JP7394887B2 - 薄膜トランジスタを形成する方法 - Google Patents
薄膜トランジスタを形成する方法 Download PDFInfo
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- JP7394887B2 JP7394887B2 JP2021574256A JP2021574256A JP7394887B2 JP 7394887 B2 JP7394887 B2 JP 7394887B2 JP 2021574256 A JP2021574256 A JP 2021574256A JP 2021574256 A JP2021574256 A JP 2021574256A JP 7394887 B2 JP7394887 B2 JP 7394887B2
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- 239000010409 thin film Substances 0.000 title claims description 15
- 239000010410 layer Substances 0.000 claims description 468
- 229910044991 metal oxide Inorganic materials 0.000 claims description 134
- 150000004706 metal oxides Chemical class 0.000 claims description 134
- 238000000034 method Methods 0.000 claims description 124
- 239000000758 substrate Substances 0.000 claims description 82
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- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 30
- 229920005591 polysilicon Polymers 0.000 claims description 30
- 238000009616 inductively coupled plasma Methods 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 238000005229 chemical vapour deposition Methods 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 14
- 238000002161 passivation Methods 0.000 claims description 13
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 11
- 229910007541 Zn O Inorganic materials 0.000 claims description 9
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- 239000011651 chromium Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
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- 229910052786 argon Inorganic materials 0.000 claims description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 15
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- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
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- 229910004205 SiNX Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
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- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
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- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
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- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1251—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Analytical Chemistry (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
Description
Claims (20)
- 薄膜トランジスタを形成する方法であって、
チャンバ内の基板の第1の部分の上に金属酸化物層を形成することと、
前記金属酸化物層の上にゲート絶縁体(GI)層を堆積させることであって、誘導結合プラズマ(ICP)を用いた高密度プラズマ化学気相堆積(HDP-CVD)プロセスでシリコン含有層を堆積させることを含み、前記HDP-CVDプロセスは、
2.3W/cm2から5.3W/cm2のICP電力密度と、
2MHzから13.56MHzのICP周波数と、
75mTorrから150mTorrのチャンバ圧力と
を有する、前記金属酸化物層の上にゲート絶縁体(GI)層を堆積させることと、
前記GI層の上にゲート電極を形成することと、
前記GI層の1又は複数の残留部分をエッチングすることと
を含む方法。 - 前記GI層を堆積させる前に、前記金属酸化物層を前処理することであって、前記金属酸化物層を前処理ICPに曝露することを含む、前記GI層を堆積させる前に、前記金属酸化物層を前処理すること
を更に含む、請求項1に記載の方法。 - 前記前処理ICPが、亜酸化窒素(N2O)、アルゴン(Ar)、又はそれらの組み合わせから形成される、請求項2に記載の方法。
- 前記GI層の上にバルクGI層を堆積させることであって、容量結合プラズマ(CCP)を用いた化学気相堆積(CVD)プロセスを含む、前記GI層の上にバルクGI層を堆積させること
を更に含む、請求項1に記載の方法。 - 前記GI層を堆積させる前に、前記金属酸化物層の上にシード層を堆積させることであって、CCPを用いたCVDプロセスを含み、前記シード層は100nm未満の厚さを有する、前記GI層を堆積させる前に、前記金属酸化物層の上にシード層を堆積させること
を更に含む、請求項1に記載の方法。 - 前記GI層を堆積させることは、前記基板を70℃から350℃の温度に加熱することを含む、請求項1に記載の方法。
- 前記ゲート電極の上に層間誘電体(ILD)層を形成することと、
前記ILD層に、ソース電極、ソース電極ビア、ドレイン電極、及びドレイン電極ビアを形成することと、
前記ソース電極、前記ドレイン電極、及び前記ILD層の上にパッシベーション層を形成することと
を更に含む、請求項1に記載の方法。 - 前記基板の第2の部分の上に、ポリシリコン層又は追加の金属酸化物層を形成すること
を更に含む、請求項1に記載の方法。 - 薄膜トランジスタデバイスを形成する方法であって、
基板の第1の部分の上に第1の金属酸化物層を形成することであって、前記基板の前記第1の部分は第1の薄膜トランジスタ(TFT)に対応する、基板の第1の部分の上に第1の金属酸化物層を形成することと、
前記基板の前記第1の部分の上の前記第1の金属酸化物層と接触させて前記第1のTFTの界面ゲート絶縁体(GI)層を堆積することと、
前記基板の第2の部分の上に下側層を形成することであって、前記基板の前記第2の部分は第2のTFTに対応し、前記下側層は前記第2のTFTの第2の金属酸化物層の底面に接触し、前記界面GI層及び前記下側層を形成することは、
前記第1の部分及び前記第2の部分の上に第1のシリコン含有層を堆積させることであって、前記第1のシリコン含有層は、誘導結合プラズマ(ICP)を用いた高密度プラズマ化学気相堆積(HDP-CVD)プロセスで堆積され、前記HDP-CVDプロセスは、
2.3W/cm 2 から5.3W/cm2のICP電力密度と、
2MHzから13.56MHzのICP周波数と
を有する、前記第1の部分及び前記第2の部分の上に第1のシリコン含有層を堆積させること
を含む、前記基板の前記第1の部分の上の前記第1の金属酸化物層と接触させて前記第1のTFTの界面ゲート絶縁体(GI)層を堆積させ、前記基板の第2の部分の上に下側層を形成することと、
前記底面を前記下側層と接触させて前記第2のTFTの前記第2の金属酸化物層を形成することと、
前記界面GI層に接触させて前記第1のTFTのバルクGI層を堆積させ、前記第2の金属酸化物層の上面に接触させて前記第2のTFTのGI層を形成することであって、前記バルクGI層及び前記GI層を形成することは、容量結合プラズマ(CCP)を用いた化学堆積プロセス(CVD)で前記第1の部分及び前記第2の部分の上に第2のシリコン含有層を堆積させることを含む、前記界面GI層に接触させて前記第1のTFTのバルクGI層を堆積させ、前記第2の金属酸化物層の上面に接触させて前記第2のTFTのGI層を形成することと、
前記第1の部分の上に前記第1のTFTの第1のゲート電極を形成し、前記第2の部分の上に前記第2のTFTの第2のゲート電極を形成することと、
前記第1のTFTの前記界面GI層、前記第1のTFTの前記バルクGI層、前記第2のTFTの前記GI層、及び前記第2のTFTの前記下側層を形成するために、前記第1の部分及び前記第2の部分から前記第2のシリコン含有層の1又は複数の残留部分を除去することと、
前記基板の上に層間誘電体(ILD)層を形成することと
を含む方法。 - 前記界面GI層を堆積させることと、前記下側層を形成することとは、同じ工程に含まれる、請求項9に記載の方法。
- 前記第1のゲート電極及び前記第2のゲート電極は、モリブデン(Mo)、クロム(Cr)、銅(Cu)、チタン(Ti)、タンタル(Ta)、タングステン(W)、又はそれらの合金を含む、請求項9に記載の方法。
- 前記バルクGI層は酸化ケイ素(SixOy)を含み、前記第1の金属酸化物層はIn-Ga-Zn-Oを含む、請求項9に記載の方法。
- 前記バルクGI層は、前記界面GI層よりも高い原子濃度のインジウム(In)原子を有する、請求項9に記載の方法。
- 薄膜トランジスタデバイスを形成する方法であって、
基板の第1の部分の上にポリシリコン層を形成することであって、前記基板の前記第1の部分はポリシリコン薄膜トランジスタ(TFT)に対応する、基板の第1の部分の上にポリシリコン層を形成することと、
前記基板の前記第1の部分の前記ポリシリコン層の上及び第2の部分の上に第1のゲート絶縁体(GI)層を堆積させることであって、前記基板の前記第2の部分は金属酸化物(MOx) TFTに対応する、前記基板の前記第1の部分の前記ポリシリコン層の上及び第2の部分の上に第1のゲート絶縁体(GI)層を堆積させることと、
前記ポリシリコン薄膜TFTの前記第1のGI層の上に第1のゲート電極を形成し、前記MOx TFTのシールド金属を形成することと、
前記第1のGI層、前記第1のゲート電極、及び前記シールド金属の上に第1の層間誘電体(ILD)層を形成することと、
前記基板の前記第2の部分の前記第1のILD層の上に前記MOx TFTの金属酸化物層を形成することと、
前記金属酸化物層に第2のGI層を形成することであって、誘導結合プラズマ(ICP)を用いた高密度プラズマ化学気相堆積(HDP-CVD)プロセスでシリコン含有層を堆積させることを含み、前記HDP-CVDプロセスは、
2.3W/cm2から5.3W/cm2のICP電力密度と、
2MHzから13.56MHzのICP周波数と
を有する、前記金属酸化物層に第2のGI層を形成することと、
前記第2のGI層の上に第2のゲート電極を形成することと、
前記第1のILD層、前記金属酸化物層、及び前記第2のゲート電極の上に第2のILD層を形成することと
を含む方法。 - 前記シールド金属は、モリブデン(Mo)、クロム(Cr)、銅(Cu)、チタン(Ti)、タンタル(Ta)、タングステン(W)、又はそれらの合金を含む、請求項14に記載の方法。
- 前記第1のILD層を形成することは、HDP-CVDプロセスを含む、請求項14に記載の方法。
- 前記第2のILD層の上にパッシベーション層を形成することを更に含む、請求項14に記載の方法。
- 前記第1のILD層の上に緩衝層を形成することを更に含む、請求項14に記載の方法。
- 前記MOx TFTは、30cm2/Vsを上回る移動度を有する、請求項14に記載の方法。
- 前記第1のGI層を堆積させることは、前記HDP-CVDプロセスを含む、請求項14に記載の方法。
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