JP7206041B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP7206041B2
JP7206041B2 JP2017252140A JP2017252140A JP7206041B2 JP 7206041 B2 JP7206041 B2 JP 7206041B2 JP 2017252140 A JP2017252140 A JP 2017252140A JP 2017252140 A JP2017252140 A JP 2017252140A JP 7206041 B2 JP7206041 B2 JP 7206041B2
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Japan
Prior art keywords
unit
cutting
dimensional code
image
type
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Active
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JP2017252140A
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English (en)
Japanese (ja)
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JP2019115963A (ja
Inventor
一樹 荒生
貴彦 津野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017252140A priority Critical patent/JP7206041B2/ja
Priority to KR1020180165333A priority patent/KR102570138B1/ko
Priority to CN201811580678.6A priority patent/CN110026902A/zh
Priority to TW107146820A priority patent/TWI772584B/zh
Publication of JP2019115963A publication Critical patent/JP2019115963A/ja
Application granted granted Critical
Publication of JP7206041B2 publication Critical patent/JP7206041B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Theoretical Computer Science (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Confectionery (AREA)
JP2017252140A 2017-12-27 2017-12-27 切削装置 Active JP7206041B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017252140A JP7206041B2 (ja) 2017-12-27 2017-12-27 切削装置
KR1020180165333A KR102570138B1 (ko) 2017-12-27 2018-12-19 절삭 장치
CN201811580678.6A CN110026902A (zh) 2017-12-27 2018-12-24 切削装置
TW107146820A TWI772584B (zh) 2017-12-27 2018-12-24 切割裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017252140A JP7206041B2 (ja) 2017-12-27 2017-12-27 切削装置

Publications (2)

Publication Number Publication Date
JP2019115963A JP2019115963A (ja) 2019-07-18
JP7206041B2 true JP7206041B2 (ja) 2023-01-17

Family

ID=67225730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017252140A Active JP7206041B2 (ja) 2017-12-27 2017-12-27 切削装置

Country Status (4)

Country Link
JP (1) JP7206041B2 (ko)
KR (1) KR102570138B1 (ko)
CN (1) CN110026902A (ko)
TW (1) TWI772584B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7423157B2 (ja) 2020-04-30 2024-01-29 株式会社ディスコ 加工装置の管理方法
CN111873035A (zh) * 2020-06-11 2020-11-03 广州黑格智造信息科技有限公司 一种切割方法及切割系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118180A (ja) 2006-10-31 2008-05-22 Funai Electric Co Ltd 定型画像読取装置およびこれを用いた定型画像読取方法
JP2011503748A (ja) 2007-11-13 2011-01-27 コグネックス・コーポレイション 複数の画像フレームを使用してパターンを読取るシステム、及び方法
JP2012066328A (ja) 2010-09-22 2012-04-05 Disco Corp ドレッシングボードおよびドレッシングボード収容ケース
JP2013073454A (ja) 2011-09-28 2013-04-22 Well Cat:Kk バーコードシンボル読取装置及びバーコードシンボル読取方法
JP2017034018A (ja) 2015-07-30 2017-02-09 株式会社ディスコ 加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6606421B1 (en) * 2000-05-25 2003-08-12 Hewlett-Packard Development Company, L.P. Geometric deformation correction method and system for dot pattern images
AU2003298655A1 (en) * 2002-11-15 2004-06-15 Bioarray Solutions, Ltd. Analysis, secure access to, and transmission of array images
CN1885311A (zh) * 2006-05-29 2006-12-27 深圳矽感科技有限公司 二维码及其编解码方法
CN101201893A (zh) * 2006-09-30 2008-06-18 电子科技大学中山学院 一种基于灰度信息的虹膜识别预处理方法
CN102500452B (zh) * 2011-10-13 2014-01-08 西安理工大学 碎纸机纸质条状碎片恢复系统及纸质条状碎片恢复方法
CN106200971A (zh) * 2016-07-07 2016-12-07 广东技术师范学院 基于手势识别的人机交互系统装置及操作方法
CN106355174B (zh) * 2016-09-23 2023-06-20 华南理工大学 一种快递单关键信息动态提取方法及系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118180A (ja) 2006-10-31 2008-05-22 Funai Electric Co Ltd 定型画像読取装置およびこれを用いた定型画像読取方法
JP2011503748A (ja) 2007-11-13 2011-01-27 コグネックス・コーポレイション 複数の画像フレームを使用してパターンを読取るシステム、及び方法
JP2012066328A (ja) 2010-09-22 2012-04-05 Disco Corp ドレッシングボードおよびドレッシングボード収容ケース
JP2013073454A (ja) 2011-09-28 2013-04-22 Well Cat:Kk バーコードシンボル読取装置及びバーコードシンボル読取方法
JP2017034018A (ja) 2015-07-30 2017-02-09 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR102570138B1 (ko) 2023-08-23
KR20190079528A (ko) 2019-07-05
TW201927476A (zh) 2019-07-16
JP2019115963A (ja) 2019-07-18
CN110026902A (zh) 2019-07-19
TWI772584B (zh) 2022-08-01

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