JP7298786B2 - プリント配線基板用積層体および多層プリント配線基板用接合体 - Google Patents

プリント配線基板用積層体および多層プリント配線基板用接合体 Download PDF

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Publication number
JP7298786B2
JP7298786B2 JP2022562936A JP2022562936A JP7298786B2 JP 7298786 B2 JP7298786 B2 JP 7298786B2 JP 2022562936 A JP2022562936 A JP 2022562936A JP 2022562936 A JP2022562936 A JP 2022562936A JP 7298786 B2 JP7298786 B2 JP 7298786B2
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Japan
Prior art keywords
printed wiring
wiring board
adhesive layer
base material
metal foil
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JP2022562936A
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Japanese (ja)
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JPWO2022211042A1 (https=
JPWO2022211042A5 (https=
Inventor
誠一 善見
順哉 中坪
茂樹 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Publication of JPWO2022211042A1 publication Critical patent/JPWO2022211042A1/ja
Publication of JPWO2022211042A5 publication Critical patent/JPWO2022211042A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022562936A 2021-03-31 2022-03-31 プリント配線基板用積層体および多層プリント配線基板用接合体 Active JP7298786B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021060003 2021-03-31
JP2021060003 2021-03-31
PCT/JP2022/016605 WO2022211042A1 (ja) 2021-03-31 2022-03-31 プリント配線基板用積層体および多層プリント配線基板用接合体

Publications (3)

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JPWO2022211042A1 JPWO2022211042A1 (https=) 2022-10-06
JPWO2022211042A5 JPWO2022211042A5 (https=) 2023-03-01
JP7298786B2 true JP7298786B2 (ja) 2023-06-27

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JP2022562936A Active JP7298786B2 (ja) 2021-03-31 2022-03-31 プリント配線基板用積層体および多層プリント配線基板用接合体

Country Status (3)

Country Link
JP (1) JP7298786B2 (https=)
TW (1) TW202246053A (https=)
WO (1) WO2022211042A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136631A (ja) 2001-11-02 2003-05-14 Kanegafuchi Chem Ind Co Ltd フレキシブル銅張積層板
JP2005167172A (ja) 2003-11-14 2005-06-23 Hitachi Chem Co Ltd プリント配線板及びその製造方法
JP2006210524A (ja) 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 多層回路基板及びその製造方法
JP2011100846A (ja) 2009-11-05 2011-05-19 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板とその製造方法、２層フレキシブル配線板とその製造方法並びにプラズマ処理装置
JP2015115334A (ja) 2013-12-09 2015-06-22 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
WO2017029973A1 (ja) 2015-08-17 2017-02-23 住友電気工業株式会社 プリント配線板及び電子部品
JP2018041961A (ja) 2016-09-05 2018-03-15 荒川化学工業株式会社 フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
JP2019029340A (ja) 2017-07-28 2019-02-21 旭化成株式会社 導電性パターンの製造方法、及びプラズマ処理装置
JP2019075486A (ja) 2017-10-18 2019-05-16 セイコーインスツル株式会社 配線基板用テープ基材、及び配線基板用テープ基材の製造方法
WO2019188087A1 (ja) 2018-03-30 2019-10-03 三井金属鉱業株式会社 銅張積層板
WO2020066145A1 (ja) 2018-09-28 2020-04-02 日東電工株式会社 低誘電基板材

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136631A (ja) 2001-11-02 2003-05-14 Kanegafuchi Chem Ind Co Ltd フレキシブル銅張積層板
JP2005167172A (ja) 2003-11-14 2005-06-23 Hitachi Chem Co Ltd プリント配線板及びその製造方法
JP2006210524A (ja) 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 多層回路基板及びその製造方法
JP2011100846A (ja) 2009-11-05 2011-05-19 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板とその製造方法、２層フレキシブル配線板とその製造方法並びにプラズマ処理装置
JP2015115334A (ja) 2013-12-09 2015-06-22 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
WO2017029973A1 (ja) 2015-08-17 2017-02-23 住友電気工業株式会社 プリント配線板及び電子部品
JP2018041961A (ja) 2016-09-05 2018-03-15 荒川化学工業株式会社 フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
JP2019029340A (ja) 2017-07-28 2019-02-21 旭化成株式会社 導電性パターンの製造方法、及びプラズマ処理装置
JP2019075486A (ja) 2017-10-18 2019-05-16 セイコーインスツル株式会社 配線基板用テープ基材、及び配線基板用テープ基材の製造方法
WO2019188087A1 (ja) 2018-03-30 2019-10-03 三井金属鉱業株式会社 銅張積層板
WO2020066145A1 (ja) 2018-09-28 2020-04-02 日東電工株式会社 低誘電基板材

Also Published As

Publication number Publication date
JPWO2022211042A1 (https=) 2022-10-06
TW202246053A (zh) 2022-12-01
WO2022211042A1 (ja) 2022-10-06

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