JPWO2023008200A1 - - Google Patents

Info

Publication number
JPWO2023008200A1
JPWO2023008200A1 JP2023506314A JP2023506314A JPWO2023008200A1 JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1 JP 2023506314 A JP2023506314 A JP 2023506314A JP 2023506314 A JP2023506314 A JP 2023506314A JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023506314A
Other languages
Japanese (ja)
Other versions
JPWO2023008200A5 (https=
JP7365528B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023008200A1 publication Critical patent/JPWO2023008200A1/ja
Publication of JPWO2023008200A5 publication Critical patent/JPWO2023008200A5/ja
Application granted granted Critical
Publication of JP7365528B2 publication Critical patent/JP7365528B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023506314A 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 Active JP7365528B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021121333 2021-07-26
JP2021121333 2021-07-26
PCT/JP2022/027620 WO2023008200A1 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023008200A1 true JPWO2023008200A1 (https=) 2023-02-02
JPWO2023008200A5 JPWO2023008200A5 (https=) 2023-07-05
JP7365528B2 JP7365528B2 (ja) 2023-10-19

Family

ID=85086705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506314A Active JP7365528B2 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Country Status (4)

Country Link
EP (1) EP4369874A4 (https=)
JP (1) JP7365528B2 (https=)
CN (1) CN117694024A (https=)
WO (1) WO2023008200A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) * 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) * 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) * 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210028A (ja) 2004-01-26 2005-08-04 Kyocera Corp 多数個取り配線基板
JP2013247256A (ja) * 2012-05-28 2013-12-09 Hitachi Ltd 半導体装置およびその製造方法
BE1023850B1 (nl) * 2016-06-29 2017-08-14 C-Mac Electromag Bvba Verbeterde elektronische schakeling en substraat met identificatiepatroon voor afzonderlijke elektronische schakelingen en werkwijze voor het produceren daarvan
CN113490654A (zh) 2019-03-01 2021-10-08 电化株式会社 陶瓷生片、陶瓷基板、陶瓷生片的制造方法及陶瓷基板的制造方法
WO2021054317A1 (ja) * 2019-09-20 2021-03-25 デンカ株式会社 複合基板及びその製造方法、並びに、回路基板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) * 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) * 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) * 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Also Published As

Publication number Publication date
CN117694024A (zh) 2024-03-12
JP7365528B2 (ja) 2023-10-19
WO2023008200A1 (ja) 2023-02-02
EP4369874A1 (en) 2024-05-15
EP4369874A4 (en) 2024-11-06

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