JPWO2022211042A1 - - Google Patents
Info
- Publication number
- JPWO2022211042A1 JPWO2022211042A1 JP2022562936A JP2022562936A JPWO2022211042A1 JP WO2022211042 A1 JPWO2022211042 A1 JP WO2022211042A1 JP 2022562936 A JP2022562936 A JP 2022562936A JP 2022562936 A JP2022562936 A JP 2022562936A JP WO2022211042 A1 JPWO2022211042 A1 JP WO2022211042A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021060003 | 2021-03-31 | ||
| JP2021060003 | 2021-03-31 | ||
| PCT/JP2022/016605 WO2022211042A1 (ja) | 2021-03-31 | 2022-03-31 | プリント配線基板用積層体および多層プリント配線基板用接合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022211042A1 true JPWO2022211042A1 (https=) | 2022-10-06 |
| JPWO2022211042A5 JPWO2022211042A5 (https=) | 2023-03-01 |
| JP7298786B2 JP7298786B2 (ja) | 2023-06-27 |
Family
ID=83456643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022562936A Active JP7298786B2 (ja) | 2021-03-31 | 2022-03-31 | プリント配線基板用積層体および多層プリント配線基板用接合体 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7298786B2 (https=) |
| TW (1) | TW202246053A (https=) |
| WO (1) | WO2022211042A1 (https=) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136631A (ja) * | 2001-11-02 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | フレキシブル銅張積層板 |
| JP2005167172A (ja) * | 2003-11-14 | 2005-06-23 | Hitachi Chem Co Ltd | プリント配線板及びその製造方法 |
| JP2006210524A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 多層回路基板及びその製造方法 |
| JP2011100846A (ja) * | 2009-11-05 | 2011-05-19 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板とその製造方法、２層フレキシブル配線板とその製造方法並びにプラズマ処理装置 |
| JP2015115334A (ja) * | 2013-12-09 | 2015-06-22 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| WO2017029973A1 (ja) * | 2015-08-17 | 2017-02-23 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
| JP2018041961A (ja) * | 2016-09-05 | 2018-03-15 | 荒川化学工業株式会社 | フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板 |
| JP2019029340A (ja) * | 2017-07-28 | 2019-02-21 | 旭化成株式会社 | 導電性パターンの製造方法、及びプラズマ処理装置 |
| JP2019075486A (ja) * | 2017-10-18 | 2019-05-16 | セイコーインスツル株式会社 | 配線基板用テープ基材、及び配線基板用テープ基材の製造方法 |
| WO2019188087A1 (ja) * | 2018-03-30 | 2019-10-03 | 三井金属鉱業株式会社 | 銅張積層板 |
| WO2020066145A1 (ja) * | 2018-09-28 | 2020-04-02 | 日東電工株式会社 | 低誘電基板材 |
-
2022
- 2022-03-31 JP JP2022562936A patent/JP7298786B2/ja active Active
- 2022-03-31 TW TW111112478A patent/TW202246053A/zh unknown
- 2022-03-31 WO PCT/JP2022/016605 patent/WO2022211042A1/ja not_active Ceased
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136631A (ja) * | 2001-11-02 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | フレキシブル銅張積層板 |
| JP2005167172A (ja) * | 2003-11-14 | 2005-06-23 | Hitachi Chem Co Ltd | プリント配線板及びその製造方法 |
| JP2006210524A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 多層回路基板及びその製造方法 |
| JP2011100846A (ja) * | 2009-11-05 | 2011-05-19 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板とその製造方法、２層フレキシブル配線板とその製造方法並びにプラズマ処理装置 |
| JP2015115334A (ja) * | 2013-12-09 | 2015-06-22 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| WO2017029973A1 (ja) * | 2015-08-17 | 2017-02-23 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
| JP2018041961A (ja) * | 2016-09-05 | 2018-03-15 | 荒川化学工業株式会社 | フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板 |
| JP2019029340A (ja) * | 2017-07-28 | 2019-02-21 | 旭化成株式会社 | 導電性パターンの製造方法、及びプラズマ処理装置 |
| JP2019075486A (ja) * | 2017-10-18 | 2019-05-16 | セイコーインスツル株式会社 | 配線基板用テープ基材、及び配線基板用テープ基材の製造方法 |
| WO2019188087A1 (ja) * | 2018-03-30 | 2019-10-03 | 三井金属鉱業株式会社 | 銅張積層板 |
| WO2020066145A1 (ja) * | 2018-09-28 | 2020-04-02 | 日東電工株式会社 | 低誘電基板材 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202246053A (zh) | 2022-12-01 |
| WO2022211042A1 (ja) | 2022-10-06 |
| JP7298786B2 (ja) | 2023-06-27 |
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