JP7306381B2 - 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム - Google Patents

導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム Download PDF

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Publication number
JP7306381B2
JP7306381B2 JP2020518322A JP2020518322A JP7306381B2 JP 7306381 B2 JP7306381 B2 JP 7306381B2 JP 2020518322 A JP2020518322 A JP 2020518322A JP 2020518322 A JP2020518322 A JP 2020518322A JP 7306381 B2 JP7306381 B2 JP 7306381B2
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Japan
Prior art keywords
group
meth
resin film
acrylate
stretchable
Prior art date
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JP2020518322A
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English (en)
Japanese (ja)
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JPWO2019216352A1 (ja
Inventor
タンイー シム
剛史 正木
崇司 川守
禎宏 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
JP2020518322A 2018-05-11 2019-05-08 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム Active JP7306381B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018092494 2018-05-11
JP2018092494 2018-05-11
PCT/JP2019/018440 WO2019216352A1 (ja) 2018-05-11 2019-05-08 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム

Publications (2)

Publication Number Publication Date
JPWO2019216352A1 JPWO2019216352A1 (ja) 2021-05-27
JP7306381B2 true JP7306381B2 (ja) 2023-07-11

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JP2020518322A Active JP7306381B2 (ja) 2018-05-11 2019-05-08 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム

Country Status (5)

Country Link
JP (1) JP7306381B2 (zh)
KR (1) KR20210007966A (zh)
CN (1) CN112106450A (zh)
TW (1) TWI826445B (zh)
WO (1) WO2019216352A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7385483B2 (ja) 2020-01-27 2023-11-22 キオクシア株式会社 半導体装置およびその製造方法
WO2024014435A1 (ja) * 2022-07-12 2024-01-18 株式会社レゾナック 硬化性樹脂組成物、硬化性フィルム、及び、積層フィルム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119410A (ja) 1998-10-16 2000-04-25 Nitto Denko Corp 高分子フィルム及び粘着シート
WO2016080346A1 (ja) 2014-11-18 2016-05-26 日立化成株式会社 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物
WO2017026420A1 (ja) 2015-08-07 2017-02-16 太陽インキ製造株式会社 導電性組成物、導電体およびフレキシブルプリント配線板
JP2017183328A (ja) 2016-03-28 2017-10-05 住友ベークライト株式会社 電子装置および電子装置の製造方法
JP2018056462A (ja) 2016-09-30 2018-04-05 住友ベークライト株式会社 配線基板および電子装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003244466A1 (en) * 2002-02-06 2003-09-02 Sekisui Chemical Co., Ltd. Resin composition
JP5082373B2 (ja) * 2005-10-18 2012-11-28 日立化成工業株式会社 プリント配線板用樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板
JP4864545B2 (ja) * 2006-05-26 2012-02-01 太陽ホールディングス株式会社 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法
TWI488841B (zh) * 2009-03-27 2015-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition, and an insulating film, a laminate, and a printed wiring board
JP2013187380A (ja) 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119410A (ja) 1998-10-16 2000-04-25 Nitto Denko Corp 高分子フィルム及び粘着シート
WO2016080346A1 (ja) 2014-11-18 2016-05-26 日立化成株式会社 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物
WO2017026420A1 (ja) 2015-08-07 2017-02-16 太陽インキ製造株式会社 導電性組成物、導電体およびフレキシブルプリント配線板
JP2017183328A (ja) 2016-03-28 2017-10-05 住友ベークライト株式会社 電子装置および電子装置の製造方法
JP2018056462A (ja) 2016-09-30 2018-04-05 住友ベークライト株式会社 配線基板および電子装置

Also Published As

Publication number Publication date
WO2019216352A1 (ja) 2019-11-14
KR20210007966A (ko) 2021-01-20
TWI826445B (zh) 2023-12-21
JPWO2019216352A1 (ja) 2021-05-27
CN112106450A (zh) 2020-12-18
TW202003665A (zh) 2020-01-16

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