JP7303788B2 - 基板処理装置及び方法 - Google Patents
基板処理装置及び方法 Download PDFInfo
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- JP7303788B2 JP7303788B2 JP2020172809A JP2020172809A JP7303788B2 JP 7303788 B2 JP7303788 B2 JP 7303788B2 JP 2020172809 A JP2020172809 A JP 2020172809A JP 2020172809 A JP2020172809 A JP 2020172809A JP 7303788 B2 JP7303788 B2 JP 7303788B2
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Description
1660 第2供給ユニット
1670 第1供給ユニット
Claims (17)
- 基板処理装置であって、
内部に処理空間を有する工程チャンバーと、
前記処理空間で基板を支持する支持ユニットと、
前記支持ユニットに提供されて前記基板を加熱する加熱ユニットと、
前記処理空間を排気する排気ユニットと、
前記処理空間に気体を供給する気体供給ユニットと、を含む基板処理装置であり、
前記気体供給ユニットは、
前記基板上に形成された液膜の厚さに基づいて決定された温度を有する気体を前記処理空間内に供給するように提供され、
前記基板上に形成された液膜の厚さに基づいて決定された温度は少なくとも2つの温度の中の1つの温度であり、
前記基板上に形成された液膜の厚さに基づいて決定された温度は第1温度及び第2温度を含み、
前記基板処理装置は、
第1温度の気体を前記処理空間に供給するように提供される第1供給ユニットと、
前記第1温度より高い第2温度の気体を前記処理空間に供給するように提供される第2供給ユニットと、を有する基板処理装置。 - 前記第1供給ユニットは、
前記処理空間に直接気体を吐出する第1供給管を含み、
前記第2供給ユニットは、
前記支持ユニットの上部に配置されるバッファ空間と、
前記バッファ空間から気体が伝達される吐出空間と、
前記バッファ空間に留まる気体を加熱するためのヒーターと、
前記バッファ空間に気体を吐出する第2供給管と、を含む請求項1に記載の基板処理装置。 - 前記第1供給ユニットは、
前記バッファ空間と前記吐出空間を貫通するように提供される請求項2に記載の基板処理装置。 - 前記第2供給ユニットは、
前記第2供給ユニットの内部空間をバッファ空間と吐出空間に区画し、第1ホールが形成された区画プレートと、
前記吐出空間内の気体を前記処理空間に吐出する第2ホールが形成された吐出プレートと、をさらに含み、
前記区画プレートは、前記基板の中央領域に対向されるように提供され、前記吐出プレートは、前記基板の全体領域に対向されるように提供される請求項2に記載の基板処理装置。 - 前記第1供給ユニットと前記第2供給ユニットの吐出口は、前記基板の中央領域に対向されるように提供される請求項1に記載の基板処理装置。
- 前記気体供給ユニットは、
前記基板上に形成された液膜の厚さを測定する測定装置と、
前記測定装置によって測定された前記基板の上の液膜の厚さ情報を受信し、前記気体供給ユニットを制御する制御器と、をさらに含む請求項1に記載の基板処理装置。 - 前記制御器は、
前記測定装置によって測定された前記基板上に形成された液膜の厚さ情報に基づいて、
前記基板の中央領域に形成された液膜の厚さが既設定値以上である場合、第2温度の前記気体を供給し、
前記基板の中央領域に形成された液膜の厚さが既設定値未満である場合、前記第1温度の気体を供給するように前記気体供給ユニットを制御する請求項6に記載の基板処理装置。 - 前記制御器は、
前記測定装置によって測定された前記基板上に形成された液膜の厚さ情報に基づいて、
前記基板の中央領域に形成された液膜の厚さが既設定値以上である場合、前記第2温度の気体を供給し、
前記基板の中央領域に形成された液膜の厚さが厚いほど、前記気体の流量を増加させ、
前記気体は、前記基板の中央領域に形成された液膜の厚さが既設定値に到達する時まで継続的に供給されるように前記気体供給ユニットを制御する請求項6に記載の基板処理装置。 - 前記制御器は、
前記測定装置によって測定された前記基板上に形成された液膜の厚さ情報に基づいて、
前記基板の中央領域に形成された液膜の厚さが既設定値未満である場合、前記第1温度の気体を供給し、
前記基板の中央領域に形成された液膜の厚さが薄いほど、前記気体の流量を増加させるように前記気体供給ユニットを制御する請求項6に記載の基板処理装置。 - 請求項1に記載の基板処理装置を利用する基板処理方法であって、
前記基板の中央領域に形成された液膜の厚さが既設定された厚さになるように前記処理空間に供給される気体の温度又は流量を制御する基板処理方法。 - 前記第2供給ユニットは、
前記支持ユニットの上部に配置されるバッファ空間と、
前記バッファ空間から気体が伝達される吐出空間と、
前記バッファ空間に留まる気体を加熱するためのヒーターと、
前記バッファ空間に気体を吐出する第2供給管と、を含む請求項10に記載の基板処理方法。 - 前記第1供給ユニットは、前記処理空間に直接気体を吐出する第1供給管を含む請求項10に記載の基板処理方法。
- 前記第1温度の気体は、前記基板の中央領域に対向される処理空間に供給される請求項10に記載の基板処理方法。
- 前記基板の中央領域に形成された液膜の厚さが既設定値以上である場合、前記第2温度の気体が供給され、
前記基板の中央領域に形成された液膜の厚さが既設定値未満である場合、前記第1温度の気体が供給される請求項10に記載の基板処理方法。 - 前記基板の中央領域に形成された液膜の厚さが既設定値以上である場合、前記第2温度の気体が供給され、
前記基板の中央領域に形成された液膜の厚さが厚いほど、前記気体の流量が増加し、
前記気体は、前記基板の中央領域に形成された液膜の厚さが既設定値に到達する時まで継続的に供給される請求項10に記載の基板処理方法。 - 前記基板の中央領域に形成された液膜の厚さが既設定値未満である場合、前記第1温度の気体が供給され、
前記基板の中央領域に形成された液膜の厚さが薄いほど、前記気体の流量が増加する請求項10に記載の基板処理方法。 - 処理空間内でフォトレジストの液膜が塗布された基板を加熱して前記液膜でソルベントを蒸発させる熱処理工程を遂行することを含む基板処理方法であって、前記熱処理工程は前記処理空間に気体を供給した状態でヒーターで前記基板を加熱し、前記基板を熱処理する間に前記基板上に形成された液膜の厚さに基づいて前記処理空間に供給される気体の温度又は流量が変更され、
前記基板の中央領域に形成された液膜の厚さが既設定値以上である場合、前記処理空間に供給される気体の温度が高められ、
前記基板の中央領域に形成された液膜の厚さが既設定値未満である場合、前記処理空間に供給される気体の温度が下げられ、
前記基板の中央領域に形成された液膜の厚さが既設定値から多く逸脱するほど、前記処理空間に供給される気体の流量が増加する基板処理方法。
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