TW202246053A - 印刷電路板用積層體及多層印刷電路板用接合體 - Google Patents
印刷電路板用積層體及多層印刷電路板用接合體 Download PDFInfo
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- TW202246053A TW202246053A TW111112478A TW111112478A TW202246053A TW 202246053 A TW202246053 A TW 202246053A TW 111112478 A TW111112478 A TW 111112478A TW 111112478 A TW111112478 A TW 111112478A TW 202246053 A TW202246053 A TW 202246053A
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021060003 | 2021-03-31 | ||
| JP2021-060003 | 2021-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202246053A true TW202246053A (zh) | 2022-12-01 |
Family
ID=83456643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111112478A TW202246053A (zh) | 2021-03-31 | 2022-03-31 | 印刷電路板用積層體及多層印刷電路板用接合體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7298786B2 (https=) |
| TW (1) | TW202246053A (https=) |
| WO (1) | WO2022211042A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136631A (ja) * | 2001-11-02 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | フレキシブル銅張積層板 |
| JP2005167172A (ja) * | 2003-11-14 | 2005-06-23 | Hitachi Chem Co Ltd | プリント配線板及びその製造方法 |
| JP4291279B2 (ja) * | 2005-01-26 | 2009-07-08 | パナソニック株式会社 | 可撓性多層回路基板 |
| JP2011100846A (ja) * | 2009-11-05 | 2011-05-19 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板とその製造方法、２層フレキシブル配線板とその製造方法並びにプラズマ処理装置 |
| JP2015115334A (ja) * | 2013-12-09 | 2015-06-22 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| JP6696989B2 (ja) * | 2015-08-17 | 2020-05-20 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
| TWI754668B (zh) * | 2016-09-05 | 2022-02-11 | 日商荒川化學工業股份有限公司 | 可撓性印刷線路板用覆銅積層板及可撓性印刷線路板 |
| JP6736610B2 (ja) * | 2017-07-28 | 2020-08-05 | 旭化成株式会社 | 導電性パターンの製造方法 |
| JP6986926B2 (ja) * | 2017-10-18 | 2021-12-22 | セイコーインスツル株式会社 | 配線基板用テープ基材、及び配線基板用テープ基材の製造方法 |
| KR20200118144A (ko) * | 2018-03-30 | 2020-10-14 | 미쓰이금속광업주식회사 | 동장 적층판 |
| JP7178852B2 (ja) * | 2018-09-28 | 2022-11-28 | 日東電工株式会社 | 低誘電基板材 |
-
2022
- 2022-03-31 JP JP2022562936A patent/JP7298786B2/ja active Active
- 2022-03-31 TW TW111112478A patent/TW202246053A/zh unknown
- 2022-03-31 WO PCT/JP2022/016605 patent/WO2022211042A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022211042A1 (https=) | 2022-10-06 |
| WO2022211042A1 (ja) | 2022-10-06 |
| JP7298786B2 (ja) | 2023-06-27 |
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