Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/293—Organic, e.g. plastic
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general

Definitions

• the present invention relates to a sealing composition and a semiconductor device.
• a semiconductor package adopting a method called a wire bonding structure in which a semiconductor element and a substrate are connected via a wire uses a resin composition for the semiconductor element, the substrate, and a wire electrically connecting these. It is formed by sealing. At this time, pressure is applied to the wire due to the flow of the sealing material, which may cause displacement of the wire (wire flow) or insufficient protection of the semiconductor element. As described above, it may be difficult to achieve both the flowability of the sealing material and the high thermal conductivity.
• One aspect of the present invention is made in view of the above-mentioned conventional circumstances, and it aims at providing a sealing composition which is excellent in fluidity and has high thermal conductivity, and a semiconductor device using the same.
• the specific means for achieving the said subject are as follows. ⁇ 1> containing an epoxy resin, a curing agent, and an inorganic filler, The particle size distribution of the inorganic filler has at least three peaks, The sealing composition in which the said inorganic filler contains an alumina with a particle diameter of 1 micrometer or less. ⁇ 2> The sealing composition according to ⁇ 1>, wherein the particle size distribution of the inorganic filler has a peak in a range of 0.3 ⁇ m to 0.7 ⁇ m, a range of 7 ⁇ m to 20 ⁇ m, and a range of 30 ⁇ m to 70 ⁇ m.
• ⁇ 3> The sealing composition according to ⁇ 1> or ⁇ 2>, wherein a ratio of alumina in inorganic particles having a particle diameter of 1 ⁇ m or less in the inorganic filler is 1% by volume to 40% by volume.
• ⁇ 4> The sealing composition according to any one of ⁇ 1> to ⁇ 3>, wherein the average circularity of the inorganic filler is 0.80 or more.
• a semiconductor device comprising: a semiconductor element; and a cured product of the sealing composition according to any one of ⁇ 1> to ⁇ 4>, wherein the semiconductor element is sealed.
• the present invention is not limited to the following embodiments.
• the constituent elements including element steps and the like
• the constituent elements are not essential unless otherwise specified.
• numerical values described before and after “to” are included in the numerical range indicated using “to” as the minimum value and the maximum value, respectively.
• the upper limit value or the lower limit value described in one numerical value range may be replaced with the upper limit value or the lower limit value of the other stepwise description numerical value range in the numerical value range described stepwise in the present disclosure. .
• each component may contain a plurality of corresponding substances.
• the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified.
• a plurality of particles corresponding to each component may be contained.
• the particle diameter of each component means the value for the mixture of the plurality of particles present in the composition unless otherwise specified.
• the sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, and the particle size distribution of the inorganic filler has at least three peaks, and the inorganic filler has a particle diameter. Contains alumina of 1 ⁇ m or less.
• the sealing composition of the present disclosure has excellent fluidity and high thermal conductivity. Although the reason is not clear, it is guessed as follows.
• the inorganic filler contained in the sealing composition exhibits a particle size distribution having at least three peaks. That is, the inorganic filler is configured to include at least inorganic particles having a large particle size, inorganic particles having a medium particle size, and inorganic particles having a small particle size.
• the sealing composition of the present disclosure is considered to be excellent in fluidity.
• the inorganic filler contains alumina having a particle diameter of 1 ⁇ m or less, and the alumina exhibits high thermal conductivity as described above.
• alumina having a particle diameter of 1 ⁇ m or less corresponds to inorganic particles having a small particle diameter as the inorganic filler contained in the sealing composition.
• the thermal conductivity between the large particle size inorganic particles and the medium particle size inorganic particles is promoted by interposing the alumina exhibiting high thermal conductivity between the large particle size inorganic particles and the medium particle size inorganic particles. be able to. As a result, it is assumed that the sealing composition of the present disclosure has high thermal conductivity.
• the sealing composition of the present disclosure contains an epoxy resin, a curing agent, and an inorganic filler, and may contain other components as needed.
• the sealing composition contains an epoxy resin.
• the type of epoxy resin is not particularly limited, and known epoxy resins can be used. Specifically, for example, it is selected from the group consisting of phenol compounds (for example, phenol, cresol, xylenol, resorcine, catechol, bisphenol A and bisphenol F) and naphthol compounds (for example, ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene) Epoxidized novolak resin obtained by condensation or cocondensation of at least one of the following compounds with an aldehyde compound (eg, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst (eg, phenol Novolac type epoxy resin and ortho cresol novolac type epoxy resin); bisphenol (for example, bisphenol A, bisphenol AD, bisphenol F and bisphenol) At least one diglycidy
• the purity of the epoxy resin is preferably high, and the amount of hydrolyzable chlorine is preferably small.
• the amount of hydrolyzable chlorine is preferably 500 ppm or less on a mass basis.
• the amount of hydrolyzable chlorine is a value determined by potentiometric titration after dissolving 1 g of the epoxy resin as a sample in 30 mL of dioxane, adding 5 mL of 1N-KOH methanol solution and refluxing for 30 minutes.
• the content of the epoxy resin in the sealing composition is preferably 1.5% by mass to 20% by mass, more preferably 2.0% by mass to 15% by mass, and 3.0% by mass or more More preferably, it is 10% by mass.
• the content of the epoxy resin in the sealing composition excluding the inorganic filler is preferably 30% by mass to 65% by mass, more preferably 35% by mass to 60% by mass, and 40% by mass to 55% by mass. More preferably, it is mass%.
• the sealing composition contains a curing agent.
• the type of curing agent is not particularly limited, and known curing agents can be used. Specifically, for example, it is selected from the group consisting of phenol compounds (eg, phenol, cresol, resorcine, catechol, bisphenol A and bisphenol F) and naphthol compounds (eg, ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene)
• Novolak resin obtained by condensation or cocondensation of at least one type and an aldehyde compound (eg, formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde) under an acidic catalyst; phenol / aralkyl resin; biphenyl / aralkyl resin; And naphthol / aralkyl resins.
• the curing agent may be used alone or in combination of two or more.
• a phenol / aralkyl resin is preferable from the viewpoint of improving the reflow resistance.
• the curing agent may be used alone or in combination of two or more.
• the curing agent is blended such that the equivalent of the functional group of the curing agent (for example, phenolic hydroxyl group in the case of novolak resin) is 0.5 equivalent to 1.5 equivalents to 1 equivalent of epoxy group of the epoxy resin.
• the curing agent is preferably blended so as to be 0.7 equivalents to 1.2 equivalents.
• the sealing composition comprises an inorganic filler.
• the inorganic filler By including the inorganic filler, the hygroscopicity of the sealing composition is reduced, and the strength in the cured state tends to be improved.
• the inorganic filler may be used alone or in combination of two or more.
• two or more types of inorganic fillers are used in combination, there may be mentioned, for example, a case where two or more types of inorganic fillers having different components, average particle diameter, shape and the like are used.
• the shape of the inorganic filler is not particularly limited, and examples thereof include powder, sphere, and fiber. It is preferable that it is spherical shape from the point of the fluidity
• the average circularity of the inorganic filler is preferably 0.80 or more, more preferably 0.85 or more, still more preferably 0.90 or more, and particularly preferably 0.93 or more. preferable.
• the average circularity of the inorganic filler may be 1.0 or less.
• the circularity of the inorganic filler is the circumference measured from the projected image of the inorganic filler, as the circle equivalent diameter calculated from the equivalent circle diameter which is the diameter of a circle having the same area as the projected area of the inorganic filler It is a numerical value obtained by dividing by the length (length of contour line), and is obtained by the following equation. The roundness is 1.00 for a true circle.
• Circularity (perimeter of equivalent circle) / (perimeter of particle cross-sectional image) Specifically, the average circularity is observed by a scanning electron microscope at a magnification of 1000 times, an image of 10 inorganic fillers is arbitrarily selected, and the circularity of each inorganic filler is measured by the above method. And the value calculated as the arithmetic mean value.
• the degree of circularity, the circumferential length of the equivalent circle, and the circumferential length of the projected image of particles can be determined by commercially available image analysis software. When two or more types are used together as an inorganic filler, the average roundness of an inorganic filler says the value as a mixture of two or more types of inorganic fillers.
• the inorganic filler is not particularly limited with respect to the material, the particle diameter and the like, as long as the inorganic filler has alumina having a particle size distribution having at least three peaks and having a particle diameter of 1 ⁇ m or less.
• examples of the inorganic filler include spherical silica, silica such as crystalline silica, alumina, zircon, magnesium oxide, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, boron nitride, aluminum nitride, beryllia, zirconia, etc.
• examples of the inorganic filler having a flame retardant effect include aluminum hydroxide and zinc borate.
• alumina is preferable from the viewpoint of high thermal conductivity.
• the proportion of alumina in the inorganic filler is preferably 60% by mass to 95% by mass, more preferably 60% by mass to 92% by mass, and still more preferably 60% by mass to 90% by mass.
• alumina and silica may be used in combination.
• the proportion of alumina in the inorganic filler is preferably 80% by mass to 95% by mass, and the proportion of silica is preferably 5% by mass to 20% by mass, alumina Of 82% by mass to 92% by mass, more preferably 8% by mass to 18% by mass of silica, and 85% by mass to 90% by mass of alumina; It is more preferable that the content is 15% by mass.
• the particle size distribution of the inorganic filler has at least three peaks, preferably three peaks.
• the position of the peak in the particle size distribution of the inorganic filler is not particularly limited, and preferably has a peak in the range of 0.3 ⁇ m to 0.7 ⁇ m, in the range of 7 ⁇ m to 20 ⁇ m, and in the range of 30 ⁇ m to 70 ⁇ m, It is more preferable to have peaks in the range of 0.3 ⁇ m to 0.6 ⁇ m, in the range of 7 ⁇ m to 15 ⁇ m, and in the range of 40 ⁇ m to 70 ⁇ m.
• the particle size distribution of the inorganic filler can be determined by the following method.
• An inorganic filler to be measured is added to a solvent (pure water) in the range of 0.02% by mass to 0.08% by mass, and vibrated for 1 to 10 minutes with a 110 W bath ultrasonic cleaner, Disperse the filler.
• About 40 mL of the dispersion is injected into the measuring cell and measured at 25 ° C.
• the measuring apparatus measures the particle size distribution on a volume basis with a laser diffraction / scattering type particle size distribution measuring apparatus (for example, LA920 (trade name) manufactured by Horiba, Ltd.).
• LA920 laser diffraction / scattering type particle size distribution measuring apparatus
• the refractive index of alumina is used. Even when the inorganic filler is a mixture of alumina and an inorganic filler other than alumina, the refractive index uses that of alumina.
• the proportion of alumina in inorganic particles having a particle diameter of 1 ⁇ m or less in the inorganic filler is preferably 1% by volume to 40% by volume, more preferably 10% by volume to 35% by volume, and 15% by volume % To 30% by volume is more preferable.
• the ratio of alumina to the inorganic particles having a particle diameter of 1 ⁇ m or less contained in the inorganic filler can be measured by the following method. For each inorganic particle whose particle diameter is confirmed to be 1 ⁇ m or less by a scanning electron microscope, constituent elements are identified by Energy dispersive X-ray spectrometry, and the material of the inorganic particle is determined.
• the ratio of alumina to inorganic particles having a particle diameter of 1 ⁇ m or less can be determined.
• the particle diameter of each inorganic particle is a circle equivalent diameter which is the diameter of a circle having the same area as the projected area.
• the proportion of alumina in the inorganic particles having a particle diameter of 10 ⁇ m or more in the inorganic filler is preferably 20% by volume to 60% by volume, more preferably 25% by volume to 55% by volume, and 30% by volume More preferably, it is% to 50% by volume.
• the ratio of alumina in the inorganic particles having a particle diameter of 10 ⁇ m or more contained in the inorganic filler can be determined in the same manner as the ratio of alumina in the inorganic particles having a particle diameter of 1 ⁇ m or less in the inorganic filler.
• the compounding amount of the inorganic filler is within the range of 75% by mass to 97% by mass with respect to the whole sealing composition from the viewpoints of hygroscopicity, reduction of linear expansion coefficient, strength improvement and solder heat resistance. Preferably, it is more preferably in the range of 80% by mass to 95% by mass.
• an inorganic filler having an average particle diameter of 0.3 ⁇ m to 0.7 ⁇ m an inorganic filler having an average particle diameter of 7 ⁇ m to 20 ⁇ m, and an inorganic filler having an average particle diameter of 30 ⁇ m to 70 ⁇ m may be used in combination. .
• the average particle size of the inorganic filler as a whole is preferably 4 ⁇ m to 30 ⁇ m, more preferably 5 ⁇ m to 25 ⁇ m, and still more preferably 6 ⁇ m to 20 ⁇ m.
• the average particle size of the inorganic filler is a dispersion liquid of the inorganic filler prepared in the same manner as in the measurement of the particle size distribution of the inorganic filler, and a laser diffraction / scattering particle size distribution measuring apparatus (for example, Horiba, Ltd.
• the sealing composition may further contain a curing accelerator.
• a hardening accelerator is not restrict
• the content of the curing accelerator is preferably 0.1% by mass to 8% by mass with respect to the total amount of the epoxy resin and the curing agent.
• the sealing composition may further contain an ion trapping agent.
• the ion trap agent that can be used in the present disclosure is not particularly limited as long as it is a generally used ion trap agent in a sealing material used for semiconductor device manufacturing applications, and hydrotalcite etc. It can be mentioned.
• As the ion trapping agent a compound represented by the following general formula (II-1) or the following general formula (II-2) may be used.
• Ion trap agents are commercially available.
• DHT-4A Korean Chemical Industry Co., Ltd., trade name
• IXE 500 Toagosei Co., Ltd., trade name
• ion trap agents other than the above, hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, antimony and the like can be mentioned.
• the ion trap agent may be used alone or in combination of two or more.
• the content of the ion trap agent is 1 part by mass with respect to 100 parts by mass of the epoxy resin in the sealing composition from the viewpoint of achieving sufficient moisture resistance reliability. It is preferable that it is more than. From the viewpoint of sufficiently exhibiting the effects of the other components, the content of the ion trap agent is preferably 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin in the sealing composition.
• the average particle size of the ion trap agent is preferably 0.1 ⁇ m to 3.0 ⁇ m, and the maximum particle size is preferably 10 ⁇ m or less.
• the average particle size of the ion trapping agent can be measured in the same manner as in the case of the inorganic filler.
• the sealing composition may further contain a coupling agent.
• the type of coupling agent is not particularly limited, and known coupling agents can be used.
• As a coupling agent a silane coupling agent and a titanium coupling agent are mentioned, for example.
• the coupling agent may be used alone or in combination of two or more.
• silane coupling agent for example, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane ⁇ -Glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ - [bis ( ⁇ -hydroxyethyl)] aminopropyltriethoxysilane, N - ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, ⁇ - ( ⁇ -aminoethyl) aminopropyldimethoxymethylsilane, N- (trimethoxysilylpropyl)
• titanium coupling agent for example, isopropyl triisostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra ( 2,2-diallyloxymethyl-1-butyl) bis (ditridecyl phosphite) titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, bis (dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylic iso Stearoyl titanate, isopropyl tridodecyl benzene sulfonyl titanate, isopropyl isostearoyl titanate
• the content of the coupling agent is preferably 3% by mass or less based on the whole of the sealing composition, and from the viewpoint of exerting the effect, 0
• the content is preferably 1% by mass or more.
• the sealing composition may further contain a release agent.
• a mold release agent is not restrict
• the mold release agent may be used alone or in combination of two or more.
• the content of the release agent is preferably 10% by mass or less based on the total amount of the epoxy resin and the curing agent, and from the viewpoint of exerting the effect Is preferably 0.5% by mass or more.
• the sealing composition may contain a colorant (eg, carbon black).
• the sealing composition may also contain modifiers such as silicone and silicone rubber.
• the colorant and the modifier may be used alone or in combination of two or more.
• electroconductive particles such as carbon black
• electroconductive particles are 1 mass% or less in content rate of particle
• the content of the conductive particles is preferably 4% by mass or less based on the total amount of the epoxy resin and the curing agent.
• the method for producing the sealing composition is not particularly limited, and can be carried out by a known method. For example, after a mixture of raw materials of a predetermined compounding amount is sufficiently mixed by a mixer or the like, it can be manufactured by kneading by a heat roll, an extruder or the like, and subjecting to processing such as cooling or crushing.
• the state of the sealing composition is not particularly limited, and may be powder, solid, liquid or the like.
• a semiconductor device of the present disclosure includes a semiconductor element and a cured product of the sealing composition of the present disclosure formed by sealing the semiconductor element.
• the method for sealing the semiconductor element using the sealing composition is not particularly limited, and a known method can be applied.
• transfer molding is generally used, but compression molding, injection molding, etc. may be used.
• the semiconductor device of the present disclosure is suitable as an IC, a large scale integration (LSI) circuit, or the like.
• LSI large scale integration
• Examples 1 to 11 and Comparative Examples 1 and 2 After pre-mixing (dry blending) the materials of the formulations shown in Tables 1 to 3, the mixture is kneaded for about 15 minutes with a biaxial roll (roll surface temperature: about 80 ° C.), and is cooled and pulverized to obtain a powdery sealing composition Manufactured.
• Epoxy resin 1 Biphenyl type epoxy resin, epoxy equivalent: 186 g / eq -Epoxy resin 2: Multifunctional epoxy resin, epoxy equivalent: 167 g / eq
• Epoxy resin 3 bisphenol type crystalline epoxy resin, epoxy equivalent: 192 g / eq ⁇
• Epoxy resin 4 Bis-F type epoxy resin, epoxy equivalent: 159 g / eq
• Curing agent 1 Multifunctional phenolic resin, triphenylmethane type phenolic resin having a hydroxyl equivalent of 102 g / eq
• Curing agent 2 Multifunctional phenolic resin, biphenyl having a hydroxyl equivalent of 205 g / eq
• Curing agent 3 Phenol ⁇ Aralkyl resin, hydroxyl equivalent: 170 g / eq
• Hardening accelerator Phosphorus hardening accelerator
• Coupling agent Epoxysilane ( ⁇ -glycidoxypropyltrimethoxysilane) -Releasing agent: Montanic acid ester-Coloring agent: Carbon black-Ion trap agent: Hydrotalcite-Modifier: Silicone
• Inorganic filler ⁇ Inorganic filler 1: Mixture of alumina and silica (average particle size: 8.6 ⁇ m) ⁇ Inorganic filler 2: silica (average particle size: 9.5 ⁇ m) ⁇ Inorganic filler 3: alumina (average particle size: 0.4 ⁇ m) ⁇ Inorganic filler 4: silica (average particle size: 0.8 ⁇ m) ⁇ Inorganic filler 5: silica (average particle size: 0.1 ⁇ m) ⁇ Inorganic filler 6: silica (average particle size: 13.0 ⁇ m) ⁇ Inorganic filler 7: silica (average particle size: 2.2 ⁇ m) ⁇ Inorganic filler 8: silica (average particle size: 0.8 ⁇ m) ⁇ Inorganic filler 9: mixture of alumina and silica (average particle size: 7.4 ⁇ m) ⁇ Inorganic filler 10: silica (average particle size: 1.5 ⁇ m) ⁇ Inorganic filler
• the positions of peaks in the particle size distribution of the inorganic filler of Examples 1 to 11 are as follows: It had 3 peaks.
• the sealing compositions according to Examples 1 to 11 all contained alumina having a particle diameter of 1 ⁇ m or less.
• the average particle size of the entire inorganic filler is shown below.
• Example 1 0.45 ⁇ m, 10 ⁇ m and 40 ⁇ m (average particle size: 8.1 ⁇ m)
• Example 2 0.5 ⁇ m, 10 ⁇ m and 50 ⁇ m (average particle size: 8.7 ⁇ m)
• Example 3 0.5 ⁇ m, 10 ⁇ m and 50 ⁇ m (average particle size: 7.6 ⁇ m)
• Example 4 0.5 ⁇ m, 10 ⁇ m and 50 ⁇ m (average particle size: 7.7 ⁇ m)
• Example 5 0.5 ⁇ m, 10 ⁇ m and 50 ⁇ m (average particle size: 6.6 ⁇ m)
• Example 6 0.5 ⁇ m, 10 ⁇ m and 51 ⁇ m (average particle size: 6.2 ⁇ m)
• Example 7 0.5 ⁇ m, 10 ⁇ m and 51 ⁇ m (average particle size: 7.7 ⁇ m)
• Example 8 0.5 ⁇ m, 10 ⁇ m and 51 ⁇ m (average particle size: 6.6 ⁇ m)
• Example 9 0.5 ⁇ m, 10 ⁇ m and 51
• the sealing composition which concerns on the comparative example 1 contained the alumina whose particle diameter is 1 micrometer or less.
• the average particle size of the entire inorganic filler is shown below. Comparative Example 1: 1.5 ⁇ m and 10 ⁇ m (average particle size: 11.3 ⁇ m)
• the position of the peak in the particle size distribution of the inorganic filler of the comparative example 2 was as follows, and had three peaks.
• the sealing composition which concerns on the comparative example 2 did not contain the alumina whose particle diameter is 1 micrometer or less.
• the average particle size of the entire inorganic filler is shown below. Comparative Example 2: 0.5 ⁇ m, 10 ⁇ m and 50 ⁇ m (average particle size: 6.5 ⁇ m)
• the evaluation of the flowability of the sealing composition was performed by a spiral flow test. Specifically, the sealing composition was molded using a spiral flow measurement die according to EMMI-1-66, and the flow distance (cm) of the molded product of the sealing composition was measured. Molding of the sealing composition was performed using a transfer molding machine under conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds. Moreover, fluidity set 160 cm or more to A, 150 cm or more and less than 160 cm as B, and less than 150 cm as C.
• the evaluation of the thermal conductivity of the sealing composition was performed by the following method. Specifically, transfer molding was performed using the prepared sealing composition under conditions of a mold temperature of 180 ° C., a molding pressure of 7 MPa, and a curing time of 300 seconds, to obtain a molded product having a mold shape. The density of the obtained cured product measured by the Archimedes method was 2.8 g / cm 3 to 3.0 g / cm 3 . Further, the thermal diffusivity of the cured product was measured by a laser flash method using a thermal diffusivity measuring device (LFA 467, manufactured by NETZSCH).
• LFA 467 thermal diffusivity measuring device
• the thermal conductivity (W / (m ⁇ K)) was calculated from the product of the thermal diffusivity measured above, the density measured by the Archimedes method, and the specific heat measured by DSC (differential calorimeter). In addition, the thermal conductivity is A at 2.5 W / (m ⁇ K) or more, and B at less than 2.5 W / (m ⁇ K).
• Comparative Example 2 in which the inorganic filler does not contain alumina having a particle diameter of 1 ⁇ m or less is an example 1, 5, 6, 8, which has particularly large amounts of alumina having a particle diameter of 1 ⁇ m or less in the inorganic filler. Compared to 10 and 11, the flowability was comparable or lower and the thermal conductivity resulted in lower.

Landscapes

• Chemical & Material Sciences (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• General Physics & Mathematics (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Compositions Of Macromolecular Compounds (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

Family

ID=67067545

Family Applications (1)

Country Status (5)

Families Citing this family (2)

Citations (5)

Family Cites Families (14)

• 2018
  • 2018-12-25 KR KR1020257001450A patent/KR20250016469A/ko active Pending
  • 2018-12-25 KR KR1020207018215A patent/KR102815688B1/ko active Active
  • 2018-12-25 CN CN201880084098.XA patent/CN111566163B/zh active Active
  • 2018-12-25 WO PCT/JP2018/047642 patent/WO2019131669A1/ja active Application Filing
  • 2018-12-25 JP JP2019562046A patent/JP7238791B2/ja active Active
  • 2018-12-26 TW TW107147230A patent/TWI797222B/zh active
• 2023
  • 2023-03-02 JP JP2023032122A patent/JP7571810B2/ja active Active

Patent Citations (5)

Also Published As

Similar Documents

Legal Events