JP7298518B2 - 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 - Google Patents

樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 Download PDF

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Publication number
JP7298518B2
JP7298518B2 JP2020038998A JP2020038998A JP7298518B2 JP 7298518 B2 JP7298518 B2 JP 7298518B2 JP 2020038998 A JP2020038998 A JP 2020038998A JP 2020038998 A JP2020038998 A JP 2020038998A JP 7298518 B2 JP7298518 B2 JP 7298518B2
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resin composition
group
component
resin
carbon atoms
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JP2020038998A
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Japanese (ja)
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JP2021138873A (ja
Inventor
恒太 鳥居
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2020038998A priority Critical patent/JP7298518B2/ja
Priority to TW110106065A priority patent/TW202146576A/zh
Priority to KR1020210028402A priority patent/KR20210113077A/ko
Priority to CN202110233964.0A priority patent/CN113354936B/zh
Publication of JP2021138873A publication Critical patent/JP2021138873A/ja
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Publication of JP7298518B2 publication Critical patent/JP7298518B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020038998A 2020-03-06 2020-03-06 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 Active JP7298518B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020038998A JP7298518B2 (ja) 2020-03-06 2020-03-06 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
TW110106065A TW202146576A (zh) 2020-03-06 2021-02-22 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板及半導體裝置
KR1020210028402A KR20210113077A (ko) 2020-03-06 2021-03-03 수지 조성물, 수지 조성물의 경화물, 수지 시트, 프린트 배선판 및 반도체 장치
CN202110233964.0A CN113354936B (zh) 2020-03-06 2021-03-03 树脂组合物、树脂组合物的固化物、树脂片材、印刷布线板及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020038998A JP7298518B2 (ja) 2020-03-06 2020-03-06 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置

Publications (2)

Publication Number Publication Date
JP2021138873A JP2021138873A (ja) 2021-09-16
JP7298518B2 true JP7298518B2 (ja) 2023-06-27

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JP2020038998A Active JP7298518B2 (ja) 2020-03-06 2020-03-06 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置

Country Status (4)

Country Link
JP (1) JP7298518B2 (ko)
KR (1) KR20210113077A (ko)
CN (1) CN113354936B (ko)
TW (1) TW202146576A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7251681B1 (ja) 2022-01-13 2023-04-04 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物、スラリー、フィルム、プリプレグ、積層板及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000026553A (ja) 1998-05-08 2000-01-25 Toagosei Co Ltd 硬化性組成物
JP2010138364A (ja) 2008-02-12 2010-06-24 Mitsubishi Gas Chemical Co Inc 樹脂組成物、プリプレグおよび金属箔張り積層板
JP2011241343A (ja) 2010-05-20 2011-12-01 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2020158705A (ja) 2019-03-27 2020-10-01 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63146960A (ja) * 1986-12-10 1988-06-18 Japan Synthetic Rubber Co Ltd 熱可塑性樹脂組成物
JP3513543B2 (ja) * 1994-11-21 2004-03-31 テクノポリマー株式会社 熱可塑性樹脂組成物
JP6550872B2 (ja) * 2015-04-03 2019-07-31 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
CN110402269B (zh) * 2017-03-13 2022-05-03 琳得科株式会社 树脂组合物及树脂片
JP6992333B2 (ja) 2017-09-06 2022-01-13 味の素株式会社 樹脂組成物
KR102024991B1 (ko) 2017-09-26 2019-11-04 한양대학교 산학협력단 이동체 기기 및 이의 데이터 전송 방법
JP6911806B2 (ja) * 2018-03-29 2021-07-28 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000026553A (ja) 1998-05-08 2000-01-25 Toagosei Co Ltd 硬化性組成物
JP2010138364A (ja) 2008-02-12 2010-06-24 Mitsubishi Gas Chemical Co Inc 樹脂組成物、プリプレグおよび金属箔張り積層板
JP2011241343A (ja) 2010-05-20 2011-12-01 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2020158705A (ja) 2019-03-27 2020-10-01 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置

Also Published As

Publication number Publication date
KR20210113077A (ko) 2021-09-15
TW202146576A (zh) 2021-12-16
JP2021138873A (ja) 2021-09-16
CN113354936B (zh) 2024-04-12
CN113354936A (zh) 2021-09-07

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