JP7200969B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7200969B2
JP7200969B2 JP2020071347A JP2020071347A JP7200969B2 JP 7200969 B2 JP7200969 B2 JP 7200969B2 JP 2020071347 A JP2020071347 A JP 2020071347A JP 2020071347 A JP2020071347 A JP 2020071347A JP 7200969 B2 JP7200969 B2 JP 7200969B2
Authority
JP
Japan
Prior art keywords
component mounting
mounting portion
support beam
electronic device
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020071347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021168356A (ja
JP2021168356A5 (https=
Inventor
啓太郎 伊藤
照久 明石
博文 船橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2020071347A priority Critical patent/JP7200969B2/ja
Priority to CN202180019768.1A priority patent/CN115280905A/zh
Priority to PCT/JP2021/014762 priority patent/WO2021206122A1/ja
Publication of JP2021168356A publication Critical patent/JP2021168356A/ja
Publication of JP2021168356A5 publication Critical patent/JP2021168356A5/ja
Priority to US17/867,255 priority patent/US12185467B2/en
Application granted granted Critical
Publication of JP7200969B2 publication Critical patent/JP7200969B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2020071347A 2020-04-10 2020-04-10 電子装置 Active JP7200969B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020071347A JP7200969B2 (ja) 2020-04-10 2020-04-10 電子装置
CN202180019768.1A CN115280905A (zh) 2020-04-10 2021-04-07 电子装置
PCT/JP2021/014762 WO2021206122A1 (ja) 2020-04-10 2021-04-07 電子装置
US17/867,255 US12185467B2 (en) 2020-04-10 2022-07-18 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020071347A JP7200969B2 (ja) 2020-04-10 2020-04-10 電子装置

Publications (3)

Publication Number Publication Date
JP2021168356A JP2021168356A (ja) 2021-10-21
JP2021168356A5 JP2021168356A5 (https=) 2022-03-04
JP7200969B2 true JP7200969B2 (ja) 2023-01-10

Family

ID=78022878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020071347A Active JP7200969B2 (ja) 2020-04-10 2020-04-10 電子装置

Country Status (4)

Country Link
US (1) US12185467B2 (https=)
JP (1) JP7200969B2 (https=)
CN (1) CN115280905A (https=)
WO (1) WO2021206122A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7310598B2 (ja) * 2019-12-25 2023-07-19 株式会社デンソー 電子装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006141A1 (en) 2003-07-10 2005-01-13 Stillabower Morris D. Circuit assembly having compliant substrate structures for mounting circuit devices
JP2006309184A (ja) 2005-03-30 2006-11-09 Sanyo Epson Imaging Devices Corp 電気光学装置、電気光学装置の製造方法、実装構造体及び電子機器
US20160150652A1 (en) 2013-07-15 2016-05-26 Novalia Ltd Circuit sheet arrangement
WO2016084630A1 (ja) 2014-11-27 2016-06-02 ソニー株式会社 回路基板および電子機器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057152U (ja) * 1983-04-28 1985-04-20 株式会社東芝 プリント配線板
JPS63241979A (ja) * 1987-03-30 1988-10-07 沖電気工業株式会社 印刷配線板
JPS6447086U (https=) * 1987-09-17 1989-03-23
JPH01289186A (ja) * 1988-05-16 1989-11-21 Toyo Commun Equip Co Ltd プリント基板
JPH0595074U (ja) * 1992-05-29 1993-12-24 株式会社村田製作所 回路基板
JPH11337571A (ja) * 1998-05-27 1999-12-10 Japan Aviation Electronics Ind Ltd 慣性センサ
JP2004119624A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Works Ltd 回路基板
KR101391040B1 (ko) * 2007-08-09 2014-04-30 삼성전자주식회사 인쇄회로 기판 및 그 제조 방법과 그를 이용한 전자 기기
JP4946965B2 (ja) 2008-04-17 2012-06-06 富士通株式会社 電子部品実装装置及びその製造方法
JP5062022B2 (ja) 2008-05-08 2012-10-31 富士通株式会社 電子部品装置
JP2011159840A (ja) 2010-02-02 2011-08-18 Panasonic Corp 電子部品の実装接続構造
JP2012039033A (ja) * 2010-08-11 2012-02-23 Clarion Co Ltd 電子回路基板、ナビゲーション装置
JP6354286B2 (ja) 2013-12-24 2018-07-11 アイシン精機株式会社 半導体装置
US11026322B2 (en) * 2018-10-09 2021-06-01 Trw Automotive U.S. Llc PCB strain relief
JP7310598B2 (ja) 2019-12-25 2023-07-19 株式会社デンソー 電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006141A1 (en) 2003-07-10 2005-01-13 Stillabower Morris D. Circuit assembly having compliant substrate structures for mounting circuit devices
JP2006309184A (ja) 2005-03-30 2006-11-09 Sanyo Epson Imaging Devices Corp 電気光学装置、電気光学装置の製造方法、実装構造体及び電子機器
US20160150652A1 (en) 2013-07-15 2016-05-26 Novalia Ltd Circuit sheet arrangement
WO2016084630A1 (ja) 2014-11-27 2016-06-02 ソニー株式会社 回路基板および電子機器

Also Published As

Publication number Publication date
JP2021168356A (ja) 2021-10-21
US12185467B2 (en) 2024-12-31
US20220353996A1 (en) 2022-11-03
CN115280905A (zh) 2022-11-01
WO2021206122A1 (ja) 2021-10-14

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