JP7423157B2 - 加工装置の管理方法 - Google Patents
加工装置の管理方法 Download PDFInfo
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- JP7423157B2 JP7423157B2 JP2020079975A JP2020079975A JP7423157B2 JP 7423157 B2 JP7423157 B2 JP 7423157B2 JP 2020079975 A JP2020079975 A JP 2020079975A JP 2020079975 A JP2020079975 A JP 2020079975A JP 7423157 B2 JP7423157 B2 JP 7423157B2
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- 238000000034 method Methods 0.000 claims description 24
- 238000007726 management method Methods 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 description 365
- 238000000227 grinding Methods 0.000 description 40
- 230000032258 transport Effects 0.000 description 20
- 230000008569 process Effects 0.000 description 17
- 230000007246 mechanism Effects 0.000 description 14
- 238000003754 machining Methods 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000005498 polishing Methods 0.000 description 5
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Description
1a 表面
1b 裏面
3 保護部材
5 デバイス
2 加工装置
4 基台
6 ターンテーブル
8 チャックテーブル
8a 保持面
10a,10b 加工ユニット(研削ユニット)
12a,12b スピンドルモータ
14a,14b スピンドル
16a,16b ホイールマウント
18a,18b 研削ホイール
20a,20b 研削砥石
22a,22b コラム
24a,24b 加工送りユニット
26a,26b カセット載置台(カセット載置領域)
28a,28b カセット
30 ウェーハ搬送ロボット
32 位置決めテーブル
34 ウェーハ搬入機構(ローディングアーム)
36 ウェーハ搬出機構(アンローディングアーム)
38 スピンナ洗浄装置
40,46 カメラユニット
42 制御ユニット
42a 判定部
42b 情報登録部
44 タッチパネル付きディスプレイ
48 加工条件表
50 種別
52 加工条件
54a,54b,54c,54d パターン
Claims (3)
- 上面に保持面を有し、該保持面に表面が対面したウェーハを保持するチャックテーブルと、
該チャックテーブルで保持したウェーハを裏面側から研削又は研磨する加工ユニットと、
ウェーハを収容するカセットが載置されるカセット載置領域に載置された該カセットから該ウェーハを搬出し、該ウェーハを該チャックテーブルへ搬送する搬送ユニットと、
該ウェーハを撮影してウェーハの該表面側に形成されたパターンが写る画像を取得するカメラユニットと、
該画像に写る該パターンが該加工ユニットで該ウェーハを加工する際の加工条件と紐付けられて登録される情報登録部と、
該カセットから搬出された加工前のウェーハから該加工条件に紐付けて該情報登録部に登録された該パターンを検出することで該加工前のウェーハが加工対象のウェーハであると判定する判定部と、
を備える加工装置において、該パターンを該加工条件に紐付けて該情報登録部に登録する際の加工装置の管理方法であって、
新たな種別のウェーハを加工する際の加工条件を該情報登録部に登録する加工条件登録ステップと、
該新たな種別のウェーハを収容したカセットが該カセット載置領域に載置された後、該新たな種別のウェーハを該搬送ユニットで該カセットから該チャックテーブルに搬送し、該加工条件登録ステップで登録した該加工条件で該加工ユニットで加工し、該搬送ユニットで該チャックテーブルから搬出する自動加工を該加工装置に実施させる自動加工プログラムを該加工装置に開始させる自動加工プログラム開始ステップと、
該自動加工プログラムに基づいて該搬送ユニットが該カセットから該新たな種別のウェーハを該チャックテーブルに搬送し該チャックテーブルが該新たな種別のウェーハを保持する過程で、該新たな種別のウェーハの該パターンが写る画像を該カメラユニットで形成する撮影ステップと、
該撮影ステップで形成された該画像に写る該パターンを該加工条件登録ステップで登録された該新たな加工条件に紐付けて該情報登録部に登録するパターン登録ステップと、を備えることを特徴とする加工装置の管理方法。 - 該新たな種別のウェーハは、該表面側に保護部材が貼着されており、
該カメラユニットは、赤外線カメラを有し、
該撮影ステップでは、
該新たな種別のウェーハは、該保護部材を介して該チャックテーブルで保持され、
該カメラユニットは、該新たな種別のウェーハの該裏面側から該ウェーハの該表面側を撮影することを特徴とする請求項1に記載の加工装置の管理方法。 - 該判定部は、該加工条件に紐付けて該情報登録部に登録される該保護部材に関する情報に基づいて該加工前のウェーハの該表面側に貼着された保護部材の有無及び適否を判定し、該保護部材が不適切であると判定した場合、及び、該加工前のウェーハに該保護部材が貼着されていないと判定した場合、該加工前のウェーハを該加工ユニットに加工させない機能をさらに有し、
該パターン登録ステップでは、該撮影ステップで形成された該画像から該保護部材に関する該情報を抽出して該加工条件に紐付けて該情報登録部に登録することを特徴とする請求項2に記載の加工装置の管理方法。
Priority Applications (3)
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JP2020079975A JP7423157B2 (ja) | 2020-04-30 | 2020-04-30 | 加工装置の管理方法 |
US17/224,328 US11738422B2 (en) | 2020-04-30 | 2021-04-07 | Management method of machining system |
CN202110458330.5A CN113594061A (zh) | 2020-04-30 | 2021-04-27 | 加工装置的管理方法 |
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JP2020079975A JP7423157B2 (ja) | 2020-04-30 | 2020-04-30 | 加工装置の管理方法 |
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JP7423157B2 true JP7423157B2 (ja) | 2024-01-29 |
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Citations (6)
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JP2013158880A (ja) | 2012-02-03 | 2013-08-19 | Disco Corp | 研削装置 |
JP2014203837A (ja) | 2013-04-01 | 2014-10-27 | 株式会社ディスコ | キーパターン検出方法、及び、アライメント方法 |
JP2014223708A (ja) | 2013-05-17 | 2014-12-04 | 株式会社ディスコ | 加工装置 |
JP2017219364A (ja) | 2016-06-06 | 2017-12-14 | 株式会社ディスコ | ウェーハの外周位置を検出するウェーハの検出方法及びウェーハの外周位置を検出することが可能な加工装置 |
JP2018148140A (ja) | 2017-03-08 | 2018-09-20 | 株式会社ディスコ | 研削装置 |
JP2019115963A (ja) | 2017-12-27 | 2019-07-18 | 株式会社ディスコ | 切削装置 |
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US7241200B2 (en) * | 2005-03-23 | 2007-07-10 | Control Systems Technologies, Llc | Control system and method for processing jewelry and the like |
JP6957096B2 (ja) * | 2017-08-22 | 2021-11-02 | 株式会社ディスコ | ドレッシングボード、その使用方法及び切削装置 |
JP6906859B2 (ja) | 2017-09-13 | 2021-07-21 | 株式会社ディスコ | 加工装置 |
US11724401B2 (en) * | 2019-11-13 | 2023-08-15 | Nvidia Corporation | Grasp determination for an object in clutter |
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2020
- 2020-04-30 JP JP2020079975A patent/JP7423157B2/ja active Active
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2021
- 2021-04-07 US US17/224,328 patent/US11738422B2/en active Active
- 2021-04-27 CN CN202110458330.5A patent/CN113594061A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013158880A (ja) | 2012-02-03 | 2013-08-19 | Disco Corp | 研削装置 |
JP2014203837A (ja) | 2013-04-01 | 2014-10-27 | 株式会社ディスコ | キーパターン検出方法、及び、アライメント方法 |
JP2014223708A (ja) | 2013-05-17 | 2014-12-04 | 株式会社ディスコ | 加工装置 |
JP2017219364A (ja) | 2016-06-06 | 2017-12-14 | 株式会社ディスコ | ウェーハの外周位置を検出するウェーハの検出方法及びウェーハの外周位置を検出することが可能な加工装置 |
JP2018148140A (ja) | 2017-03-08 | 2018-09-20 | 株式会社ディスコ | 研削装置 |
JP2019115963A (ja) | 2017-12-27 | 2019-07-18 | 株式会社ディスコ | 切削装置 |
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US20210339358A1 (en) | 2021-11-04 |
US11738422B2 (en) | 2023-08-29 |
JP2021174953A (ja) | 2021-11-01 |
CN113594061A (zh) | 2021-11-02 |
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