JP7330187B2 - 粗化ニッケルめっき板 - Google Patents

粗化ニッケルめっき板 Download PDF

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Publication number
JP7330187B2
JP7330187B2 JP2020531398A JP2020531398A JP7330187B2 JP 7330187 B2 JP7330187 B2 JP 7330187B2 JP 2020531398 A JP2020531398 A JP 2020531398A JP 2020531398 A JP2020531398 A JP 2020531398A JP 7330187 B2 JP7330187 B2 JP 7330187B2
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JP
Japan
Prior art keywords
nickel
roughened
plating
layer
adhesion
Prior art date
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Application number
JP2020531398A
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English (en)
Japanese (ja)
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JPWO2020017655A5 (https=
JPWO2020017655A1 (ja
Inventor
慎一郎 堀江
悦郎 堤
利文 小▲柳▼
興 吉岡
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Toyo Kohan Co Ltd
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Toyo Kohan Co Ltd
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Publication date
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Publication of JPWO2020017655A1 publication Critical patent/JPWO2020017655A1/ja
Publication of JPWO2020017655A5 publication Critical patent/JPWO2020017655A5/ja
Priority to JP2023128768A priority Critical patent/JP7710492B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16Electroplating with layers of varying thickness
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/406Bright, glossy, shiny surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538Roughness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/72Density
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • C25D5/36Pretreatment of metallic surfaces to be electroplated of iron or steel
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12944Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
JP2020531398A 2018-07-19 2019-07-19 粗化ニッケルめっき板 Active JP7330187B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023128768A JP7710492B2 (ja) 2018-07-19 2023-08-07 粗化ニッケルめっき板

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2018135582 2018-07-19
JP2018135582 2018-07-19
JP2019015942 2019-01-31
JP2019015942 2019-01-31
JP2019108779 2019-06-11
JP2019108779 2019-06-11
PCT/JP2019/028562 WO2020017655A1 (ja) 2018-07-19 2019-07-19 粗化ニッケルめっき板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023128768A Division JP7710492B2 (ja) 2018-07-19 2023-08-07 粗化ニッケルめっき板

Publications (3)

Publication Number Publication Date
JPWO2020017655A1 JPWO2020017655A1 (ja) 2021-08-02
JPWO2020017655A5 JPWO2020017655A5 (https=) 2022-05-10
JP7330187B2 true JP7330187B2 (ja) 2023-08-21

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JP2020531398A Active JP7330187B2 (ja) 2018-07-19 2019-07-19 粗化ニッケルめっき板
JP2023128768A Active JP7710492B2 (ja) 2018-07-19 2023-08-07 粗化ニッケルめっき板

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Country Status (6)

Country Link
US (1) US11760063B2 (https=)
JP (2) JP7330187B2 (https=)
KR (2) KR102746732B1 (https=)
CN (1) CN112424400B (https=)
DE (1) DE112019003641T5 (https=)
WO (1) WO2020017655A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023156409A (ja) * 2018-07-19 2023-10-24 東洋鋼鈑株式会社 粗化ニッケルめっき板

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113930811A (zh) * 2020-06-29 2022-01-14 比亚迪股份有限公司 一种铜基金属件、金属塑胶复合材料及其制备方法
CN113930810B (zh) * 2020-06-29 2024-02-27 比亚迪股份有限公司 一种铁基金属件、金属塑胶复合材料及其制备方法
CN115698388B (zh) 2020-07-16 2025-05-16 东洋钢钣株式会社 电解铁箔
EP4183905A4 (en) 2020-07-16 2024-10-23 Toyo Kohan Co., Ltd. ELECTROLYTIC IRON FOIL
WO2022210654A1 (ja) * 2021-03-31 2022-10-06 日鉄ケミカル&マテリアル株式会社 集電体用鋼箔、電極、及び、電池
DE112022002379T5 (de) 2021-04-28 2024-02-15 Toyo Kohan Co., Ltd. Oberflächenbehandelte Stahlfolie
WO2022231008A1 (ja) 2021-04-28 2022-11-03 東洋鋼鈑株式会社 集電体用表面処理鋼箔
JP7578802B2 (ja) 2021-04-28 2024-11-06 東洋鋼鈑株式会社 集電体用表面処理鋼箔及びその製造方法
JP7568342B2 (ja) 2021-09-29 2024-10-16 ミネベアパワーデバイス株式会社 めっき欠陥推定方法および半導体装置の製造方法
JP2023098448A (ja) * 2021-12-28 2023-07-10 株式会社豊田自動織機 金属水素化物電池のバイポーラ電極、及びそのバイポーラ電極を備えた金属水素化物電池
JP2023098440A (ja) * 2021-12-28 2023-07-10 東洋鋼鈑株式会社 集電体用表面処理金属箔
EP4516971A4 (en) 2022-04-29 2026-04-29 Toyo Kohan Co Ltd Method for producing rolled surface-treated steel sheet, and rolled surface-treated steel sheet
WO2023210832A1 (ja) 2022-04-29 2023-11-02 東洋鋼鈑株式会社 ニッケルめっき鋼板及びその製造方法
JP7354345B1 (ja) * 2022-05-16 2023-10-02 Jx金属株式会社 非水電解質電池用タブリード
JP7354347B1 (ja) 2022-05-16 2023-10-02 Jx金属株式会社 非水電解質電池用タブリード
JP7354346B1 (ja) * 2022-05-16 2023-10-02 Jx金属株式会社 非水電解質電池用タブリード
JP7354348B1 (ja) 2022-05-16 2023-10-02 Jx金属株式会社 非水電解質電池用タブリード
KR20250136307A (ko) 2023-01-16 2025-09-16 도요 고한 가부시키가이샤 니켈 도금 금속재
KR20250085212A (ko) * 2023-12-05 2025-06-12 주식회사 포스코 도금강판 및 그 제조방법

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JP2011021216A (ja) 2009-07-14 2011-02-03 Furukawa Electric Co Ltd:The 抵抗層付銅箔、該銅箔の製造方法および積層基板
JP2013095991A (ja) 2011-11-04 2013-05-20 Fukuda Metal Foil & Powder Co Ltd 高放射率金属箔

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JPS5855236B2 (ja) * 1975-07-17 1983-12-08 ソニー株式会社 酸性Ni電気メッキ浴
JPS5885345U (ja) 1981-12-07 1983-06-09 株式会社日立製作所 精密平面移動装置
KR100602896B1 (ko) * 2002-06-04 2006-07-19 미쓰이 긴조꾸 고교 가부시키가이샤 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판
JP4934443B2 (ja) * 2007-01-29 2012-05-16 古河電気工業株式会社 金属箔の表面処理方法
JP5885345B2 (ja) 2012-05-29 2016-03-15 東洋鋼鈑株式会社 樹脂との加工密着性に優れる容器用表面処理鋼板、その製造方法および缶
US9903989B2 (en) * 2012-08-31 2018-02-27 Lg Chem, Ltd. Metal structure for decorative bezel and method for manufacturing same
TWI510362B (zh) * 2013-04-30 2015-12-01 Nippon Steel & Sumitomo Metal Corp 鍍Ni鋼板及鍍Ni鋼板之製造方法
US9707738B1 (en) * 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
KR102479919B1 (ko) * 2016-09-13 2022-12-20 도요 고한 가부시키가이샤 전지 용기용 표면 처리 강판의 제조 방법
KR102746732B1 (ko) 2018-07-19 2024-12-24 도요 고한 가부시키가이샤 조화 니켈 도금판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021216A (ja) 2009-07-14 2011-02-03 Furukawa Electric Co Ltd:The 抵抗層付銅箔、該銅箔の製造方法および積層基板
JP2013095991A (ja) 2011-11-04 2013-05-20 Fukuda Metal Foil & Powder Co Ltd 高放射率金属箔

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023156409A (ja) * 2018-07-19 2023-10-24 東洋鋼鈑株式会社 粗化ニッケルめっき板
JP7710492B2 (ja) 2018-07-19 2025-07-18 東洋鋼鈑株式会社 粗化ニッケルめっき板

Also Published As

Publication number Publication date
CN112424400A (zh) 2021-02-26
JP2023156409A (ja) 2023-10-24
US20210268770A1 (en) 2021-09-02
KR20210032397A (ko) 2021-03-24
KR102746732B1 (ko) 2024-12-24
KR102684520B1 (ko) 2024-07-11
KR20240113609A (ko) 2024-07-22
JP7710492B2 (ja) 2025-07-18
WO2020017655A1 (ja) 2020-01-23
DE112019003641T5 (de) 2021-05-06
CN112424400B (zh) 2023-12-05
JPWO2020017655A1 (ja) 2021-08-02
US11760063B2 (en) 2023-09-19

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