JP7222991B2 - 半導体発光素子の製造方法 - Google Patents
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- JP7222991B2 JP7222991B2 JP2020522394A JP2020522394A JP7222991B2 JP 7222991 B2 JP7222991 B2 JP 7222991B2 JP 2020522394 A JP2020522394 A JP 2020522394A JP 2020522394 A JP2020522394 A JP 2020522394A JP 7222991 B2 JP7222991 B2 JP 7222991B2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
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- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Led Devices (AREA)
Description
(実施形態1)
(半導体発光素子10)
(半導体発光素子の製造方法)
(ウエハ準備工程)
(割断工程)
(レーザ光LB)
(パルス間隔がピコ秒のレーザ)
(超短パルスレーザ照射時に生じる現象)
(実施例)
5…基板;5a…第一主面;5b…第二主面
6…第一半導体層
7…第二半導体層
8…活性層
10…半導体発光素子
11…半導体構造
13…透光性導電層
14…保護膜
20…改質領域
31…第一集光位置
32…集光位置
AUM1…第一金製ミラー
AUM2…第二金製ミラー
CP…チップ
CRK…クラック
HWP1…第一偏光フィルタ
HWP2…第二偏光フィルタ
INT1…第一時間間隔
INT2…第二時間間隔
LB、LB1、LB2…レーザ光
LP1…第一レーザパルス
LP2…第二レーザパルス
OF…オリエンテーションフラット面
PBS…偏光ビームスプリッタ
QWP1…第一円偏光フィルタ
QWP2…第二円偏光フィルタ
SLP…シングルパルス
SPT…点
STD…スポット間隔
WP…偏光子
DPT…深さ
DST…距離間隔
Claims (8)
- 半導体発光素子の製造方法であって、
基板上に半導体構造が設けられたウエハを準備する工程と、
前記ウエハの基板内に、所定の距離間隔で複数回、レーザ光をパルス状に第一時間間隔で照射することで、前記基板内に複数の改質領域を形成し、形成された前記複数の改質領域の間にクラックを伸展させる工程と、
を含み、
前記基板内に前記複数の改質領域を形成しクラックを伸展させる工程において、前記第一時間間隔で行われる各レーザ光照射が、
前記基板内の厚さ方向における所定の深さに、第一パルスエネルギーを有する第一レーザパルスを照射する工程と、
前記第一レーザパルスの照射後、前記基板内の厚さ方向における前記所定の深さに、前記第一時間間隔よりも短い3ps~900psの第二時間間隔で、前記第一パルスエネルギーに対して強度比を0.5~1.5とする第二パルスエネルギーの第二レーザパルスを照射する工程と、
を含む半導体発光素子の製造方法。 - 請求項1に記載の半導体発光素子の製造方法であって、
前記第二レーザパルスを照射する工程において、前記第二レーザパルスの第二パルスエネルギーを、前記第一パルスエネルギーに対して強度比を0.8~1.2としてなる半導体発光素子の製造方法。 - 請求項2に記載の半導体発光素子の製造方法であって、
前記第二時間間隔が、3ps~500psである半導体発光素子の製造方法。 - 請求項3に記載の半導体発光素子の製造方法であって、
前記第二時間間隔が、50ps~350psである半導体発光素子の製造方法。 - 請求項1~4のいずれか一に記載の半導体発光素子の製造方法であって、
前記第一レーザパルス及び第二レーザパルスのパルス幅が、100fs~10000fsである半導体発光素子の製造方法。 - 請求項1~5のいずれか一に記載の半導体発光素子の製造方法であって、
前記第一時間間隔が、5μs~40μsである半導体発光素子の製造方法。 - 請求項1~6のいずれか一に記載の半導体発光素子の製造方法であって、
前記第一レーザパルスの第一パルスエネルギーが、0.5μJ~15μJである半導体発光素子の製造方法。 - 請求項1~7のいずれか一に記載の半導体発光素子の製造方法であって、
前記基板がサファイア基板である半導体発光素子の製造方法。
以上
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762592299P | 2017-11-29 | 2017-11-29 | |
US62/592,299 | 2017-11-29 | ||
PCT/JP2018/043455 WO2019107320A1 (en) | 2017-11-29 | 2018-11-26 | Method for producing semiconductor light emitting element |
Publications (3)
Publication Number | Publication Date |
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JP2021504933A JP2021504933A (ja) | 2021-02-15 |
JP2021504933A5 JP2021504933A5 (ja) | 2021-03-25 |
JP7222991B2 true JP7222991B2 (ja) | 2023-02-15 |
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JP2020522394A Active JP7222991B2 (ja) | 2017-11-29 | 2018-11-26 | 半導体発光素子の製造方法 |
Country Status (7)
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US (1) | US11289621B2 (ja) |
EP (1) | EP3718148B1 (ja) |
JP (1) | JP7222991B2 (ja) |
KR (1) | KR102563724B1 (ja) |
CN (1) | CN111566828B (ja) |
TW (1) | TWI788472B (ja) |
WO (1) | WO2019107320A1 (ja) |
Families Citing this family (2)
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CN110102882A (zh) * | 2018-02-01 | 2019-08-09 | 松下电器产业株式会社 | 切片方法及切片装置 |
JP7217426B2 (ja) * | 2019-02-22 | 2023-02-03 | パナソニックIpマネジメント株式会社 | レーザ加工装置およびレーザ加工方法 |
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- 2018-11-26 EP EP18882815.6A patent/EP3718148B1/en active Active
- 2018-11-26 JP JP2020522394A patent/JP7222991B2/ja active Active
- 2018-11-26 WO PCT/JP2018/043455 patent/WO2019107320A1/en unknown
- 2018-11-26 CN CN201880077036.6A patent/CN111566828B/zh active Active
- 2018-11-26 KR KR1020207018265A patent/KR102563724B1/ko active IP Right Grant
- 2018-11-29 TW TW107142641A patent/TWI788472B/zh active
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Also Published As
Publication number | Publication date |
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US20200365758A1 (en) | 2020-11-19 |
TWI788472B (zh) | 2023-01-01 |
EP3718148A4 (en) | 2021-09-08 |
EP3718148B1 (en) | 2022-11-16 |
US11289621B2 (en) | 2022-03-29 |
EP3718148A1 (en) | 2020-10-07 |
KR20200091892A (ko) | 2020-07-31 |
CN111566828B (zh) | 2023-07-21 |
JP2021504933A (ja) | 2021-02-15 |
WO2019107320A1 (en) | 2019-06-06 |
CN111566828A (zh) | 2020-08-21 |
TW201931627A (zh) | 2019-08-01 |
KR102563724B1 (ko) | 2023-08-07 |
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