JP7424601B2 - 積層体、樹脂フィルム、及び積層体の製造方法 - Google Patents
積層体、樹脂フィルム、及び積層体の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 title claims description 17
- 239000011347 resin Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 16
- 239000011888 foil Substances 0.000 claims description 75
- 229910052751 metal Inorganic materials 0.000 claims description 74
- 239000002184 metal Substances 0.000 claims description 74
- 238000009832 plasma treatment Methods 0.000 claims description 56
- 230000003746 surface roughness Effects 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 17
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 description 84
- 229920003002 synthetic resin Polymers 0.000 description 84
- 230000000052 comparative effect Effects 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 239000011889 copper foil Substances 0.000 description 20
- 238000012545 processing Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 15
- 229920000106 Liquid crystal polymer Polymers 0.000 description 14
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 14
- 239000004734 Polyphenylene sulfide Substances 0.000 description 12
- 229920000069 polyphenylene sulfide Polymers 0.000 description 12
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 6
- 238000007719 peel strength test Methods 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 4
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002459 sustained effect Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- JCJUKCIXTRWAQY-UHFFFAOYSA-N 6-hydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=CC=CC2=C1 JCJUKCIXTRWAQY-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Description
Claims (4)
- フィルム状に成形されたフッ素樹脂層と、前記フッ素樹脂層の接合面に接着剤を用いずに直接接合された金属箔とを含んで構成される積層体であって、
前記金属箔の接合面は、表面粗度Rzが1.2μm以下の平滑面であり、
前記フッ素樹脂層の接合面は、真空プラズマ処理が施された真空プラズマ処理面とされており、かつ、真空プラズマ処理後の表面の炭素原子、酸素原子の原子数の組成比の値(O/C)が、0.05以上、0.20以下となっている積層体。 - 前記金属箔の接合面は、表面粗度Rzが、0.05μm以上、1.2μm以下の平滑面である、
請求項1に記載の積層体。 - フッ素樹脂層を有してフィルム状に形成され、前記フッ素樹脂層の表面の炭素原子、酸素原子の原子数の組成比の値(O/C)が、0.05以上、0.20以下となっている、
樹脂フィルム。 - フィルム状に成形されたフッ素樹脂層と、前記フッ素樹脂層の接合面に接着剤を用いずに直接接合された金属箔とを含んで構成される積層体を製造する製造方法であって、
前記フッ素樹脂層の接合面に対し、含酸素ガス雰囲気で真空プラズマ処理を施して前記真空プラズマ処理後の表面の炭素原子、酸素原子の原子数の組成比の値(O/C)を0.05以上、0.20以下にする真空プラズマ処理工程と、
前記真空プラズマ処理工程後の前記フッ素樹脂層と前記金属箔とを重ね合せて、加熱、加圧することにより、接着剤を用いずに直接接合する接合工程とを含み、
前記金属箔の接合面は、表面粗度Rzが1.2μm以下の平滑面とされている積層体の製造方法。
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JP2017164905A (ja) | 2016-03-14 | 2017-09-21 | 昭和電工株式会社 | ノルボルネン化合物付加重合体と金属箔との積層フィルム |
WO2019008876A1 (ja) | 2017-07-07 | 2019-01-10 | Agc株式会社 | 積層体の製造方法、積層体及びフレキシブルプリント基板の製造方法 |
JP2019018493A (ja) | 2017-07-20 | 2019-02-07 | 株式会社沖データ | 検出装置および画像形成装置 |
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JP2805882B2 (ja) * | 1989-08-31 | 1998-09-30 | 東レ株式会社 | 積層体 |
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JP2017164905A (ja) | 2016-03-14 | 2017-09-21 | 昭和電工株式会社 | ノルボルネン化合物付加重合体と金属箔との積層フィルム |
WO2019008876A1 (ja) | 2017-07-07 | 2019-01-10 | Agc株式会社 | 積層体の製造方法、積層体及びフレキシブルプリント基板の製造方法 |
JP2019018493A (ja) | 2017-07-20 | 2019-02-07 | 株式会社沖データ | 検出装置および画像形成装置 |
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