WO2019216352A1 - 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム - Google Patents

導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム Download PDF

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Publication number
WO2019216352A1
WO2019216352A1 PCT/JP2019/018440 JP2019018440W WO2019216352A1 WO 2019216352 A1 WO2019216352 A1 WO 2019216352A1 JP 2019018440 W JP2019018440 W JP 2019018440W WO 2019216352 A1 WO2019216352 A1 WO 2019216352A1
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meth
acrylate
stretchable
resin film
stretchable resin
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PCT/JP2019/018440
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English (en)
French (fr)
Japanese (ja)
Inventor
タンイー シム
剛史 正木
崇司 川守
禎宏 小川
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日立化成株式会社
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Priority to KR1020207031452A priority Critical patent/KR20210007966A/ko
Priority to JP2020518322A priority patent/JP7306381B2/ja
Priority to CN201980030605.6A priority patent/CN112106450A/zh
Publication of WO2019216352A1 publication Critical patent/WO2019216352A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Definitions

  • the present invention relates to a conductor substrate, a stretchable wiring substrate, and a stretchable resin film for a wiring substrate.
  • Patent Document 1 proposes a stretchable flexible circuit board composed of a stretchable thermoplastic elastomer.
  • stretchable wiring boards are often exposed to high temperatures exceeding, for example, 100 ° C. along with the mounting of various electronic components.
  • the stretchable wiring board greatly expands at a high temperature, which may hinder stable production of the stretchable device.
  • the stretchable resin film constituting the conventional stretchable wiring board has a high tack, particularly at high temperatures, there is a problem with the handleability of the stretchable wiring board at high temperatures.
  • an object of one aspect of the present invention is to provide a stretchable wiring board that has excellent stretchability, a low coefficient of thermal expansion, low tack at high temperatures, and excellent handleability, and a conductor used for obtaining the same.
  • the object is to provide a substrate and a stretchable resin film.
  • One aspect of the present invention provides a conductive substrate having a stretchable resin film and a conductor layer provided on the stretchable resin film.
  • the stretchable resin film contains a rubber component and a filler.
  • the rubber component may be cross-linked.
  • the conductor substrate according to one aspect of the present invention it is possible to obtain a stretchable wiring substrate that has excellent stretchability, a low thermal expansion coefficient, low tack at high temperature, and excellent handleability.
  • Another aspect of the present invention provides a stretchable wiring board including the above-described conductor board, wherein the conductor layer forms a wiring pattern.
  • the above-mentioned conductor substrate has an excellent stretchability, has a low coefficient of thermal expansion, and has a low tack at high temperatures and excellent handleability.
  • Still another aspect of the present invention provides a stretchable resin film for a wiring board containing a rubber component and a filler.
  • still another aspect of the present invention provides an application for producing a wiring board of a stretchable resin film containing a rubber component and a filler, and the rubber component may be crosslinked.
  • the rubber component may be cross-linked.
  • the above-mentioned stretchable resin film can provide a stretchable wiring board that has excellent stretchability, has a low coefficient of thermal expansion, and has low tack at high temperatures and excellent handleability.
  • a stretchable wiring board having excellent stretchability, a low coefficient of thermal expansion, a low tack at high temperature, and excellent handleability.
  • FIG. 1 is a plan view showing an embodiment of a stretchable wiring board.
  • a stretchable wiring substrate 1 shown in FIG. 1 is a conductor substrate having a stretchable resin film 3 and a conductor layer 5 provided on the stretchable resin film 3 and forming a wiring pattern.
  • the stretchable resin film 3 contains a rubber component and a filler. Elasticity is easily imparted to the elastic resin film mainly by the rubber component.
  • the conductor layer 5 forms a wiring pattern including a corrugated portion that can be expanded and contracted.
  • the stretchable resin film 3 can have stretchability such that the recovery rate after tensile deformation to 20% strain is 80% or more.
  • This recovery rate is calculated
  • FIG. 2 is a stress-strain curve showing an example of measuring the recovery rate.
  • the recovery rate can be measured, for example, when X is 50%. From the viewpoint of resistance to repeated use, the recovery rate may be 80% or more, 85% or more, or 90% or more. The upper limit on the definition of the recovery rate is 100%.
  • the rubber component includes one or more rubbers.
  • the rubber contained in the rubber component may be a thermoplastic elastomer.
  • thermoplastic elastomers include hydrogenated styrene elastomers.
  • a hydrogenated styrene-based elastomer is an elastomer obtained by adding hydrogen to an unsaturated double bond of a styrene-based elastomer having a soft segment including an unsaturated double bond.
  • the hydrogenated styrene-based elastomer can be expected to have an effect of improving weather resistance.
  • hydrogenated styrene elastomers examples include styrene-ethylenebutylene-styrene block copolymer elastomers (SEBS, sometimes referred to as “hydrogenated styrene butadiene rubber”).
  • SEBS styrene-ethylenebutylene-styrene block copolymer elastomers
  • Rubber components are acrylic rubber, isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene rubber, ethylene propylene rubber, fluoro rubber, sulfurized rubber, epichlorohydrin rubber, and chlorinated butyl rubber. It may contain at least one rubber selected from the group consisting of
  • the rubber component may include at least one rubber selected from styrene butadiene rubber, butadiene rubber, and butyl rubber.
  • styrene butadiene rubber By using styrene butadiene rubber, the resistance of the stretchable resin film to various chemicals used in the plating process is improved, and a wiring board can be manufactured with high yield.
  • acrylic rubber examples include ZEON Corporation “Nipol AR Series” and Kuraray Co., Ltd. “Clarity Series”.
  • isoprene rubber for example, Nippon Zeon Co., Ltd. “Nipol IR Series” can be mentioned.
  • butyl rubber examples include JSR Corporation “BUTYL Series”
  • styrene butadiene rubber examples include JSR Corporation “Dynalon SEBS Series”, “Dynalon HSBR Series”, Kraton Polymer Japan Co., Ltd. “Clayton D Polymer Series”, and Aron Kasei Corporation “AR Series”.
  • Examples of commercially available butadiene rubber include ZEON Corporation “Nipol BR Series”. Examples of commercially available acrylonitrile butadiene rubber include JSR Corporation “JSR NBR Series”. Examples of commercially available silicone rubber include Shin-Etsu Silicone Co., Ltd. “KMP Series”. Examples of commercially available ethylene propylene rubber include JSR Corporation “JSR EP Series”.
  • fluororubber for example, Daikin Co., Ltd. “DAIEL series” is exemplified.
  • As a commercial item of epichlorohydrin rubber Nippon Zeon Co., Ltd. "Hydrin series” is mentioned, for example.
  • the rubber component can also be produced by synthesis.
  • acrylic rubber can be obtained by reacting (meth) acrylic acid, (meth) acrylic acid ester, aromatic vinyl compound, vinyl cyanide compound and the like.
  • the rubber component may be crosslinked by a reaction of a crosslinking group.
  • the cross-linking group may be a reactive group capable of proceeding with the reaction of cross-linking the molecular chain of the rubber component or the formation of a cross-linked structure by the reaction of the molecular chain of the rubber component with the cross-linking component described later. Examples include (meth) acryloyl groups, vinyl groups, epoxy groups, styryl groups, amino groups, isocyanurate groups, ureido groups, cyanate groups, isocyanate groups, mercapto groups, hydroxyl groups, carboxyl groups, and acid anhydride groups. Can be mentioned.
  • the rubber component may be crosslinked by the reaction of at least one of the acid anhydride group or the carboxyl group.
  • rubbers having acid anhydride groups include rubbers that are partially modified with maleic anhydride.
  • As a commercial product of rubber partially modified with maleic anhydride for example, there is a styrene elastomer “Tuffprene 912” manufactured by Asahi Kasei Corporation.
  • the rubber partially modified with maleic anhydride may be a hydrogenated styrene elastomer modified with maleic anhydride.
  • the hydrogenated styrene elastomer modified with maleic anhydride include maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer.
  • Examples of such commercially available products include “FG1901” and “FG1924” from Clayton Polymer Japan Co., Ltd., “Tuff Tech M1911”, “Tuff Tech M1913” and “Tuff Tech M1943” from Asahi Kasei Corporation.
  • the weight average molecular weight of the rubber component may be 20,000 to 200,000, 30,000 to 150,000, or 50,000 to 125,000 from the viewpoint of coating properties.
  • the weight average molecular weight (Mw) here means a standard polystyrene conversion value determined by gel permeation chromatography (GPC).
  • the content of the rubber component in the stretchable resin film may be 30 to 100% by weight, 50 to 100% by weight, or 70 to 100% by weight based on the weight of components other than the filler in the stretchable resin film. . When the content of the rubber component is within this range, the stretchable resin film tends to have particularly excellent stretchability.
  • the stretchable resin film contains one or more fillers dispersed in a resin phase containing a rubber component.
  • the filler can be an inorganic filler, an organic filler, or a combination thereof.
  • the filler may include at least one inorganic filler selected from the group consisting of silica, glass, alumina, titanium oxide, carbon black, mica, and boron nitride.
  • the average particle size of the filler may be 10 to 500 nm. When the average particle diameter of the filler is within this range, a more remarkable effect can be obtained in terms of reducing the thermal expansion coefficient of the stretchable resin film and suppressing tackiness of the stretchable resin film at a high temperature. From the same viewpoint, the average particle size of the filler may be 400 nm or less, 300 nm or less, 200 nm or less, 150 nm or less, or 80 nm or less. In the present specification, the average particle diameter of the filler means an average particle diameter (average primary particle diameter) obtained by a laser diffraction / scattering method. The average particle size of the filler can be measured using, for example, a nano particle size distribution measuring device SALD-7500 nano (manufactured by Shimadzu Corporation).
  • the shape of the filler is not particularly limited, and the filler can have any shape such as a substantially spherical shape, a fiber shape, and an indefinite shape.
  • the surface of the filler may be modified with a functional group.
  • the functional group that can be introduced on the surface of the filler include an amino group, a phenylamino group, and a phenyl group.
  • a filler having a surface modified with a functional group can contribute to improving the adhesion between the stretchable resin film and the conductor layer.
  • the filler content in the stretchable resin film may be 1 to 200 parts by mass with respect to 100 parts by mass of the rubber component.
  • the filler content may be 150 parts by mass or less or 100 parts by mass or less with respect to 100 parts by mass of the rubber component.
  • the stretchable resin film may be a cured product of a resin composition containing a rubber component and a filler.
  • the resin composition may further contain a crosslinking component.
  • the cured product of the resin composition includes a crosslinked structure formed by a reaction between the crosslinking groups of the rubber component, a reaction between the crosslinking group of the rubber component and the crosslinking component, a polymerization reaction of the crosslinking component, or a combination thereof. If the stretchable resin film is a cured product of the resin composition, the heat resistance of the stretchable resin film tends to be improved.
  • the crosslinking component that can be contained in the resin composition for forming the stretchable resin film is a compound having one or more reactive groups.
  • the crosslinking component is selected from the group consisting of, for example, an epoxy group, a (meth) acryloyl group, a vinyl group, a styryl group, an amino group, an isocyanurate group, a ureido group, a cyanate group, an isocyanate group, a mercapto group, a hydroxyl group, and a carboxyl group. It may be a compound having at least one reactive group.
  • the crosslinking component may be a compound having a reactive group selected from an epoxy group, an amino group, a hydroxyl group, and a carboxyl group.
  • the combination of a rubber having at least one of a maleic anhydride group or a carboxyl group and a compound having an epoxy group (epoxy resin), heat resistance and low moisture permeability of the stretchable resin film, stretchable resin film and conductive layer In particular, excellent effects are obtained in terms of adhesion to the resin and low tack of the stretchable resin film after curing.
  • the heat resistance of the stretchable resin film is improved, deterioration of the stretchable resin film in a heating process such as nitrogen reflow can be suppressed. If the stretchable resin film after curing has a low tack, the conductor substrate or the wiring substrate can be handled with good workability.
  • the compound containing an epoxy group that can be used as a crosslinking component can be a monofunctional, bifunctional, or trifunctional or higher polyfunctional epoxy resin.
  • the crosslinking component may contain a bifunctional or trifunctional or higher functional epoxy resin in order to obtain sufficient curability.
  • epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, cresol novolac type epoxy resin, and epoxy resin having a fatty chain. It may be at least one selected.
  • An example of a commercially available epoxy resin having a fatty chain is EXA-4816 manufactured by DIC Corporation.
  • An epoxy resin that gives a cured product having a high glass transition temperature can contribute to the reduction of the thermal expansion coefficient of the stretchable resin film and the suppression of tack at a high temperature.
  • Specific examples of such an epoxy resin include dicyclopentadiene type epoxy resins and naphthalene type epoxy resins.
  • the crosslinking component may contain a compound having a (meth) acryloyl group.
  • the compound having a (meth) acryloyl group may be a (meth) acrylic acid ester.
  • the compound having a (meth) acryloyl group is a compound having one, two, three or more (meth) acryloyl groups (for example, a monofunctional, bifunctional, or trifunctional (meth) acrylic acid ester). May be.
  • the crosslinking component may be a compound having two or more (meth) acryloyl groups.
  • Examples of monofunctional (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, and butoxyethyl (meth).
  • a monofunctional (meth) acrylate may be selected from the above aliphatic (meth) acrylate and the above aromatic (meth) acrylate from the viewpoint of compatibility with the styrene-based elastomer, transparency and heat resistance.
  • bifunctional (meth) acrylic acid ester examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) ) Acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethoxylated polypropylene glycol Di (meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, neo Nthyl glycol di (meth) acrylate, 3-methyl-1,5-pentanediol di (me
  • a bifunctional (meth) acrylate may be selected from the aliphatic (meth) acrylate and the aromatic (meth) acrylate.
  • trifunctional or higher polyfunctional (meth) acrylic acid ester examples include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, and ethoxylated propoxy.
  • a polyfunctional (meth) acrylate may be selected from the aliphatic (meth) acrylate and the aromatic (meth) acrylate.
  • the content of the crosslinking component in the resin composition for forming the stretchable resin film may be 10 parts by mass, 15 parts by mass or 20 parts by mass with respect to 100 parts by mass of the rubber component. It may be less than or equal to 60 parts by weight, or less than or equal to 50 parts by weight. When the content of the crosslinking component is in the above range, the adhesion with the conductor layer tends to be improved while maintaining the properties of the stretchable resin film.
  • the resin composition for forming the stretchable resin film may further contain a curing agent for the polymerization reaction (curing reaction) of the crosslinking component, a curing accelerator, or both.
  • a curing agent is a compound that itself becomes a reaction substrate for a polymerization reaction (curing reaction) that reacts with a crosslinking component.
  • the curing accelerator is a compound that functions as a catalyst for the curing reaction. A compound having both functions of a curing agent and a curing accelerator can also be used.
  • the content of the curing agent and the curing accelerator may be 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the rubber component and the crosslinking component, respectively.
  • a compound having an epoxy group epoxy resin
  • aliphatic polyamine, polyaminoamide, polymercaptan, aromatic polyamine, acid anhydride, carboxylic acid, phenol novolac resin, ester resin, and At least one selected from the group consisting of dicyandiamide may be used.
  • the curing agent or curing accelerator for the compound having an epoxy group at least one selected from the group consisting of a tertiary amine, imidazole, and phosphine may be used. From the viewpoints of storage stability and curability of the resin composition before curing, imidazole may be used.
  • an imidazole compatible with the rubber may be selected.
  • the content of imidazole may be 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the rubber component and the crosslinking component.
  • a thermal radical polymerization initiator or a photo radical polymerization initiator may be used as the curing agent.
  • thermal radical polymerization initiator examples include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t -Butylperoxy) -2-methylcyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, and 1, Peroxyketals such as 1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; ⁇ , ⁇ ′-bis (t-butylperoxy) Diisopropylbenzene, dicumyl peroxide, t-butyl Dialkyl peroxide
  • radical photopolymerization initiators examples include benzoinketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane- 1-one and ⁇ -hydroxy ketones such as 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino- ⁇ -amino ketones such as 1- (4-morpholinophenyl) -butan-1-one and 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one; Oxime esters such as [4- (phenylthio) phenyl] -1,2-octadion-2- (benzoyl) oxime; bis ( Phosphine oxides such as 2,4,6-trimethylbenzoyl) phenylphosphine oxide,
  • 2,4,5-triarylimidazole dimer benzophenone, N, N, N Benzophenone compounds such as N, N'-tetramethyl-4,4'-diaminobenzophenone, N, N, N ', N'-tetraethyl-4,4'-diaminobenzophenone, and 4-methoxy-4'-dimethylaminobenzophenone 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone Quinone compounds such as 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-
  • the stretchable resin film, or the resin composition for forming the same may contain, as necessary, an antioxidant, a heat stabilizer, an ultraviolet absorber, a hydrolysis inhibitor, a yellowing inhibitor, Further, a visible light absorber, a colorant, a plasticizer, a flame retardant, a leveling agent and the like may be further contained within a range that does not significantly impair the effects of the present invention.
  • the thickness of the stretchable resin film 3 may be 5 to 1000 ⁇ m. When the thickness of the stretchable resin film is within this range, sufficient strength as a stretchable substrate can be easily obtained, and drying can be performed sufficiently, so that the amount of residual solvent in the stretchable resin film can be reduced.
  • the surface roughness Ra value of the main surface of the stretchable resin film 3 opposite to the conductor layer 5 may be 0.1 ⁇ m or more.
  • the Ra value may be 0.2 ⁇ m or more, 0.3 ⁇ m or more, or 0.4 ⁇ m or more.
  • the upper limit of the Ra value is not particularly limited, but may be 2.0 ⁇ m or less from the viewpoint of the strength of the stretchable resin film.
  • the surface roughness Ra value can be measured using, for example, a step gauge (manufactured by Kosaka Laboratory Ltd., ET-200).
  • the surface roughness Ra value of the stretchable resin film can be within the above range.
  • the unevenness transfer group A method of peeling the material, a method of performing imprint processing such as etching treatment and thermal imprint processing on the stretchable resin film after curing, and pressing the roughened surface of the metal foil on the stretchable resin film, There is a method of etching.
  • the tack value of the surface of the stretchable resin film is 0.7 gf / mm 2 or less (6.9 kPa or less), 0.5 gf / mm 2 or less (4.9 kPa or less), or 0.4 gf / mm 2 or less at 30 ° C. (3.9 kPa or less).
  • the tack value of the surface of the stretchable resin film may be 4.5 gf / mm 2 or less (44 kPa or less) or 4.0 gf / mm 2 or less (39 kPa or less) at 200 ° C.
  • the lower limit of the tack value is not particularly limited, and may be 0 gf / mm 2 (0 kPa).
  • the tack value is measured using, for example, a tacking tester (“TACII” manufactured by Reska Co., Ltd.).
  • the elastic modulus (tensile modulus) of the stretchable resin film may be 0.1 MPa or more and 1000 MPa or less.
  • the elastic modulus When the elastic modulus is 0.1 MPa or more and 1000 MPa or less, the handleability and flexibility as a substrate tend to be particularly excellent. From this viewpoint, the elastic modulus may be 0.3 MPa to 100 MPa, or 0.5 MPa to 50 MPa.
  • the elongation at break of the stretchable resin film may be 100% or more. When the elongation at break is 100% or more, sufficient stretchability tends to be obtained. From this viewpoint, the elongation at break may be 150% or more, 200% or more, 300% or more, or 500% or more.
  • the upper limit of the elongation at break is not particularly limited, but is usually about 1000% or less.
  • the stretchable resin film may be supplied in a state of a carrier film and a laminated film having a stretchable resin film provided on the carrier film.
  • Polyester such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate
  • Polycarbonate Polyolefin, such as polyethylene and polypropylene
  • Polyamide Polyimide
  • Polyamideimide Polyetherimide
  • Polyethersulfide polyethersulfone
  • polyketone polyphenylene ether
  • polyphenylene sulfide polyarylate
  • polysulfone and liquid crystal polymer.
  • a film of polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polypropylene, polycarbonate, polyamide, polyimide, polyamideimide, polyphenylene ether, polyphenylene sulfide, polyarylate, or polysulfone is used as a carrier film. Also good.
  • the thickness of the carrier film is not particularly limited, but may be 3 to 250 ⁇ m. When the thickness of the carrier film is 3 ⁇ m or more, the carrier film tends to have sufficient film strength. When the thickness of the carrier film is 250 ⁇ m or less, sufficient flexibility tends to be easily obtained. From the above viewpoint, the thickness of the carrier film may be 5 to 200 ⁇ m, or 7 to 150 ⁇ m. From the viewpoint of improving peelability from the stretchable resin film, a film obtained by subjecting the base film to a release treatment with a silicone compound, a fluorine-containing compound, or the like may be used as necessary.
  • the laminated film may further have a protective film covering the stretchable resin film.
  • the protective film is not particularly limited, and examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefins such as polyethylene and polypropylene. From the viewpoints of flexibility and toughness, a film of polyester such as polyethylene terephthalate or polyolefin such as polyethylene and polypropylene may be used as the protective film. From the viewpoint of improving the peelability from the stretchable resin film, the protective film may be subjected to a release treatment with a silicone compound, a fluorine-containing compound, or the like.
  • the thickness of the protective film may be appropriately changed depending on the intended flexibility, but may be 10 to 250 ⁇ m. When the thickness of the protective film is 10 ⁇ m or more, the protective film tends to have sufficient film strength. When the thickness of the protective film is 250 ⁇ m or less, the protective film tends to have sufficient flexibility. From the above viewpoint, the thickness of the protective film may be 15 to 200 ⁇ m, or 20 to 150 ⁇ m.
  • the conductor layer 5 of the stretchable wiring board 1 can be, for example, a conductor foil or a conductor plating film.
  • the conductor foil can be a metal foil.
  • metal foil include copper foil, titanium foil, stainless steel foil, nickel foil, permalloy foil, 42 alloy foil, kovar foil, nichrome foil, beryllium copper foil, phosphor bronze foil, brass foil, white foil, aluminum foil, Examples include tin foil, lead foil, zinc foil, solder foil, iron foil, tantalum foil, niobium foil, molybdenum foil, zirconium foil, gold foil, silver foil, palladium foil, monel foil, inconel foil, and hastelloy foil.
  • the conductor foil may be selected from a copper foil, a gold foil, a nickel foil, and an iron foil from the viewpoint of an appropriate elastic modulus and the like.
  • the conductor foil may be a copper foil.
  • the copper foil can easily form a wiring pattern by photolithography without impairing the properties of the stretchable resin substrate.
  • copper foil There is no restriction
  • the electrolytic copper foil and rolled copper foil used for a copper clad laminated board, a flexible wiring board, etc. can be used.
  • the conductor plating film can be a film formed by a normal plating method used in the additive method or the semi-additive method. For example, after applying a plating catalyst for depositing palladium, the stretchable resin film is immersed in an electroless plating solution, and an electroless plating layer (conductor layer) having a thickness of 0.3 to 1.5 ⁇ m is formed on the entire surface of the primer. To precipitate. If necessary, electrolytic plating (electroplating) can be further performed to adjust to a required thickness. As an electroless plating solution used for electroless plating, any electroless plating solution can be used, and there is no particular limitation. An ordinary method can be employed for electrolytic plating, and there is no particular limitation.
  • the conductor plating film (electroless plating film, electrolytic plating film) may be a copper plating film from the viewpoint of cost and resistance.
  • the thickness of the conductor layer is not particularly limited, but may be 1 to 50 ⁇ m. When the thickness of the conductor layer is 1 ⁇ m or more, the wiring pattern can be more easily formed. When the thickness of the conductor layer is 50 ⁇ m or less, etching and handling are particularly easy.
  • the stretchable wiring board is manufactured by, for example, a method including preparing a stretchable resin film and a conductor substrate having a conductor layer provided on the stretchable resin film, and forming a wiring pattern on the conductor layer. Is done.
  • a conductive substrate having a conductive foil as a conductive layer is obtained by, for example, applying a varnish of a resin composition for forming a stretchable resin film on a conductive foil, or on a stretchable resin film formed on a carrier film.
  • You may form a stretchable resin film by drying the coating film of the resin composition for forming a stretchable resin film, and hardening this by heating or light irradiation of the formed resin layer.
  • a conductor substrate having a conductor plating film as a conductor layer is obtained by, for example, a method of forming a conductor plating film on a stretchable resin film formed on a carrier film by an ordinary plating method used in an additive method or a semi-additive method. ,Obtainable.
  • the method for forming the wiring pattern on the conductor layer includes, for example, a step of forming an etching resist on the conductor layer of the conductor substrate, exposing the etching resist, developing the exposed etching resist, and forming a part of the conductor layer.
  • a step of forming a resist pattern to be covered, a step of removing a portion of the conductor layer not covered with the resist pattern with an etching solution, and a step of removing the resist pattern can be included.
  • the method of forming a wiring pattern on the conductor layer includes a step of forming a plating resist on the conductor layer of the conductor substrate, exposing the plating resist, developing the exposed plating resist, and forming a part of the conductor layer.
  • a stretchable device can be obtained by mounting various electronic components on the wiring board.
  • Raw materials The following were prepared as raw materials for producing a stretchable resin film.
  • Laminated film having a stretchable resin film 100 parts by mass of a maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer (FG1924GT), 200 parts by mass of silica filaments (SE2050), and 50 parts by mass of toluene were uniformly mixed with stirring. To the obtained mixture, 25 parts by mass of a dicyclopentadiene type epoxy resin (HP7200H) and 3.75 parts by mass of 1-benzyl-2-methylimidazole (1B2MZ) were added, and the mixture was further stirred to obtain a resin varnish.
  • FG1924GT maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer
  • SE2050 silica filaments
  • toluene 50 parts by mass of toluene were uniformly mixed with stirring.
  • the obtained resin varnish was applied onto the release-treated surface of the carrier film using a knife coater (“SNC-350” manufactured by Yasui Seiki Co., Ltd.
  • the coating film was dried (“MSO-80TPS manufactured by Futaba Kagaku Co., Ltd.) )) Was dried by heating at 100 ° C. for 20 minutes to form a resin layer having a thickness of 100 ⁇ m.
  • the formed resin layer was subjected to the same release treatment PET film as the carrier film, and the release treatment surface was a resin.
  • a laminated film was obtained by sticking as a protective film in the direction of the layer side, and the resin film was cured by heating the laminated film at 180 ° C. for 60 minutes to have a stretchable resin film (cured product of the resin layer).
  • a laminated film was obtained.
  • Example 2 A resin varnish was prepared in the same manner as in Example 1, except that 200 parts by mass of the silica filaments (SE2050) was replaced with 108 parts by mass of the silica filaments (C40) containing 70 parts by mass of filler. Using the obtained resin varnish, a laminated film having a stretchable resin film was obtained in the same manner as in Example 1.
  • Example 3 A resin varnish was prepared in the same manner as in Example 1 except that 200 parts by mass of the silica filaments (SE2050) was replaced with 233 parts by mass of the silica filaments (C120) containing 70 parts by mass of filler. Using the obtained resin varnish, a laminated film having a stretchable resin film was obtained in the same manner as in Example 1.
  • Example 4 A resin varnish was prepared in the same manner as in Example 1, except that 200 parts by mass of the silica filaments (SE2050) was replaced with 100 parts by mass of the silica filaments (F19) containing 70 parts by mass of filler. Using the obtained resin varnish, a laminated film having a stretchable resin film was obtained in the same manner as in Example 1.
  • Example 5 Same as Example 1 except that the compounding amounts of silica filamentous (SE2050), dicyclopentadiene type epoxy resin (HP7200H) and 1-benzyl-2-methylimidazole (1B2MZ) were changed as shown in Table 1. Thus, a resin varnish was prepared. Using the obtained resin varnish, a laminated film having a stretchable resin film was obtained in the same manner as in Example 1.
  • Comparative Example 1 100 parts by weight of maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer (FG1924GT), 25 parts by weight of dicyclopentadiene type epoxy resin (HP7200H), and 3.75 parts by weight of 1-benzyl-2- Methylimidazole (1B2MZ) was mixed with 50 parts by mass of toluene, and the mixture was stirred to obtain a resin varnish. Using the obtained resin varnish, a laminated film having a stretchable resin film was obtained in the same manner as in Example 1.
  • Comparative Examples 2 and 3 Similar to Comparative Example 1 except that the blending amounts of maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer (FG1924GT) and dicyclopentadiene type epoxy resin (HP7200H) were changed as shown in Table 1. Thus, a resin varnish and a laminated film were obtained.
  • FG1924GT maleic anhydride-modified styrene-ethylenebutylene-styrene block copolymer elastomer
  • HP7200H dicyclopentadiene type epoxy resin
  • thermomechanical analysis TMA
  • Device SS6000 (Seiko Instruments Inc.) Sample size: 10 mm long x 3 mm width Load: 0.05 MPa Temperature: 0 to 120 ° C Temperature increase rate: 5 ° C / min
  • Tensile modulus A test piece of a stretchable resin film having a strip shape having a length of 40 mm and a width of 10 mm from which the carrier film and the protective film were removed was prepared. A tensile test of the test piece was performed using an autograph (Shimadzu Corporation “EZ-S”) to obtain a stress-strain curve. The tensile modulus at room temperature was determined from the obtained stress-strain curve. The tensile test was performed under the conditions of a distance between chucks of 20 mm and a tensile speed of 50 mm / min. The tensile elastic modulus was obtained from the slope of the stress-strain curve in the range of 0.5 to 1.0 N stress.
  • Tack value The protective film was removed from the laminated film, and the tack value of the exposed surface of the stretchable resin film was measured using a tacking tester (“TACII” manufactured by Reska Co., Ltd.). The measurement conditions were set to a constant load mode, an immersion speed of 120 mm / min, a test speed of 600 mm / min, a load of 100 gf, a load holding time of 1 second, and a temperature of 30 ° C. or 200 ° C.
  • Table 1 shows the blending amount of each component of the curable resin composition used to form the stretchable resin film and the evaluation results of the stretchable resin film.
  • the numerical value in the parenthesis regarding the filler in the table is the blending amount of the solid content (filler) in the slurry.
  • the stretchable resin films of the examples containing fillers have excellent stretchability, low thermal expansion coefficient, low tack at high temperature, and excellent handleability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2019/018440 2018-05-11 2019-05-08 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム WO2019216352A1 (ja)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080346A1 (ja) * 2014-11-18 2016-05-26 日立化成株式会社 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物
JP2017183328A (ja) * 2016-03-28 2017-10-05 住友ベークライト株式会社 電子装置および電子装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119410A (ja) 1998-10-16 2000-04-25 Nitto Denko Corp 高分子フィルム及び粘着シート
CA2474694A1 (en) * 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Resin composition_and products containing the same
JP5082373B2 (ja) * 2005-10-18 2012-11-28 日立化成工業株式会社 プリント配線板用樹脂組成物、プリプレグ、基板、金属箔張積層板、樹脂付金属箔及びプリント配線板
JP4864545B2 (ja) * 2006-05-26 2012-02-01 太陽ホールディングス株式会社 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法
CN102365310B (zh) * 2009-03-27 2013-11-20 日立化成工业株式会社 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板
JP2013187380A (ja) 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
WO2017026420A1 (ja) 2015-08-07 2017-02-16 太陽インキ製造株式会社 導電性組成物、導電体およびフレキシブルプリント配線板
JP6888262B2 (ja) 2016-09-30 2021-06-16 住友ベークライト株式会社 配線基板および電子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016080346A1 (ja) * 2014-11-18 2016-05-26 日立化成株式会社 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物
JP2017183328A (ja) * 2016-03-28 2017-10-05 住友ベークライト株式会社 電子装置および電子装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024014435A1 (ja) * 2022-07-12 2024-01-18 株式会社レゾナック 硬化性樹脂組成物、硬化性フィルム、及び、積層フィルム

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