JP7192132B1 - 基板ホルダ、めっき装置、及びめっき装置の製造方法 - Google Patents
基板ホルダ、めっき装置、及びめっき装置の製造方法 Download PDFInfo
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- JP7192132B1 JP7192132B1 JP2021539016A JP2021539016A JP7192132B1 JP 7192132 B1 JP7192132 B1 JP 7192132B1 JP 2021539016 A JP2021539016 A JP 2021539016A JP 2021539016 A JP2021539016 A JP 2021539016A JP 7192132 B1 JP7192132 B1 JP 7192132B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 192
- 238000007747 plating Methods 0.000 title claims abstract description 151
- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000013459 approach Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000032258 transport Effects 0.000 description 23
- 238000004088 simulation Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 230000005684 electric field Effects 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 11
- 238000009826 distribution Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/008102 WO2022185435A1 (ja) | 2021-03-03 | 2021-03-03 | 基板ホルダ、めっき装置、及びめっき装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022185435A1 JPWO2022185435A1 (ko) | 2022-09-09 |
| JP7192132B1 true JP7192132B1 (ja) | 2022-12-19 |
Family
ID=83154003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021539016A Active JP7192132B1 (ja) | 2021-03-03 | 2021-03-03 | 基板ホルダ、めっき装置、及びめっき装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230383431A1 (ko) |
| JP (1) | JP7192132B1 (ko) |
| KR (1) | KR102553048B1 (ko) |
| CN (1) | CN116324045B (ko) |
| WO (1) | WO2022185435A1 (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
| JP2016079504A (ja) * | 2014-10-16 | 2016-05-16 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159354A (en) | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
| JP4764899B2 (ja) * | 2008-04-25 | 2011-09-07 | 株式会社荏原製作所 | 基板めっき用治具、基板めっき装置 |
| JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP6317299B2 (ja) * | 2015-08-28 | 2018-04-25 | 株式会社荏原製作所 | めっき装置、めっき方法、及び基板ホルダ |
| JP2017137519A (ja) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | めっき装置 |
| JP6659467B2 (ja) * | 2016-06-03 | 2020-03-04 | 株式会社荏原製作所 | めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
| JP2020105576A (ja) | 2018-12-27 | 2020-07-09 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
-
2021
- 2021-03-03 US US18/027,588 patent/US20230383431A1/en active Pending
- 2021-03-03 KR KR1020237008184A patent/KR102553048B1/ko active IP Right Grant
- 2021-03-03 WO PCT/JP2021/008102 patent/WO2022185435A1/ja active Application Filing
- 2021-03-03 CN CN202180064554.6A patent/CN116324045B/zh active Active
- 2021-03-03 JP JP2021539016A patent/JP7192132B1/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
| JP2016079504A (ja) * | 2014-10-16 | 2016-05-16 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116324045B (zh) | 2023-12-08 |
| US20230383431A1 (en) | 2023-11-30 |
| JPWO2022185435A1 (ko) | 2022-09-09 |
| WO2022185435A1 (ja) | 2022-09-09 |
| KR102553048B1 (ko) | 2023-07-10 |
| KR20230038606A (ko) | 2023-03-20 |
| CN116324045A (zh) | 2023-06-23 |
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