CN117694024A - 接合基板、电路基板及其制造方法、以及单片基板及其制造方法 - Google Patents

接合基板、电路基板及其制造方法、以及单片基板及其制造方法 Download PDF

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Publication number
CN117694024A
CN117694024A CN202280051810.2A CN202280051810A CN117694024A CN 117694024 A CN117694024 A CN 117694024A CN 202280051810 A CN202280051810 A CN 202280051810A CN 117694024 A CN117694024 A CN 117694024A
Authority
CN
China
Prior art keywords
identification mark
conductor
substrate
conductor portion
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280051810.2A
Other languages
English (en)
Chinese (zh)
Inventor
汤浅晃正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN117694024A publication Critical patent/CN117694024A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN202280051810.2A 2021-07-26 2022-07-13 接合基板、电路基板及其制造方法、以及单片基板及其制造方法 Pending CN117694024A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021121333 2021-07-26
JP2021-121333 2021-07-26
PCT/JP2022/027620 WO2023008200A1 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Publications (1)

Publication Number Publication Date
CN117694024A true CN117694024A (zh) 2024-03-12

Family

ID=85086705

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280051810.2A Pending CN117694024A (zh) 2021-07-26 2022-07-13 接合基板、电路基板及其制造方法、以及单片基板及其制造方法

Country Status (4)

Country Link
EP (1) EP4369874A4 (https=)
JP (1) JP7365528B2 (https=)
CN (1) CN117694024A (https=)
WO (1) WO2023008200A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210028A (ja) 2004-01-26 2005-08-04 Kyocera Corp 多数個取り配線基板
JP4860200B2 (ja) * 2005-08-04 2012-01-25 Ｊｕｋｉ株式会社 多面取り基板の生産履歴管理方法及び多面取り基板
JP5299304B2 (ja) * 2010-02-05 2013-09-25 三菱マテリアル株式会社 パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
JP2013247256A (ja) * 2012-05-28 2013-12-09 Hitachi Ltd 半導体装置およびその製造方法
BE1023850B1 (nl) * 2016-06-29 2017-08-14 C-Mac Electromag Bvba Verbeterde elektronische schakeling en substraat met identificatiepatroon voor afzonderlijke elektronische schakelingen en werkwijze voor het produceren daarvan
JP7741725B2 (ja) 2019-03-01 2025-09-18 デンカ株式会社 セラミックグリーンシート、セラミック基板、セラミックグリーンシートの製造方法およびセラミック基板の製造方法
CN114127918A (zh) * 2019-07-31 2022-03-01 电化株式会社 陶瓷基板及其制造方法、复合基板及其制造方法以及电路基板及其制造方法
JP7503069B2 (ja) * 2019-09-20 2024-06-19 デンカ株式会社 複合基板及びその製造方法、並びに、回路基板及びその製造方法

Also Published As

Publication number Publication date
JP7365528B2 (ja) 2023-10-19
EP4369874A1 (en) 2024-05-15
EP4369874A4 (en) 2024-11-06
WO2023008200A1 (ja) 2023-02-02
JPWO2023008200A1 (https=) 2023-02-02

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