JP7365528B2 - 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 - Google Patents

接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 Download PDF

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Publication number
JP7365528B2
JP7365528B2 JP2023506314A JP2023506314A JP7365528B2 JP 7365528 B2 JP7365528 B2 JP 7365528B2 JP 2023506314 A JP2023506314 A JP 2023506314A JP 2023506314 A JP2023506314 A JP 2023506314A JP 7365528 B2 JP7365528 B2 JP 7365528B2
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Japan
Prior art keywords
identification mark
conductor
dummy
circuit board
bonded substrate
Prior art date
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Active
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JP2023506314A
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English (en)
Japanese (ja)
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JPWO2023008200A5 (https=
JPWO2023008200A1 (https=
Inventor
晃正 湯浅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023008200A1 publication Critical patent/JPWO2023008200A1/ja
Publication of JPWO2023008200A5 publication Critical patent/JPWO2023008200A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023506314A 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 Active JP7365528B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021121333 2021-07-26
JP2021121333 2021-07-26
PCT/JP2022/027620 WO2023008200A1 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023008200A1 JPWO2023008200A1 (https=) 2023-02-02
JPWO2023008200A5 JPWO2023008200A5 (https=) 2023-07-05
JP7365528B2 true JP7365528B2 (ja) 2023-10-19

Family

ID=85086705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506314A Active JP7365528B2 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Country Status (4)

Country Link
EP (1) EP4369874A4 (https=)
JP (1) JP7365528B2 (https=)
CN (1) CN117694024A (https=)
WO (1) WO2023008200A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210028A (ja) 2004-01-26 2005-08-04 Kyocera Corp 多数個取り配線基板
JP2013247256A (ja) * 2012-05-28 2013-12-09 Hitachi Ltd 半導体装置およびその製造方法
BE1023850B1 (nl) * 2016-06-29 2017-08-14 C-Mac Electromag Bvba Verbeterde elektronische schakeling en substraat met identificatiepatroon voor afzonderlijke elektronische schakelingen en werkwijze voor het produceren daarvan
CN113490654A (zh) 2019-03-01 2021-10-08 电化株式会社 陶瓷生片、陶瓷基板、陶瓷生片的制造方法及陶瓷基板的制造方法
WO2021054317A1 (ja) * 2019-09-20 2021-03-25 デンカ株式会社 複合基板及びその製造方法、並びに、回路基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Also Published As

Publication number Publication date
CN117694024A (zh) 2024-03-12
WO2023008200A1 (ja) 2023-02-02
EP4369874A1 (en) 2024-05-15
EP4369874A4 (en) 2024-11-06
JPWO2023008200A1 (https=) 2023-02-02

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