JP7238791B2 - 封止組成物及び半導体装置 - Google Patents

封止組成物及び半導体装置 Download PDF

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Publication number
JP7238791B2
JP7238791B2 JP2019562046A JP2019562046A JP7238791B2 JP 7238791 B2 JP7238791 B2 JP 7238791B2 JP 2019562046 A JP2019562046 A JP 2019562046A JP 2019562046 A JP2019562046 A JP 2019562046A JP 7238791 B2 JP7238791 B2 JP 7238791B2
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JP
Japan
Prior art keywords
inorganic filler
particle size
mass
alumina
sealing composition
Prior art date
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Active
Application number
JP2019562046A
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English (en)
Japanese (ja)
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JPWO2019131669A1 (ja
Inventor
健太 石橋
格 山浦
拓也 児玉
実佳 田中
慧地 堀
東哲 姜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2019131669A1 publication Critical patent/JPWO2019131669A1/ja
Priority to JP2023032122A priority Critical patent/JP7571810B2/ja
Application granted granted Critical
Publication of JP7238791B2 publication Critical patent/JP7238791B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019562046A 2017-12-28 2018-12-25 封止組成物及び半導体装置 Active JP7238791B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023032122A JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017254883 2017-12-28
JP2017254883 2017-12-28
PCT/JP2018/047642 WO2019131669A1 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置

Related Child Applications (1)

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JP2023032122A Division JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2019131669A1 JPWO2019131669A1 (ja) 2020-12-24
JP7238791B2 true JP7238791B2 (ja) 2023-03-14

Family

ID=67067545

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JP2019562046A Active JP7238791B2 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置
JP2023032122A Active JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

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Country Status (5)

Country Link
JP (2) JP7238791B2 (enrdf_load_stackoverflow)
KR (2) KR20250016469A (enrdf_load_stackoverflow)
CN (1) CN111566163B (enrdf_load_stackoverflow)
TW (1) TWI797222B (enrdf_load_stackoverflow)
WO (1) WO2019131669A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067951A (ja) * 2017-12-28 2023-05-16 株式会社レゾナック 封止組成物及び半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290076A (ja) 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2010024464A (ja) 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2014122364A (ja) 2014-03-20 2014-07-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、有機修飾無機充填材、エポキシ樹脂組成物の製造方法
JP2015205796A (ja) 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物

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Publication number Priority date Publication date Assignee Title
JP2874089B2 (ja) * 1994-04-13 1999-03-24 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP4112396B2 (ja) * 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4774778B2 (ja) 2005-03-28 2011-09-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
CN101522793B (zh) * 2006-10-06 2011-12-28 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP4973322B2 (ja) * 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
CN102007073B (zh) * 2008-04-30 2014-10-08 电气化学工业株式会社 氧化铝粉末、其制造方法以及使用该氧化铝粉末的树脂组合物
CN102382422B (zh) * 2010-09-01 2013-01-02 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP6282390B2 (ja) * 2010-12-16 2018-02-21 日立化成株式会社 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
WO2013145608A1 (ja) * 2012-03-29 2013-10-03 住友ベークライト株式会社 樹脂組成物および半導体装置
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2014208694A1 (ja) * 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
JP6090614B2 (ja) * 2014-01-08 2017-03-08 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP6501211B2 (ja) * 2016-01-13 2019-04-17 エルジー・ケム・リミテッド 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ
KR20250016469A (ko) * 2017-12-28 2025-02-03 가부시끼가이샤 레조낙 밀봉 조성물 및 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290076A (ja) 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2010024464A (ja) 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2014122364A (ja) 2014-03-20 2014-07-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、有機修飾無機充填材、エポキシ樹脂組成物の製造方法
JP2015205796A (ja) 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067951A (ja) * 2017-12-28 2023-05-16 株式会社レゾナック 封止組成物及び半導体装置
JP7571810B2 (ja) 2017-12-28 2024-10-23 株式会社レゾナック 封止組成物及び半導体装置

Also Published As

Publication number Publication date
KR20250016469A (ko) 2025-02-03
KR20200103682A (ko) 2020-09-02
TW201934650A (zh) 2019-09-01
JP2023067951A (ja) 2023-05-16
CN111566163A (zh) 2020-08-21
KR102815688B1 (ko) 2025-06-04
JPWO2019131669A1 (ja) 2020-12-24
TWI797222B (zh) 2023-04-01
JP7571810B2 (ja) 2024-10-23
WO2019131669A1 (ja) 2019-07-04
CN111566163B (zh) 2024-02-13

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