JP7242684B2 - セラミックス構造体 - Google Patents
セラミックス構造体 Download PDFInfo
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- JP7242684B2 JP7242684B2 JP2020539538A JP2020539538A JP7242684B2 JP 7242684 B2 JP7242684 B2 JP 7242684B2 JP 2020539538 A JP2020539538 A JP 2020539538A JP 2020539538 A JP2020539538 A JP 2020539538A JP 7242684 B2 JP7242684 B2 JP 7242684B2
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/028—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
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- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
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Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
1a、1b:基体の表面
2:穴
3:封止材
4:第1部材
5:第2部材
6:段差
7:凹部
8:第1面
10:セラミックス構造体
Claims (4)
- セラミックスからなる基体と、
該基体の内部に位置する穴と、
前記基体の表面に位置し、前記穴と繋がっている開口と、
該開口を塞ぐ封止材と、を有し、
該封止材は、
樹脂、金属粒子およびセラミックス粒子の少なくともいずれかを含有する第1部材と、
セラミックスまたは金属からなり、柱状体である第2部材と、を有し、
前記穴の壁面と前記第2部材との間の少なくとも一部に前記第1部材が位置し、
前記第2部材は、下面の少なくとも一部が直接または前記第1部材を介して前記基体に接続しており、
前記穴の壁面における前記第2部材に対向する表面、および、前記第2部材における前記穴の壁面に対向する表面の少なくともいずれかは、前記第2部材の軸方向に段差を有し、
該段差は、凹部と凸部とを有しており、前記凹部と前記凸部は、前記基体の表面から略同じ深さに位置している、
セラミックス構造体。 - 前記第2部材は、前記穴の壁面との対向面において、前記基体との接点が周回する部分を有する、請求項1に記載のセラミックス構造体。
- 前記第2部材は、ブッシュである、請求項1または2に記載のセラミックス構造体。
- 前記穴の気圧は、大気圧よりも低い、請求項1乃至請求項3のいずれかに記載のセラミックス構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018161681 | 2018-08-30 | ||
JP2018161681 | 2018-08-30 | ||
PCT/JP2019/033699 WO2020045495A1 (ja) | 2018-08-30 | 2019-08-28 | セラミックス構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020045495A1 JPWO2020045495A1 (ja) | 2021-08-26 |
JP7242684B2 true JP7242684B2 (ja) | 2023-03-20 |
Family
ID=69644471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020539538A Active JP7242684B2 (ja) | 2018-08-30 | 2019-08-28 | セラミックス構造体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20210292247A1 (ja) |
EP (1) | EP3845508A4 (ja) |
JP (1) | JP7242684B2 (ja) |
WO (1) | WO2020045495A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001058882A (ja) | 1998-08-26 | 2001-03-06 | Ngk Insulators Ltd | 接合体、高圧放電灯およびその製造方法 |
JP2008071843A (ja) | 2006-09-12 | 2008-03-27 | Ngk Spark Plug Co Ltd | 多層セラミック基板及びその製造方法 |
JP2013224253A (ja) | 2012-03-22 | 2013-10-31 | Ngk Insulators Ltd | 接合体の製造方法、及び、接合体 |
JP2014131015A (ja) | 2012-11-30 | 2014-07-10 | Kyocera Corp | セラミック焼結体、これを用いた流路部材ならびに半導体検査装置および半導体製造装置 |
JP2015138910A (ja) | 2014-01-23 | 2015-07-30 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP2016108233A (ja) | 2014-11-28 | 2016-06-20 | 京セラ株式会社 | セラミック部材 |
JP2018113422A (ja) | 2017-01-13 | 2018-07-19 | 日本特殊陶業株式会社 | セラミックス部材 |
JP2018114485A (ja) | 2017-01-20 | 2018-07-26 | 日本碍子株式会社 | ハニカム構造体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT504354A (ja) * | 1952-08-08 | |||
DE3636110A1 (de) * | 1986-10-23 | 1988-04-28 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Einschmelzung fuer eine hochdruckentladungslampe |
DE3803227A1 (de) * | 1988-02-04 | 1989-08-17 | Hoechst Ceram Tec Ag | Verfahren zum vakuumdichten verschliessen eines keramikrohres |
EP0516579B1 (de) * | 1991-05-26 | 1994-06-22 | Endress + Hauser Gmbh + Co. | Durchkontaktierung eines Isolierstoffteils |
JP3929255B2 (ja) * | 2000-07-03 | 2007-06-13 | 日本碍子株式会社 | 接合体および高圧放電灯 |
CN1473452A (zh) * | 2001-07-09 | 2004-02-04 | IBIDEN�ɷ�����˾ | 陶瓷加热器与陶瓷接合体 |
-
2019
- 2019-08-28 EP EP19856286.0A patent/EP3845508A4/en active Pending
- 2019-08-28 JP JP2020539538A patent/JP7242684B2/ja active Active
- 2019-08-28 US US17/263,461 patent/US20210292247A1/en active Pending
- 2019-08-28 WO PCT/JP2019/033699 patent/WO2020045495A1/ja unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001058882A (ja) | 1998-08-26 | 2001-03-06 | Ngk Insulators Ltd | 接合体、高圧放電灯およびその製造方法 |
JP2008071843A (ja) | 2006-09-12 | 2008-03-27 | Ngk Spark Plug Co Ltd | 多層セラミック基板及びその製造方法 |
JP2013224253A (ja) | 2012-03-22 | 2013-10-31 | Ngk Insulators Ltd | 接合体の製造方法、及び、接合体 |
JP2014131015A (ja) | 2012-11-30 | 2014-07-10 | Kyocera Corp | セラミック焼結体、これを用いた流路部材ならびに半導体検査装置および半導体製造装置 |
JP2015138910A (ja) | 2014-01-23 | 2015-07-30 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP2016108233A (ja) | 2014-11-28 | 2016-06-20 | 京セラ株式会社 | セラミック部材 |
JP2018113422A (ja) | 2017-01-13 | 2018-07-19 | 日本特殊陶業株式会社 | セラミックス部材 |
JP2018114485A (ja) | 2017-01-20 | 2018-07-26 | 日本碍子株式会社 | ハニカム構造体 |
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