JP7386738B2 - 基板搬送方法および基板処理装置 - Google Patents

基板搬送方法および基板処理装置 Download PDF

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Publication number
JP7386738B2
JP7386738B2 JP2020049569A JP2020049569A JP7386738B2 JP 7386738 B2 JP7386738 B2 JP 7386738B2 JP 2020049569 A JP2020049569 A JP 2020049569A JP 2020049569 A JP2020049569 A JP 2020049569A JP 7386738 B2 JP7386738 B2 JP 7386738B2
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Prior art keywords
pressure
opening
gas
substrate
processing
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JP2020049569A
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Japanese (ja)
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JP2021150514A (ja
Inventor
誠治 田中
僚 佐野
洋平 山田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2020049569A priority Critical patent/JP7386738B2/ja
Priority to TW110108059A priority patent/TW202201612A/zh
Priority to CN202110264462.4A priority patent/CN113496915A/zh
Priority to KR1020210032648A priority patent/KR102517603B1/ko
Publication of JP2021150514A publication Critical patent/JP2021150514A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2020049569A 2020-03-19 2020-03-19 基板搬送方法および基板処理装置 Active JP7386738B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020049569A JP7386738B2 (ja) 2020-03-19 2020-03-19 基板搬送方法および基板処理装置
TW110108059A TW202201612A (zh) 2020-03-19 2021-03-08 基板搬運方法及基板處理裝置
CN202110264462.4A CN113496915A (zh) 2020-03-19 2021-03-11 基片输送方法和基片处理装置
KR1020210032648A KR102517603B1 (ko) 2020-03-19 2021-03-12 기판 반송 방법 및 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020049569A JP7386738B2 (ja) 2020-03-19 2020-03-19 基板搬送方法および基板処理装置

Publications (2)

Publication Number Publication Date
JP2021150514A JP2021150514A (ja) 2021-09-27
JP7386738B2 true JP7386738B2 (ja) 2023-11-27

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JP2020049569A Active JP7386738B2 (ja) 2020-03-19 2020-03-19 基板搬送方法および基板処理装置

Country Status (4)

Country Link
JP (1) JP7386738B2 (zh)
KR (1) KR102517603B1 (zh)
CN (1) CN113496915A (zh)
TW (1) TW202201612A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240053041A (ko) 2021-09-15 2024-04-23 스미토모 덴키 고교 가부시키가이샤 초전도 선재

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232071A (ja) 1999-02-09 2000-08-22 Kokusai Electric Co Ltd 基板処理方法および基板処理装置
JP2000306974A (ja) 1999-04-20 2000-11-02 Ebara Corp 半導体処理装置
JP2005527120A (ja) 2002-05-21 2005-09-08 エーエスエム アメリカ インコーポレイテッド 半導体処理ツール内チャンバ間の相互汚染の減少
JP2007142284A (ja) 2005-11-21 2007-06-07 Hitachi Kokusai Electric Inc 基板処理装置
JP2016011719A (ja) 2014-06-30 2016-01-21 入江工研株式会社 ゲートバルブ
JP2017128796A (ja) 2016-01-15 2017-07-27 東京エレクトロン株式会社 真空処理装置及び真空処理装置の運転方法。
US20200058529A1 (en) 2018-08-15 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconuctor device manufacturing system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100271758B1 (ko) * 1997-06-25 2001-01-15 윤종용 반도체장치 제조설비 및 이의 구동방법
JP2004096089A (ja) * 2002-07-09 2004-03-25 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4816790B2 (ja) 2003-06-02 2011-11-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP4695936B2 (ja) * 2005-07-15 2011-06-08 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5028193B2 (ja) * 2007-09-05 2012-09-19 株式会社日立ハイテクノロジーズ 半導体製造装置における被処理体の搬送方法
JP2009062604A (ja) * 2007-09-10 2009-03-26 Tokyo Electron Ltd 真空処理システムおよび基板搬送方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232071A (ja) 1999-02-09 2000-08-22 Kokusai Electric Co Ltd 基板処理方法および基板処理装置
JP2000306974A (ja) 1999-04-20 2000-11-02 Ebara Corp 半導体処理装置
JP2005527120A (ja) 2002-05-21 2005-09-08 エーエスエム アメリカ インコーポレイテッド 半導体処理ツール内チャンバ間の相互汚染の減少
JP2007142284A (ja) 2005-11-21 2007-06-07 Hitachi Kokusai Electric Inc 基板処理装置
JP2016011719A (ja) 2014-06-30 2016-01-21 入江工研株式会社 ゲートバルブ
JP2017128796A (ja) 2016-01-15 2017-07-27 東京エレクトロン株式会社 真空処理装置及び真空処理装置の運転方法。
US20200058529A1 (en) 2018-08-15 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconuctor device manufacturing system

Also Published As

Publication number Publication date
KR102517603B1 (ko) 2023-04-03
TW202201612A (zh) 2022-01-01
CN113496915A (zh) 2021-10-12
KR20210117943A (ko) 2021-09-29
JP2021150514A (ja) 2021-09-27

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