を開ける方法及び装置
CN103264227B (zh) * 2013-04-11 2015-05-13 温州大学 一种激光直接刻蚀聚合物基体表面覆盖金属膜的方法
CN103252262A (zh) * 2013-04-15 2013-08-21 中国人民解放军军事医学科学院卫生学环境医学研究所 一种聚甲基丙烯酸甲酯材料微流控芯片加工技术方法
JP2016534008A (ja) * 2013-08-07 2016-11-04 トルンプフ レーザー− ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツングＴＲＵＭＰＦ Ｌａｓｅｒ− ｕｎｄ Ｓｙｓｔｅｍｔｅｃｈｎｉｋ ＧｍｂＨ 透明の、ガラス状の、ガラス質の、セラミックのかつ／又は結晶質の層を有する板状のワークピースを加工する方法、並びにこのようなワークピース用の分離装置、並びにこのようなワークピースから成る製品
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150243559A1 (en) * 2014-02-27 2015-08-27 Jungrae Park Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etch
JP6383977B2 (ja) * 2014-06-27 2018-09-05 Ａｇｃ株式会社 ガラス基板の切断方法
US10082333B2 (en) 2014-07-02 2018-09-25 Praxair Technology, Inc. Argon condensation system and method
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
EP3169635B2 (en) 2014-07-14 2025-11-12 4JET microtech GmbH Method and system for forming perforations
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法
TW201831414A (zh) * 2016-12-13 2018-09-01 美商康寧公司 藉由形成劃痕線來雷射處理透明工件的方法

Also Published As

Publication number Publication date
JP7396899B2 (ja) 2023-12-12
JP2020517570A (ja) 2020-06-18
CN110545948B (zh) 2022-02-25
KR20190132461A (ko) 2019-11-27
US11065716B2 (en) 2021-07-20
JP7538175B2 (ja) 2024-08-21
EP3624982A1 (de) 2020-03-25
JP2022116133A (ja) 2022-08-09
US20200180068A1 (en) 2020-06-11
WO2018210484A1 (de) 2018-11-22
CN110545948A (zh) 2019-12-06

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