JP7220980B2 - 表示装置製造用のマスクブランク用基板の製造方法、マスクブランクの製造方法、及びマスクの製造方法 - Google Patents

表示装置製造用のマスクブランク用基板の製造方法、マスクブランクの製造方法、及びマスクの製造方法 Download PDF

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JP7220980B2
JP7220980B2 JP2017220801A JP2017220801A JP7220980B2 JP 7220980 B2 JP7220980 B2 JP 7220980B2 JP 2017220801 A JP2017220801 A JP 2017220801A JP 2017220801 A JP2017220801 A JP 2017220801A JP 7220980 B2 JP7220980 B2 JP 7220980B2
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main surface
substrate
mask blank
manufacturing
mark
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Japanese (ja)
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JP2018106147A (ja
Inventor
順一 安森
誠治 坪井
明宏 河原
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Hoya Corp
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Hoya Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Surface Treatment Of Glass (AREA)
JP2017220801A 2016-12-22 2017-11-16 表示装置製造用のマスクブランク用基板の製造方法、マスクブランクの製造方法、及びマスクの製造方法 Active JP7220980B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170169612A KR102533073B1 (ko) 2016-12-22 2017-12-11 표시 장치 제조용 마스크 블랭크용 기판의 제조 방법, 마스크 블랭크의 제조 방법 및 마스크의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016249328 2016-12-22
JP2016249328 2016-12-22

Publications (2)

Publication Number Publication Date
JP2018106147A JP2018106147A (ja) 2018-07-05
JP7220980B2 true JP7220980B2 (ja) 2023-02-13

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JP2017220801A Active JP7220980B2 (ja) 2016-12-22 2017-11-16 表示装置製造用のマスクブランク用基板の製造方法、マスクブランクの製造方法、及びマスクの製造方法

Country Status (2)

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JP (1) JP7220980B2 (ko)
KR (1) KR102533073B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6948988B2 (ja) * 2018-06-26 2021-10-13 クアーズテック株式会社 フォトマスク用基板およびその製造方法
WO2022203364A1 (ko) * 2021-03-26 2022-09-29 삼성전자 주식회사 피듀셜 마크를 포함하는 하우징을 포함하는 전자 장치 및 그 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023252A (ja) 2010-07-15 2012-02-02 Dainippon Printing Co Ltd 反射型マスクブランクス、反射型マスク、および反射型マスクブランクスの製造方法
JP2014084234A (ja) 2012-10-19 2014-05-12 Hoya Corp 電子機器用カバーガラスのガラス基板及びその製造方法
JP2016069993A (ja) 2014-09-30 2016-05-09 大日本印刷株式会社 採光具
JP6080450B2 (ja) 2012-09-21 2017-02-15 株式会社タダノ 監視カメラ装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915938A (ja) * 1982-07-19 1984-01-27 Hoya Corp マ−キングを施されたフオトマスクブランクス用基板
JPS59200238A (ja) * 1983-04-27 1984-11-13 Fujitsu Ltd フオトマスクの製造方法
JPS6080450U (ja) * 1983-11-07 1985-06-04 日本電気株式会社 フオトマスク基板
JPS626259A (ja) * 1985-07-02 1987-01-13 Sharp Corp フオトマスク基板
JPS6275532A (ja) * 1985-09-30 1987-04-07 Toshiba Corp 基板の製造方法
JPH04110944A (ja) * 1990-08-31 1992-04-13 Nippon Sekiei Glass Kk 透明材料のマーキング方法
JPH0571855U (ja) * 1992-02-28 1993-09-28 大日本印刷株式会社 フォトマスク用ガラス基板
KR20030053085A (ko) * 2001-12-22 2003-06-28 주식회사 실트론 실리콘 웨이퍼의 제조방법
JP2008151916A (ja) * 2006-12-15 2008-07-03 Shin Etsu Chem Co Ltd 大型フォトマスク基板のリサイクル方法
JP5176641B2 (ja) * 2008-03-27 2013-04-03 凸版印刷株式会社 ハーフトーン型位相シフトマスク及びその製造方法
KR101168712B1 (ko) * 2009-02-13 2012-09-13 호야 가부시키가이샤 마스크블랭크용 기판, 마스크블랭크 및 포토마스크
CN102472712A (zh) * 2009-07-24 2012-05-23 旭硝子株式会社 玻璃部件的质量管理方法和质量管理装置以及带标记的玻璃部件
JP5578708B2 (ja) * 2010-04-19 2014-08-27 Ｈｏｙａ株式会社 Ｆｐｄ製造用再生フォトマスク基板の製造方法、再生フォトマスク用ブランクの製造方法、ペリクル付再生フォトマスクの製造方法及びパターン転写方法
KR20120056905A (ko) * 2010-08-02 2012-06-05 주식회사 에스앤에스텍 포토마스크 블랭크용 투명 기판, 포토마스크 블랭크 및 그의 제조 방법
JP6067529B2 (ja) * 2013-10-09 2017-01-25 日本板硝子株式会社 マーク付きコーティングガラス板の製造方法
JP2015119087A (ja) * 2013-12-19 2015-06-25 古河機械金属株式会社 マーク付き窒化物半導体基板の製造方法
JP2018076207A (ja) * 2016-11-10 2018-05-17 旭硝子株式会社 ガラス板およびガラス板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023252A (ja) 2010-07-15 2012-02-02 Dainippon Printing Co Ltd 反射型マスクブランクス、反射型マスク、および反射型マスクブランクスの製造方法
JP6080450B2 (ja) 2012-09-21 2017-02-15 株式会社タダノ 監視カメラ装置
JP2014084234A (ja) 2012-10-19 2014-05-12 Hoya Corp 電子機器用カバーガラスのガラス基板及びその製造方法
JP2016069993A (ja) 2014-09-30 2016-05-09 大日本印刷株式会社 採光具

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JP2018106147A (ja) 2018-07-05
KR102533073B1 (ko) 2023-05-17
KR20180073451A (ko) 2018-07-02

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