PL2764376T3 - Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawienia - Google Patents
Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawieniaInfo
- Publication number
- PL2764376T3 PL2764376T3 PL11873517T PL11873517T PL2764376T3 PL 2764376 T3 PL2764376 T3 PL 2764376T3 PL 11873517 T PL11873517 T PL 11873517T PL 11873517 T PL11873517 T PL 11873517T PL 2764376 T3 PL2764376 T3 PL 2764376T3
- Authority
- PL
- Poland
- Prior art keywords
- channel
- differentiate
- devices based
- different etching
- etching rates
- Prior art date
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
- G01R31/307—Contactless testing using electron beams of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11873517.4A EP2764376B1 (en) | 2011-09-27 | 2011-09-27 | A method to differentiate p-channel or n-channel devices based on different etching rates. |
| PCT/IB2011/054245 WO2013045973A1 (en) | 2011-09-27 | 2011-09-27 | A method to differential p-channel or n-channel devices based on different etching rates. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2764376T3 true PL2764376T3 (pl) | 2017-03-31 |
Family
ID=47994345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11873517T PL2764376T3 (pl) | 2011-09-27 | 2011-09-27 | Sposób rozróżniania pomiędzy urządzeniami z kanałem typu P i kanałem typu N oparty na różnym stopniu wytrawienia |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2764376B1 (pl) |
| JP (1) | JP5977830B2 (pl) |
| KR (1) | KR20140082993A (pl) |
| CN (1) | CN104105976B (pl) |
| CA (1) | CA2849729A1 (pl) |
| PL (1) | PL2764376T3 (pl) |
| WO (1) | WO2013045973A1 (pl) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7396899B2 (ja) * | 2017-05-15 | 2023-12-12 | エル・ピー・ケー・エフ・レーザー・アンド・エレクトロニクス・ソシエタス・ヨーロピア | パルスレーザ光を用いた基板の加工、特に分離のための方法 |
| JP2020131141A (ja) * | 2019-02-21 | 2020-08-31 | 紀州技研工業株式会社 | 描画方法および描画装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4623255A (en) * | 1983-10-13 | 1986-11-18 | The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration | Method of examining microcircuit patterns |
| JP2953020B2 (ja) * | 1990-10-05 | 1999-09-27 | 日本電気株式会社 | 半導体装置の製造方法 |
| JPH11135785A (ja) * | 1997-10-31 | 1999-05-21 | Sony Corp | 半導体装置の製造方法 |
| JP2000260768A (ja) * | 1999-03-05 | 2000-09-22 | Nec Corp | 半導体装置の製造方法 |
| US7294935B2 (en) * | 2001-01-24 | 2007-11-13 | Hrl Laboratories, Llc | Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide |
| US6872581B2 (en) * | 2001-04-16 | 2005-03-29 | Nptest, Inc. | Measuring back-side voltage of an integrated circuit |
| JP4302971B2 (ja) * | 2002-12-17 | 2009-07-29 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2005045006A (ja) * | 2003-07-22 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US7015146B2 (en) * | 2004-01-06 | 2006-03-21 | International Business Machines Corporation | Method of processing backside unlayering of MOSFET devices for electrical and physical characterization including a collimated ion plasma |
| CA2521675C (en) * | 2005-09-29 | 2009-11-24 | Chipworks Inc | Method of preparing an integrated circuit die for imaging |
| US20070200179A1 (en) * | 2006-02-24 | 2007-08-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Strain enhanced CMOS architecture with amorphous carbon film and fabrication method of forming the same |
| US7745236B2 (en) * | 2006-12-21 | 2010-06-29 | Spansion Llc | Floating gate process methodology |
| US7655984B2 (en) * | 2007-06-12 | 2010-02-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device with discontinuous CESL structure |
-
2011
- 2011-09-27 PL PL11873517T patent/PL2764376T3/pl unknown
- 2011-09-27 KR KR20147011513A patent/KR20140082993A/ko not_active Withdrawn
- 2011-09-27 JP JP2014531322A patent/JP5977830B2/ja not_active Expired - Fee Related
- 2011-09-27 WO PCT/IB2011/054245 patent/WO2013045973A1/en not_active Ceased
- 2011-09-27 CN CN201180075089.2A patent/CN104105976B/zh not_active Expired - Fee Related
- 2011-09-27 CA CA2849729A patent/CA2849729A1/en not_active Abandoned
- 2011-09-27 EP EP11873517.4A patent/EP2764376B1/en not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105976B (zh) | 2016-09-21 |
| EP2764376A4 (en) | 2015-06-17 |
| EP2764376A1 (en) | 2014-08-13 |
| KR20140082993A (ko) | 2014-07-03 |
| JP2014531763A (ja) | 2014-11-27 |
| JP5977830B2 (ja) | 2016-08-24 |
| CA2849729A1 (en) | 2013-04-04 |
| CN104105976A (zh) | 2014-10-15 |
| EP2764376B1 (en) | 2016-11-16 |
| WO2013045973A1 (en) | 2013-04-04 |
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