JP7346190B2 - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
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- JP7346190B2 JP7346190B2 JP2019168748A JP2019168748A JP7346190B2 JP 7346190 B2 JP7346190 B2 JP 7346190B2 JP 2019168748 A JP2019168748 A JP 2019168748A JP 2019168748 A JP2019168748 A JP 2019168748A JP 7346190 B2 JP7346190 B2 JP 7346190B2
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- 238000000034 method Methods 0.000 description 22
- 230000007246 mechanism Effects 0.000 description 13
- 230000007423 decrease Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
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- 239000000853 adhesive Substances 0.000 description 1
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- 238000011109 contamination Methods 0.000 description 1
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Description
第1の実施形態にかかる半導体製造装置は、隙間が接着樹脂(アンダーフィル)で埋められた複数のバンプ電極を介して配線基板上に半導体チップを熱圧着して半導体装置を構成するフリップチップ実装を行う。半導体製造装置は、半導体チップ裏面(回路が施された面と逆の裏面)と熱圧着ツール(以下ボンディングツール)との間にテープ(フィルム)を介在させたFAB(Film Assist Bonding)を行う。これにより、熱圧着時にチップの外形よりはみだした接着樹脂がボンディングツールに付着しないようにする。
次に、第2の実施形態にかかる半導体製造装置について説明する。以下では、第1の実施形態と異なる部分を中心に説明する。
Claims (11)
- 基板と複数のバンプ電極を介して前記基板にボンディングされるべき半導体チップとが載置される載置面を有するステージと、
前記載置面に対向する表面と前記表面における前記半導体チップに重なる第1の領域に配された第1の吸着構造と前記表面における前記第1の領域の周囲の第2の領域に配された第2の吸着構造とを有するボンディングツールと、
第1の期間に少なくとも前記第1の吸着構造により前記表面にテープを介して前記半導体チップを吸着させた状態で前記ボンディングツールを前記ステージに相対的に近づけ、前記第1の期間に続く第2の期間に前記ボンディングツールから前記半導体チップへの加圧力を目標圧力に維持しながら前記ボンディングツールの温度を第1の目標温度に制御し、前記第2の期間に続く第3の期間に前記ボンディングツールから前記半導体チップへの加圧力が前記目標圧力に維持されるように前記ボンディングツール及び前記ステージの距離を相対的に制御するとともに前記ボンディングツールの温度を前記第1の目標温度より高い第2の目標温度に制御し、前記第3の期間に続く第4の期間に前記ボンディングツールを前記ステージから相対的に遠ざけ前記第1の吸着構造及び前記第2の吸着構造による吸着を解除するコントローラと、
を備え、
前記ボンディングツールは、前記表面における前記第2の吸着構造の周囲に配された診断穴をさらに有し、
前記コントローラは、前記第1の期間に前記第1の吸着構造により前記表面に前記テープを介して前記半導体チップを吸着させた状態で前記ボンディングツールを前記ステージに相対的に近づけ、前記第3の期間に前記診断穴を介して前記テープの吸着状態の異常を検知した場合に前記第2の吸着構造により前記表面に前記テープを吸着させる
半導体製造装置。 - 前記コントローラは、前記第1の期間に前記第2の吸着構造により前記表面に前記テープを吸着させ前記第1の吸着構造により前記表面に前記テープを介して前記半導体チップを吸着させた状態で前記ボンディングツールを前記ステージに相対的に近づける
請求項1に記載の半導体製造装置。 - 前記第1の吸着構造における空間に連通された第1の排気管と、
前記第1の排気管と独立して設けられ、前記第2の吸着構造における空間に連通された第2の排気管と、
をさらに備え、
前記コントローラは、前記第1の期間に前記第1の排気管を介して前記第1の吸着構造における空間を減圧状態に制御するとともに前記第2の排気管を介して前記第2の吸着構造における空間を減圧状態に制御し、前記第4の期間に前記第1の排気管を介して前記第1の吸着構造における空間の減圧状態を解除するとともに前記第2の排気管を介して前記第2の吸着構造における空間の減圧状態を解除する
請求項2に記載の半導体製造装置。 - 前記第1の吸着構造における空間に連通された第1の排気管と、
前記第1の排気管と独立して設けられ、前記第2の吸着構造における空間に連通された第2の排気管と、
前記第1の排気管及び前記第2の排気管と独立して設けられ、前記診断穴に連通された第3の排気管と、
をさらに備え、
前記コントローラは、前記第1の期間に前記第1の排気管を介して前記第1の吸着構造における空間を減圧状態に制御し、前記第3の期間に前記第3の排気管及び前記診断穴を介して前記テープの異常を検知した場合に前記第2の排気管を介して前記第2の吸着構造における空間を減圧状態に制御し、前記第4の期間に前記第1の排気管を介して前記第1の吸着構造における空間の減圧状態を解除するとともに前記第2の排気管を介して前記第2の吸着構造における空間の減圧状態を解除する
請求項1に記載の半導体製造装置。 - 前記第2の吸着構造は、前記第1の領域の外縁に沿って延びた溝を含む
請求項1から4のいずれか1項に記載の半導体製造装置。 - 前記第2の吸着構造は、前記第1の領域の外縁に沿って配列された複数の吸着穴を含む
請求項1から4のいずれか1項に記載の半導体製造装置。 - 前記第2の吸着構造は、
段差面と、
前記段差面に対して外側に隣接するテラス面と、
前記テラス面に配された吸着穴と、
を有する
請求項1から4のいずれか1項に記載の半導体製造装置。 - 基板と前記基板にボンディングされるべき半導体チップとが載置される載置面を有するステージと、
平面視で矩形状であり、前記載置面に対向する表面と前記表面における前記半導体チップに重なる第1の領域に配された第1の吸着構造と前記表面における前記第1の領域の周囲の第2の領域に配された第2の吸着構造とを有するボンディングツールと、
を備え、
前記第1の吸着構造は、前記ボンディングツールの長手方向に沿って配列された複数の第1の吸着穴を有し、
前記第2の吸着構造は、前記第1の領域を囲むように配列された複数の第2の吸着穴を有し、
前記ボンディングツールは、前記表面における前記第2の吸着構造の周囲に配された診断穴をさらに有する
半導体製造装置。 - 前記第2の吸着構造は、
段差面と、
前記段差面に対して外側に隣接するテラス面と、
をさらに有し、
前記複数の第2の吸着穴は、前記テラス面に配されている
請求項8に記載の半導体製造装置。 - 前記第1の吸着穴に連通された第1の排気管と、
前記第1の排気管と独立して設けられ、前記第2の吸着穴に連通された第2の排気管と、
前記第1の排気管を介した前記第1の吸着穴の減圧制御と前記第2の排気管を介した前記第2の吸着穴の減圧制御とを互いに独立して行うコントローラと、
をさらに備えた
請求項8又は9に記載の半導体製造装置。 - 前記第1の吸着穴に連通された第1の排気管と、
前記第1の排気管と独立して設けられ、前記第2の吸着穴に連通された第2の排気管と、
前記第1の排気管及び前記第2の排気管と独立して設けられ、前記診断穴に連通された第3の排気管と、
前記第1の排気管を介した前記第1の吸着穴の減圧制御と前記第2の排気管を介した前記第2の吸着穴の減圧制御と前記第3の排気管を介した前記診断穴の減圧制御とを互いに独立して行うコントローラと、
をさらに備えた
請求項8に記載の半導体製造装置。
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