JP2020158705A - 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 - Google Patents
樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 Download PDFInfo
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- JP2020158705A JP2020158705A JP2019061616A JP2019061616A JP2020158705A JP 2020158705 A JP2020158705 A JP 2020158705A JP 2019061616 A JP2019061616 A JP 2019061616A JP 2019061616 A JP2019061616 A JP 2019061616A JP 2020158705 A JP2020158705 A JP 2020158705A
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Classifications
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Abstract
Description
[1] (A)マレイミド化合物、(B)アリル基含有ベンゾオキサジン化合物、及び(C)高分子量成分を含む、樹脂組成物。
[2] (A)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、10質量%以上40質量%以下である、[1]に記載の樹脂組成物。
[3] (B)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、0.01質量%以上15質量%以下である、[1]又は[2]に記載の樹脂組成物。
[4] (A)成分に対する(B)成分の質量比[(B)成分/(A)成分]が、0.01以上0.20以下である、[1]〜[3]のいずれかに記載の樹脂組成物。
[5] (C)成分が、熱可塑性樹脂である、[1]〜[4]のいずれかに記載の樹脂組成物。
[6] 熱可塑性樹脂が、ポリイミド樹脂、ポリカーボネート樹脂及びフェノキシ樹脂から選ばれる少なくとも1種である、[5]に記載の樹脂組成物。
[7] (C)成分の重量平均分子量又は数平均分子量が5000以上100000以下である、[1]〜[6]のいずれかに記載の樹脂組成物。
[8] (C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、0.1質量%以上10質量%以下である、[1]〜[7]のいずれかに記載の樹脂組成物。
[9] (D)無機充填材をさらに含む、[1]〜[8]のいずれかに記載の樹脂組成物。
[10] (D)成分が、アミン系カップリング剤又は(メタ)アクリル系カップリング剤で表面処理されている、[9]に記載の樹脂組成物。
[11] (D)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、50質量%以上である、[9]又は[10]に記載の樹脂組成物。
[12] 200℃で90分間熱処理して得られる硬化物を、空洞共振摂動法により測定周波数5.8GHz及び測定温度23℃の条件で測定した場合の誘電正接が0.005以下である、[1]〜[11]のいずれかに記載の樹脂組成物。
[13] 200℃で90分間熱処理して得られる硬化物を、日本工業規格JIS K7127に準拠して測定した場合の破断点伸度が0.7%以上である、[1]〜[12]のいずれかに記載の樹脂組成物。
[14] 絶縁層形成用である、[1]〜[13]のいずれかに記載の樹脂組成物。
[15] 導体層を形成するための絶縁層形成用である、[1]〜[14]のいずれかに記載の樹脂組成物。
[16] [1]〜[15]のいずれかに記載の樹脂組成物の硬化物。
[17] 支持体と、該支持体上に設けられた、[1]〜[15]のいずれかに記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
[18] [1]〜[15]のいずれかに記載の樹脂組成物の硬化物又は[16]に記載の硬化物により形成された絶縁層を含む、プリント配線板。
[19] [18]に記載のプリント配線板を含む、半導体装置。
本発明の樹脂組成物は、(A)マレイミド化合物、(B)置換又は非置換のアリル基を含有するアリル基含有ベンゾオキサジン化合物、及び(C)高分子量成分を含む。本発明の樹脂組成物は、(A)〜(C)成分を含むことで、誘電正接の値が小さく、耐環境試験後における導電性材料と間の密着性に優れ、かつ、脆さが改善された硬化物をもたらすことができる。
樹脂組成物は、(A)成分としてマレイミド化合物を含有する。(A)成分を樹脂組成物に含有させることで、誘電正接の値が小さい硬化物を得ることが可能となる。(A)成分は1種単独で用いてもよく、2種以上を併用してもよい。
樹脂組成物は、(B)成分としてアリル基含有ベンゾオキサジン化合物を含む。アリル基含有ベンゾオキサジン化合物とは、置換又は非置換のアリル基を含有するベンゾオキサジン化合物をいう。ベンゾオキサジン化合物とは、後記のベンゾオキサジン環を有する化合物をいう。アリル基含有ベンゾオキサジン化合物は、アリル基の反応性及びベンゾオキサジン環の反応性によって、樹脂組成物を熱硬化させる硬化剤として機能する。(B)成分を樹脂組成物に含有させることで、耐環境試験後における導電性材料との間の密着性に優れる硬化物を得ることが可能となる。また、(B)成分を後記(C)成分とともに樹脂組成物に含有させることにより、耐環境試験後における導電性材料との間の密着性にさらに優れ、かつ改善された脆さを有する硬化物を得ることが可能となる。(B)成分は1種単独で用いてもよく、2種以上を併用してもよい。
樹脂組成物は、(C)成分として高分子量成分を含有する。(C)成分を樹脂組成物に含有させることで、樹脂組成物の応力が緩和され、その結果、(A)成分によって得られる硬化物の誘電正接の小さい値を維持しつつ、改善された脆さを有する硬化物を得ることが可能となる。また、(C)成分を(B)成分とともに樹脂組成物に含有させることにより、耐環境試験後における導電性材料との間の密着性にさらに優れ、かつさらに改善された脆さを有する硬化物を得ることが可能となる。(C)成分は1種単独で用いてもよく、2種以上を併用してもよい。
R31及びR32は、それぞれ独立して、ハロゲン原子、シアノ基、ニトロ基、又は−X33−R33を示し、
X33は、それぞれ独立して、単結合、−NR33’−、−O−、−S−、−CO−、−SO2−、−NR33’CO−、−CONR33’−、−OCO−、又は−COO−を示し、
R33は、それぞれ独立して、置換又は無置換のアルキル基、又は置換又は無置換のアルケニル基を示し、
R33’は、それぞれ独立して、水素原子、置換又は無置換のアルキル基、又は置換又は無置換のアルケニル基を示し、
Yは、単結合、或いは炭素原子、酸素原子、硫黄原子及び窒素原子から選ばれる1〜100個の骨格原子を有するリンカー構造を示し、
n10及びm10は、それぞれ独立して、0〜3の整数を示す。]
で表される化合物が挙げられる。
(C)成分100mg、分散剤(関東化学社製「N−メチルピロリドン」)5gをバイアル瓶に秤取り、超音波にて20分間分散し、続いて、メンブレンフィルター(東洋濾紙社製「アドバンテック」、0.5μmカット)を使用して濾過を行った後、ゲル浸透クロマトグラフ測定装置(昭光サイエンティフィック社製「Shodex GPC−101」)を使用して、数平均分子量(Mn)の算出を行う。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(D)成分として無機充填材を含有していてもよい。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(E)成分として重合開始剤を含んでいてもよい。(E)成分は1種類単独で用いてもよく、又は2種類以上を併用してもよい。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(F)成分として熱硬化性樹脂を含有していてもよい。但し、(F)成分は、(A)成分、(B)成分及び(C)成分のいずれか1つに該当するものは除かれる。熱硬化性樹脂とは、熱硬化可能な樹脂をいう。ここで、熱硬化可能な化合物には、自身が熱硬化により重合可能な化合物、本発明の樹脂組成物に含まれる成分に対して反応性を有する化合物、本発明の樹脂組成物に含まれる成分の反応性に応じて当該成分と反応可能な化合物が包含される。
樹脂組成物は、上述した成分以外に、任意の成分として、更にその他の添加剤を含んでいてもよい。このような添加剤としては、例えば、増粘剤、消泡剤、レベリング剤、密着性付与剤等の樹脂添加剤、硬化促進剤などが挙げられる。これらの添加剤は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。それぞれの含有量は当業者であれば適宜設定できる。
本発明の樹脂組成物の調製方法は、特に限定されるものではなく、例えば、配合成分を、必要により溶媒等を添加し、回転ミキサーなどを用いて混合・分散する方法などが挙げられる。樹脂組成物は、例えば溶剤を含むことにより、樹脂ワニスとして得ることができる。
樹脂組成物は、(A)マレイミド化合物、(B)置換又は非置換のアリル基を含有するアリル基含有ベンゾオキサジン化合物、及び(C)高分子量成分を含む。これらの成分を組み合わせて用いることで、誘電正接の値が小さく、耐環境試験後における導電性材料と間の密着性に優れ、かつ、脆さが改善された硬化物を得ることができる。すでに上記したが、一般に、マレイミド化合物を含有する樹脂組成物の硬化物は誘電正接の値が小さい。しかし、マレイミド化合物は通常軟化点が高いため、マレイミド化合物を含有する樹脂組成物の硬化物は脆い傾向にある。また、マレイミド化合物を含有する樹脂組成物の硬化物は、耐環境試験の後において、特にはHAST(Highly Accelerated temperature and humidity Stress Test)後において、密着性に劣る傾向にある。しかし、(A)成分を含有する樹脂組成物に対し(B)アリル基含有ベンゾオキサジン化合物及び(C)高分子量成分を含有させることで、実施例において例証されたように、(A)成分を含有することで得られる誘電正接の小さい値を維持しつつ、耐環境試験後における導電性材料と間の密着性に優れ、かつ、脆さが改善された硬化物を得ることができる。これは、樹脂組成物中に、(A)成分と反応可能なアリル基及びベンゾオキサジン環を同一分子中に組み合わせて含む(B)成分が存在することで、架橋構造体を(C)成分を取り込んだ状態で形成することができ、当該架橋構造体が耐環境試験(例えばHAST試験)にパスする構造を有する結果、本発明の所期の効果を奏することが可能になったと推察される。ここで、脆さの改善については、(C)高分子量成分が存在することで硬化物(架橋構造)内の応力を緩和できるようになったことも一因であり、これにより、密着性の向上及び耐環境試験性(耐HAST性)の向上にも寄与したと考えられる。
(1)基材に仮固定フィルムを積層する工程、
(2)半導体チップを、仮固定フィルム上に仮固定する工程、
(3)半導体チップ上に封止層を形成する工程、
(4)基材及び仮固定フィルムを半導体チップから剥離する工程、
(5)半導体チップの基材及び仮固定フィルムを剥離した面に、絶縁層としての再配線形成層を形成する工程、及び
(6)再配線形成層上に、導体層としての再配線層を形成する工程
本発明の樹脂シートは、支持体と、該支持体上に設けられた、本発明の樹脂組成物を含む樹脂組成物層を含む。
本発明のプリント配線板は、本発明の樹脂組成物の硬化物により形成された絶縁層を含む。
(I)内層基板上に、樹脂シートの樹脂組成物層が内層基板と接合するように積層する工程
(II)樹脂組成物層を熱硬化して絶縁層を形成する工程
本発明の半導体装置は、本発明のプリント配線板を含む。本発明の半導体装置は、本発明のプリント配線板を用いて製造することができる。
高分子量成分としてのポリイミド樹脂を含むワニスを以下のようにして調製した。
還流冷却器を連結した水分定量受器、窒素導入管、及び攪拌器を備えた、500mLのセパラブルフラスコを用意した。このフラスコに、4,4’−オキシジフタル酸無水物(ODPA)20.3g、γ−ブチロラクトン200g、トルエン20g、及び、5−(4−アミノフェノキシ)−3−[4−(4−アミノフェノキシ)フェニル]−1,1,3−トリメチルインダン29.6gを加えて、窒素気流下で45℃にて2時間攪拌して反応を行い、反応溶液を得た。
(樹脂組成物を含む樹脂ワニスAの調製)
マレイミド化合物としての日本化薬社製ビフェニルアラルキル型マレイミド樹脂「MIR−3000−70MT」(マレイミド基当量:275g/eq.、不揮発分70%のMEK/トルエン混合溶液)(以下、「マレイミド化合物A含有溶液」ともいう)100部、合成例1にて得た高分子量成分としてのポリイミド樹脂を20質量%含むワニス(以下、「高分子量成分A含有ワニス」ともいう)30部、トルエン15部、メチルエチルケトン(MEK)15部、アリル基含有ベンゾオキサジン化合物としての四国化成工業社製「ALP−d」(非置換のアリル基を含有するアリル基含有ベンゾオキサジン化合物;開環反応関与基当量:257g/eq.、アリル基当量:257g/eq.)の不揮発成分50%のMEK溶液(以下、「アリル基含有ベンゾオキサジン化合物A含有溶液」ともいう)4部、重合開始剤としての日油社製「パーヘキシル(登録商標)D」(以下、「重合開始剤A」ともいう)0.5部、及び、アミン系カップリング剤としての信越化学工業社製フェニルアミノシラン系カップリング剤「KBM573」で表面処理された無機充填材としてのアドマテックス社製球形シリカ「SO−C2」(以下、「無機充填材A」ともいう)135部を高速回転ミキサーで均一に分散して、樹脂組成物を含む樹脂ワニスAを得た。
無機充填材Aは、前述の測定方法にしたがって測定した平均粒径が0.5μmであり、前述の測定方法にしたがって測定した比表面積が5.9m2/gであった。
ポリエチレンテレフタレートフィルム(東レ社製「ルミラーR80」、厚み38μm、軟化点130℃)の一方の面に、アルキド樹脂系離型剤(リンテック社製「AL−5」)で離型処理を施すことにより、離型層を備えた支持体を用意した。
得られた樹脂シートAの樹脂組成物層を用いて、樹脂組成物の硬化物を、誘電正接の値、脆さ及び密着性の観点から後述する評価方法に従って評価した。
マレイミド化合物としての大和化成工社製ポリフェニルメタンマレイミド「BMI−2300」(マレイミド基当量186g/eq.)(以下、「マレイミド化合物B」ともいう)70部、及び、高分子量成分としての三菱ガス化学社製ポリカーボネート樹脂「FPC2136」(重量平均分子量30000、数平均分子量20895)(以下、「高分子量成分B」ともいう)6部を、トルエン40部、MEK40部に撹拌しながら加熱溶解させた。得られた溶液を室温にまで冷却した後、この溶液にアリル基含有ベンゾオキサジン化合物A含有溶液4部、重合開始剤A0.5部、及び、(メタ)アクリル系カップリング剤としての信越化学工業社製メタクリル系カップリング剤「KBM503」で表面処理されたアドマテックス社製球形シリカ「SO−C2」(以下、「無機充填材B」ともいう)135部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。
無機充填材Bは、前述の測定方法にしたがって測定した平均粒径が0.5μmであり、前述の測定方法にしたがって測定した比表面積が5.9m2/gであった。
そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
高分子量成分B3部を、トルエン20部、MEK20部に撹拌しながら加熱溶解させた。得られた溶液を室温にまで冷却した後、マレイミド化合物A含有溶液100部、マレイミド化合物としてのデザイナーモレキュールズ社製液状ビスマレイミド「BMI−689」(マレイミド基当量345g/eq.)(以下、「マレイミド化合物C」ともいう)15部、アリル基含有ベンゾオキサジン化合物A含有溶液4部、重合開始剤A0.5部、及び、無機充填材A235部を、高速回転ミキサーで均一に分散して、樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
マレイミド化合物B70部を、トルエン40部、MEK40部に撹拌しながら加熱溶解させた。得られた溶液を室温にまで冷却した後、マレイミド化合物としてのデザイナーモレキュールズ社製液状ビスマレイミド「BMI−1500」(マレイミド基当量750g/eq.)(以下、「マレイミド化合物D」ともいう)15部、高分子量成分としての(三菱ケミカル社製フェノキシ樹脂「YX7553BH30」(重量平均分子量35000;不揮発成分30質量%のMEKとシクロヘキサノンの1:1溶液)(以下、「高分子量成分C含有溶液」ともいう)10部、アリル基含有ベンゾオキサジン化合物A含有溶液4部、重合開始剤A0.5部、及び、無機充填材A235部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
マレイミド化合物A含有溶液100部、トルエン20部、MEK20部、マレイミド化合物C15部、高分子量成分A含有ワニス15部、アリル基含有ベンゾオキサジン化合物A含有溶液20部、重合開始剤A0.5部、及び、無機充填材B235部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
マレイミド化合物A含有溶液100部、マレイミド化合物D15部、トルエン20部、MEK20部、高分子量成分A含有ワニス15部、アリル基含有ベンゾオキサジン化合物A含有溶液30部、重合開始剤A0.5部、及び、無機充填材A235部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
マレイミド化合物A含有溶液100部、マレイミド化合物C15部、トルエン20部、MEK20部、高分子量成分C含有溶液10部、アリル基含有ベンゾオキサジン化合物A含有溶液4部、重合開始剤A0.5部、無機充填材A235部、熱硬化性樹脂としてのDIC社製ナフタレン型エポキシ樹脂「HP4032SS」(エポキシ当量約144g/eq.)8部、熱硬化性樹脂としてのDIC社製活性エステル系硬化剤「HPC−8000−65T」(活性基当量約223g/eq.、不揮発成分65質量%のトルエン溶液)18.5部、及び、熱硬化性樹脂としての1−ベンジル−2−フェニルイミダゾール(1B2PZ)(不揮発成分20質量%のMEK溶液)1部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
マレイミド化合物A含有溶液100部、マレイミド化合物C15部、トルエン20部、MEK20部、高分子量成分A含有ワニス15部、アリル基含有ベンゾオキサジン化合物A含有溶液4部、重合開始剤A0.5部、無機充填材B235部、及び、熱硬化性樹脂としての三菱ガス化学社製ラジカル重合性化合物「OPE−2St」(数平均分子量1200)、不揮発分65質量%のトルエン溶液)50部を、高速回転ミキサーで均一に分散して樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
実施例1において、アリル基含有ベンゾオキサジン化合物A含有溶液4部を、(B’)成分としての四国化成工業社製「P−d」(マレイミド基と反応する官能基を持たないベンゾオキサジン化合物;開環反応関与基当量:217g/eq.、アリル基当量:0g/eq.)の不揮発成分50%のMEK溶液4部に変更した。
以上の事項以外は実施例1と同様にして、比較用樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
実施例1において、アリル基含有ベンゾオキサジン化合物A含有溶液4部を、(B”)成分としての大阪ソーダ社製オルトジアリルフタレート「ダイソーダップ(登録商標)モノマー」(分子量246;アリル基当量:123g/eq.)2部に変更した。
以上の事項以外は実施例1と同様にして、比較用樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
実施例1において、アリル基含有ベンゾオキサジン化合物A含有溶液4部を、(B’)成分としての四国化成工業社製「P−d」の不揮発成分50%のMEK溶液2部と、大阪ソーダ社製オルトジアリルフタレート「ダイソーダップ(登録商標)モノマー」(分子量246)1部に変更した。
以上の事項以外は実施例1と同様にして、比較用樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。
実施例1において、高分子量成分A含有ワニス20部を使用しなかった。
以上の事項以外は実施例1と同様にして、比較用樹脂組成物を含む樹脂ワニスAを得た。そして、樹脂ワニスAを用いて、実施例1と同様にして、樹脂シートAを得て、樹脂シートAの樹脂組成物層を実施例1と同様にして評価に供した。ただし、比較例4については、誘電正接の値及び脆さを評価することはできなかった。
上述した実施例及び比較例で得た樹脂シートAの樹脂組成物層を用いて、樹脂組成物層の硬化物を、誘電正接の値、脆さ及び密着性の観点から、下記の方法によって評価した。
密着性の評価は、以下の手順にて、銅箔引き剥がし強度を測定することにより行った。
<<評価基板の作製>>
(1)銅箔の下地処理
三井金属鉱山社製「3EC−III」(電界銅箔、35μm)の光沢面をメック社製「CZ8101」にて1μmエッチングして銅表面の粗化処理を行い、次いで防錆処理(CL8300)を施した。この銅箔をCZ銅箔という。さらに、130℃のオーブンで30分間加熱処理した。これにより、内層基板を得た。
内層回路を形成したガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板の厚さ0.4mm、パナソニック社製「R1515A」)の両面をメック社製「CZ8101」にて1μmエッチングして銅表面の粗化処理を行った。これにより、処理面を有するCZ銅箔を得た。
実施例及び比較例で作製した樹脂シートAから保護フィルムを剥がして、樹脂組成物層を露出させた。バッチ式真空加圧ラミネーター(ニッコー・マテリアルズ社製、2ステージビルドアップラミネーター「CVP700」)を用いて、樹脂組成物層が上記内層基板と接するように、内層基板の両面にラミネートした。積層は、30秒間減圧して気圧を13hPa以下に調整した後、120℃、圧力0.74MPaにて30秒間圧着させることにより実施した。次いで、100℃、圧力0.5MPaにて60秒間熱プレスを行った。その後、支持体を剥がし、樹脂組成物層を露出させた。
露出させた樹脂組成物層上に、CZ銅箔の処理面を、上記と同様の条件で、ラミネートした。そして、200℃、90分の硬化条件で樹脂組成物層を硬化して硬化物(絶縁層)を形成した。これにより、両面にCZ銅箔が積層された評価基板Aを得た。
作製した評価基板Aを150mm×30mmの小片に切断した。小片の銅箔部分に、カッターを用いて幅10mm、長さ100mmの部分の切込みをいれて、この一端を剥がして後記引っ張り試験機のつかみ具で掴み、室温(常温)中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重[kgf/cm]を測定した。この測定の結果得られる荷重の値を「HAST前の銅箔引き剥がし強度」とする。測定には、引っ張り試験機(ティー・エス・イー社製オートコム万能試験機「AC−50C−SL」)を使用した。測定は日本工業規格JIS C6481に準拠して行った。結果を表1に示した。
作製した評価基板Aに対し、高度加速寿命試験装置(楠本化成社製「PM422」)を用いて、130℃、85%RHの高温高湿条件で100時間の加速環境試験を実施した。その後、HAST後の評価基板Aに上記と同様に切込みをいれて、上記の測定と同様に、切込みの一端を剥がして上記引っ張り試験機のつかみ具で掴み、室温(常温)中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重[kgf/cm]を測定した。この測定の結果得られる荷重の値を「HAST後の銅箔引き剥がし強度」とする。測定は日本工業規格JIS C6481に準拠して行った。結果を表1に示した。
誘電正接の評価は、以下の手順にて、その値を測定することにより行った。
<<評価用硬化物の作製>>
実施例及び比較例で作製した樹脂シートAから保護フィルムを剥がして、200℃にて90分間加熱して樹脂組成物層を熱硬化させた後、支持体を剥離することで、樹脂組成物の硬化物で形成された硬化物フィルムを得た。比較例4については硬化物フィルムが得られなかった。硬化物フィルムを、幅2mm、長さ80mmに切り出し、評価用硬化物Aを得た。
各評価用硬化物Aについて、アジレントテクノロジーズ社製「HP8362B」を用いて、空洞共振摂動法により測定周波数5.8GHz、測定温度23℃にて誘電正接の値(Df値)を測定した。3本の試験片について測定を行い、平均値を算出し、結果を表1に示した。
脆さの評価は、以下の手順にて、破断点伸度を測定することにより行った。
評価用硬化物Aについて、日本工業規格JIS K7127に準拠して、テンシロン万能試験機((株)オリエンテック製「RTC−1250A」)により引っ張り試験を行い、破断点伸度[%]を測定した。結果を表1に示した。
上述した実施例及び比較例の結果を、下記の表1に示す。下記の表1において、各成分の量は、不揮発成分換算量を表す。表1中の(C)成分の含有量及び(D)成分の含有量は、樹脂組成物中の不揮発成分を100質量%とした場合の百分率[質量%]を示す。
表1から分かるように、実施例と比較例の対比から、実施例においては、誘電正接の値が小さく、耐環境試験後における導電性材料と間の密着性に優れ、かつ、脆さが改善された硬化物を得ることができる樹脂組成物を提供できることが分かった。また、実施例に係る樹脂組成物当該樹脂組成物の硬化物;当該樹脂組成物を含む樹脂シート;当該樹脂組成物の硬化物により形成された絶縁層を含むプリント配線板、及び半導体装置を提供することも可能となることが分かった。
Claims (19)
- (A)マレイミド化合物、
(B)アリル基含有ベンゾオキサジン化合物、及び
(C)高分子量成分を含む、樹脂組成物。 - (A)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、10質量%以上40質量%以下である、請求項1に記載の樹脂組成物。
- (B)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、0.01質量%以上15質量%以下である、請求項1又は2に記載の樹脂組成物。
- (A)成分に対する(B)成分の質量比[(B)成分/(A)成分]が、0.01以上0.20以下である、請求項1〜3のいずれか1項に記載の樹脂組成物。
- (C)成分が、熱可塑性樹脂である、請求項1〜4のいずれか1項に記載の樹脂組成物。
- 熱可塑性樹脂が、ポリイミド樹脂、ポリカーボネート樹脂及びフェノキシ樹脂から選ばれる少なくとも1種である、請求項5に記載の樹脂組成物。
- (C)成分の重量平均分子量又は数平均分子量が5000以上100000以下である、請求項1〜6のいずれか1項に記載の樹脂組成物。
- (C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、0.1質量%以上10質量%以下である、請求項1〜7のいずれか1項に記載の樹脂組成物。
- (D)無機充填材をさらに含む、請求項1〜8のいずれか1項に記載の樹脂組成物。
- (D)成分が、アミン系カップリング剤又は(メタ)アクリル系カップリング剤で表面処理されている、請求項9に記載の樹脂組成物。
- (D)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、50質量%以上である、請求項9又は10に記載の樹脂組成物。
- 200℃で90分間熱処理して得られる硬化物を、空洞共振摂動法により測定周波数5.8GHz及び測定温度23℃の条件で測定した場合の誘電正接が0.005以下である、請求項1〜11のいずれか1項に記載の樹脂組成物。
- 200℃で90分間熱処理して得られる硬化物を、日本工業規格JIS K7127に準拠して測定した場合の破断点伸度が0.7%以上である、請求項1〜12のいずれか1項に記載の樹脂組成物。
- 絶縁層形成用である、請求項1〜13のいずれか1項に記載の樹脂組成物。
- 導体層を形成するための絶縁層形成用である、請求項1〜14のいずれか1項に記載の樹脂組成物。
- 請求項1〜15のいずれか1項に記載の樹脂組成物の硬化物。
- 支持体と、該支持体上に設けられた、請求項1〜15のいずれか1項に記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
- 請求項1〜15のいずれか1項に記載の樹脂組成物の硬化物又は請求項16に記載の硬化物により形成された絶縁層を含む、プリント配線板。
- 請求項18に記載のプリント配線板を含む、半導体装置。
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JP2021138873A (ja) * | 2020-03-06 | 2021-09-16 | 味の素株式会社 | 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 |
WO2023145471A1 (ja) * | 2022-01-28 | 2023-08-03 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
WO2023145473A1 (ja) * | 2022-01-28 | 2023-08-03 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
WO2023171215A1 (ja) * | 2022-03-08 | 2023-09-14 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
WO2024009831A1 (ja) * | 2022-07-04 | 2024-01-11 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
JP7451060B2 (ja) | 2021-05-24 | 2024-03-18 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物の硬化物からなるフィルム、及びそれを有するフレキシブルプリント基板 |
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JP7298518B2 (ja) | 2020-03-06 | 2023-06-27 | 味の素株式会社 | 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置 |
JP7451060B2 (ja) | 2021-05-24 | 2024-03-18 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物の硬化物からなるフィルム、及びそれを有するフレキシブルプリント基板 |
WO2023145471A1 (ja) * | 2022-01-28 | 2023-08-03 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
WO2023145473A1 (ja) * | 2022-01-28 | 2023-08-03 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
WO2023171215A1 (ja) * | 2022-03-08 | 2023-09-14 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
WO2024009831A1 (ja) * | 2022-07-04 | 2024-01-11 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
WO2024108837A1 (zh) * | 2022-11-22 | 2024-05-30 | 武汉市三选科技有限公司 | 低介电损耗的积层膜、其制备方法及电路基板结构 |
CN117777696A (zh) * | 2023-11-28 | 2024-03-29 | 无锡仁宇科技有限公司 | 一种硬化pc面板的制备工艺 |
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JP7491343B2 (ja) | 2024-05-28 |
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JP2022121453A (ja) | 2022-08-19 |
KR20200116047A (ko) | 2020-10-08 |
CN111748206A (zh) | 2020-10-09 |
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