JP7186271B2 - 積層体、タッチセンサ、調光素子、光電変換素子、熱線制御部材、アンテナ、電磁波シールド部材および画像表示装置 - Google Patents
積層体、タッチセンサ、調光素子、光電変換素子、熱線制御部材、アンテナ、電磁波シールド部材および画像表示装置 Download PDFInfo
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- JP7186271B2 JP7186271B2 JP2021160979A JP2021160979A JP7186271B2 JP 7186271 B2 JP7186271 B2 JP 7186271B2 JP 2021160979 A JP2021160979 A JP 2021160979A JP 2021160979 A JP2021160979 A JP 2021160979A JP 7186271 B2 JP7186271 B2 JP 7186271B2
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- transparent conductive
- conductive layer
- main surface
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- resin
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- 229920001225 polyester resin Polymers 0.000 claims description 3
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- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
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- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
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- C01G19/02—Oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L31/0232—Optical elements or arrangements associated with the device
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- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- C—CHEMISTRY; METALLURGY
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- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Condensed Matter Physics & Semiconductors (AREA)
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- Crystallography & Structural Chemistry (AREA)
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Description
例えば、観察できない程度の微細な凹凸、波打ちは、許容される。
R1<R2 (2)
式中、R1は、第1ガス供給機61から供給される酸素ガス流量の比である。R2は、第2ガス供給機62から供給される酸素ガス流量の比である。R3は、第3ガス供給機63から供給される酸素ガス流量の比である。R4は、第4ガス供給機64から供給される酸素ガス流量の比である。R5は、第5ガス供給機65から供給される酸素ガス流量の比である。
この透明導電層3は、一の第1粒界7Aの第1中間部11から分岐し、他の第1粒界7Bの第2中間部12に至る第2粒界8を有する。そのため、第2主面6に水が接触しても、第2主面6から第1主面5に至る水の経路を長く確保することができる。その結果、透明導電層3は、耐透湿性に優れる。また、透明導電層3を備える透明導電性シート1も、耐透湿性に優れる。
以下の各変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態およびその変形例を適宜組み合わせることができる。
まず、PETフィルムロール(三菱樹脂社製、厚み50μm)を用意した。
表1の記載に従って、成膜条件と透明導電層3の厚みとを変更した以外は、実施例1と同様に処理した。
下記の項目を評価した。それらの結果を表1に示す。
透明導電層3の厚みを、透過型電子顕微鏡(日立製作所製、装置名「HF-2000」)を用いた断面観察により、求めた。
FIBマイクロサンプリング法により、実施例1および比較例1のそれぞれの透明導電層3の透明導電性シート1を断面調製した後、それぞれの透明導電層3の断面をFE-TEM観察した。なお、倍率を、少なくとも第1粒界7が観察できるように、設定した。
FIB装置; Hitachi製 FB2200、 加速電圧: 10kV
FE-TEM 装置; JEOL製 JEM-2800、加速電圧: 200kV
実施例1および比較例1のそれぞれの透明導電層3の表面抵抗を四端子法により測定した。
実施例1および比較例1のそれぞれの透明導電層3の透湿度を、水蒸気透過率測定装置(「PERMATRAN W3/33」、MOCON社製)を用いて、温度40℃、相対湿度90%の条件で、測定した。なお、測定に際して、基材シート2の基材第2主面22を、検出器側に配置した。
3 透明導電層
2 基材シート
4 結晶粒
5 第1主面
6 第2主面
7 第1粒界
8 第2粒界
9 頂点
11 第1中間部
12 第2中間部
Claims (8)
- 基材シートまたは機能層と、透明導電層とを厚み方向一方側に向かって順に備え、
前記透明導電層は、第1主面、および、前記第1主面と厚み方向に対向し、前記基材シートまたは前記機能層の前記厚み方向の一方面に接触する第2主面を備え、
前記透明導電層は、前記厚み方向に直交する面方向に延びる単一の層であり、
前記透明導電層は、
複数の結晶粒と、
前記複数の結晶粒を仕切り、厚み方向一端縁および他端縁のそれぞれが前記第1主面および前記第2主面のそれぞれにおいて開放される複数の第1粒界と、
一の前記第1粒界の厚み方向中間部から分岐し、前記一の第1粒界に隣接する他の前記第1粒界の厚み方向中間部に至る第2粒界とを有し、
前記基材シートは、ポリエステル樹脂、(メタ)アクリル樹脂、オレフィン樹脂、ポリカーボネート樹脂、ポリエーテルスルフォン樹脂、ポリアリレート樹脂、メラミン樹脂、ポリアミド樹脂、ポリイミド樹脂、セルロース樹脂、ポリスチレン樹脂、および、ノルボルネン樹脂からなる群から選択される少なくとも1種からなり、
前記機能層は、有機材料を含む、積層体。 - 請求項1に記載の積層体を備える、タッチセンサ。
- 請求項1に記載の積層体を備える、調光素子。
- 請求項1に記載の積層体を備える、光電変換素子。
- 請求項1に記載の積層体を備える、熱線制御部材。
- 請求項1に記載の積層体を備える、アンテナ。
- 請求項1に記載の積層体を備える、電磁波シールド部材。
- 請求項1に記載の積層体を備える、画像表示装置。
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