KR20250016469A - 밀봉 조성물 및 반도체 장치 - Google Patents

밀봉 조성물 및 반도체 장치 Download PDF

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Publication number
KR20250016469A
KR20250016469A KR1020257001450A KR20257001450A KR20250016469A KR 20250016469 A KR20250016469 A KR 20250016469A KR 1020257001450 A KR1020257001450 A KR 1020257001450A KR 20257001450 A KR20257001450 A KR 20257001450A KR 20250016469 A KR20250016469 A KR 20250016469A
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KR
South Korea
Prior art keywords
inorganic filler
particle diameter
sealing composition
mass
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001450A
Other languages
English (en)
Korean (ko)
Inventor
겐타 이시바시
마사시 야마우라
다쿠야 고다마
미카 다나카
게이치 호리
동철 강
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250016469A publication Critical patent/KR20250016469A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257001450A 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치 Pending KR20250016469A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2017-254883 2017-12-28
JP2017254883 2017-12-28
PCT/JP2018/047642 WO2019131669A1 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置
KR1020207018215A KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207018215A Division KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Publications (1)

Publication Number Publication Date
KR20250016469A true KR20250016469A (ko) 2025-02-03

Family

ID=67067545

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257001450A Pending KR20250016469A (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치
KR1020207018215A Active KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207018215A Active KR102815688B1 (ko) 2017-12-28 2018-12-25 밀봉 조성물 및 반도체 장치

Country Status (5)

Country Link
JP (2) JP7238791B2 (enrdf_load_stackoverflow)
KR (2) KR20250016469A (enrdf_load_stackoverflow)
CN (1) CN111566163B (enrdf_load_stackoverflow)
TW (1) TWI797222B (enrdf_load_stackoverflow)
WO (1) WO2019131669A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250016469A (ko) * 2017-12-28 2025-02-03 가부시끼가이샤 레조낙 밀봉 조성물 및 반도체 장치
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273920A (ja) 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

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JP2874089B2 (ja) * 1994-04-13 1999-03-24 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP4112396B2 (ja) * 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4525139B2 (ja) 2004-03-31 2010-08-18 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物の製造方法。
CN101522793B (zh) * 2006-10-06 2011-12-28 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP4973322B2 (ja) * 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
CN102007073B (zh) * 2008-04-30 2014-10-08 电气化学工业株式会社 氧化铝粉末、其制造方法以及使用该氧化铝粉末的树脂组合物
JP5407767B2 (ja) 2009-11-04 2014-02-05 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
CN102382422B (zh) * 2010-09-01 2013-01-02 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP6282390B2 (ja) * 2010-12-16 2018-02-21 日立化成株式会社 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
WO2013145608A1 (ja) * 2012-03-29 2013-10-03 住友ベークライト株式会社 樹脂組成物および半導体装置
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2014208694A1 (ja) * 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
JP6090614B2 (ja) * 2014-01-08 2017-03-08 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP5905917B2 (ja) 2014-03-20 2016-04-20 住友ベークライト株式会社 表面処理粒子の製造方法
JP6347653B2 (ja) 2014-04-21 2018-06-27 新日鉄住金マテリアルズ株式会社 球状粒子の製造方法
JP6501211B2 (ja) * 2016-01-13 2019-04-17 エルジー・ケム・リミテッド 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ
KR20250016469A (ko) * 2017-12-28 2025-02-03 가부시끼가이샤 레조낙 밀봉 조성물 및 반도체 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006273920A (ja) 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
JP7238791B2 (ja) 2023-03-14
KR20200103682A (ko) 2020-09-02
TW201934650A (zh) 2019-09-01
JP2023067951A (ja) 2023-05-16
CN111566163A (zh) 2020-08-21
KR102815688B1 (ko) 2025-06-04
JPWO2019131669A1 (ja) 2020-12-24
TWI797222B (zh) 2023-04-01
JP7571810B2 (ja) 2024-10-23
WO2019131669A1 (ja) 2019-07-04
CN111566163B (zh) 2024-02-13

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A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20250115

Application number text: 1020207018215

Filing date: 20200624

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250213

Comment text: Request for Examination of Application