JPWO2023008200A1 - - Google Patents

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Publication number
JPWO2023008200A1
JPWO2023008200A1 JP2023506314A JP2023506314A JPWO2023008200A1 JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1 JP 2023506314 A JP2023506314 A JP 2023506314A JP 2023506314 A JP2023506314 A JP 2023506314A JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023506314A
Other versions
JP7365528B2 (ja
JPWO2023008200A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023008200A1 publication Critical patent/JPWO2023008200A1/ja
Publication of JPWO2023008200A5 publication Critical patent/JPWO2023008200A5/ja
Application granted granted Critical
Publication of JP7365528B2 publication Critical patent/JP7365528B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
JP2023506314A 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 Active JP7365528B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021121333 2021-07-26
JP2021121333 2021-07-26
PCT/JP2022/027620 WO2023008200A1 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023008200A1 true JPWO2023008200A1 (ja) 2023-02-02
JPWO2023008200A5 JPWO2023008200A5 (ja) 2023-07-05
JP7365528B2 JP7365528B2 (ja) 2023-10-19

Family

ID=85086705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506314A Active JP7365528B2 (ja) 2021-07-26 2022-07-13 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法

Country Status (4)

Country Link
EP (1) EP4369874A1 (ja)
JP (1) JP7365528B2 (ja)
CN (1) CN117694024A (ja)
WO (1) WO2023008200A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) * 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) * 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) * 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210028A (ja) 2004-01-26 2005-08-04 Kyocera Corp 多数個取り配線基板
US20220147723A1 (en) 2019-03-01 2022-05-12 Denka Company Limited Ceramic green sheet, ceramic substrate, method of producing ceramic green sheet, and method of producing ceramic substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042934A (ja) * 2005-08-04 2007-02-15 Juki Corp 多面取り基板の生産履歴管理方法及び多面取り基板
JP2011165727A (ja) * 2010-02-05 2011-08-25 Mitsubishi Materials Corp パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体
JP2011233648A (ja) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd マーク付き回路基板
WO2021020471A1 (ja) * 2019-07-31 2021-02-04 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Also Published As

Publication number Publication date
WO2023008200A1 (ja) 2023-02-02
JP7365528B2 (ja) 2023-10-19
CN117694024A (zh) 2024-03-12
EP4369874A1 (en) 2024-05-15

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