JP7178749B2 - 回路パターン連続製造装置 - Google Patents
回路パターン連続製造装置 Download PDFInfo
- Publication number
- JP7178749B2 JP7178749B2 JP2021531027A JP2021531027A JP7178749B2 JP 7178749 B2 JP7178749 B2 JP 7178749B2 JP 2021531027 A JP2021531027 A JP 2021531027A JP 2021531027 A JP2021531027 A JP 2021531027A JP 7178749 B2 JP7178749 B2 JP 7178749B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- continuous
- transfer film
- plating
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0628—In vertical cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Description
転写フィルムを水平方向に広がった状態にアンワインディングするアンワインダーを構成する。
転写フィルムを水平方向に広がった状態にアンワインディングするアンワインダーを構成する。
以下,例示的な実施例を添付図面を参照してより詳細に記述し,これらの図面において同一の参照符号は同一の要素を指す。
Claims (6)
- ロールツーロール工程及び連続電鋳工程を適用した回路パターン連続製造装置において,
転写フィルムを水平方向に広がった状態にアンワインディングするアンワインダー;
回転する陰極ドラムの表面上に電鋳めっきによって第1金属層からなる回路パターンを形成する回転ドラム型連続電鋳部;
前記回転ドラム型連続電鋳部の陰極ドラムの表面上に形成された回路パターンを,前記転写フィルムに転写する連続転写部;
前記転写フィルムに転写された回路パターンに前記回転ドラム型連続電鋳部と同一の材質の金属からなる第2金属層を追加でめっきして設ける第1水平めっき槽;
第2金属層上に前記連続電鋳部と互いに異なる材質の金属からなる第3金属層をめっきして設ける第2水平めっき槽;及び
前記転写フィルムをリワインディングするリワインダー;
を含み,
第1水平めっき槽によって追加的にめっきすることで回路パターンの厚さを調節して,
第2水平めっき槽によって第2金属層の上に延性及び剛性を調節するため第3金属層をめっきすることで合金で形成された回路パターンを形成することを特徴とする回路パターン連続製造装置。 - ロールツーロール工程及び連続電鋳工程を適用した回路パターン連続製造装置において,
転写フィルムを水平方向に広がった状態にアンワインディングするアンワインダー;
回転する陰極ドラムの表面上に電鋳めっきによって第1金属層からなる回路パターンを形成する回転ドラム型連続電鋳部;
前記回転ドラム型連続電鋳部の陰極ドラムの表面上に形成された回路パターンを,前記転写フィルムに転写する連続転写部;
前記転写フィルムを水平方向に広がった状態から垂直方向に立てられた状態に切り換える第1ターンバー;
垂直方向に切り換えられて移送する転写フィルムに転写された回路パターンに前記連続電鋳部と同一の材質の金属からなる第2金属層をめっきして設ける第1垂直めっき槽;
前記転写フィルムをリワインディングするリワインダー;
を含むことを特徴とする回路パターン連続製造装置。 - 前記リワインダーの前段に,第1垂直めっき槽を通る転写フィルムを垂直方向に立てられた状態から水平方向に広がった状態に切り換える第2ターンバー;
をさらに含むことを特徴とする請求項2記載の回路パターン連続製造装置。 - 前記第1垂直めっき槽と前記リワインダーとの間に,前記第2金属層上に前記連続電鋳部と互いに異なる材質の金属からなる第3金属層をめっきして設ける第2垂直めっき槽をさらに含むことを特徴とする請求項2記載の回路パターン連続製造装置。
- 前記リワインダーの前段に,前記第2垂直めっき槽を通る転写フィルムを垂直方向に立てられた状態から水平方向に広がった状態に切り換える第2ターンバーをさらに含むことを特徴とする請求項4記載の回路パターン連続製造装置。
- 前記回転ドラム型連続電鋳部,前記第1ターンバー,前記第1垂直めっき槽,前記第2垂直めっき槽,前記第2ターンバーが「コ」字状をなすように配置されたことを特徴とする請求項5記載の回路パターン連続製造装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0150906 | 2018-11-29 | ||
KR1020180150906A KR102152892B1 (ko) | 2018-11-29 | 2018-11-29 | 회로 패턴 연속 제조 장치 |
PCT/KR2019/016410 WO2020111751A1 (ko) | 2018-11-29 | 2019-11-27 | 회로 패턴 연속 제조 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022510952A JP2022510952A (ja) | 2022-01-28 |
JP7178749B2 true JP7178749B2 (ja) | 2022-11-28 |
Family
ID=70852880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021531027A Active JP7178749B2 (ja) | 2018-11-29 | 2019-11-27 | 回路パターン連続製造装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220010445A1 (ja) |
EP (1) | EP3890458A4 (ja) |
JP (1) | JP7178749B2 (ja) |
KR (1) | KR102152892B1 (ja) |
WO (1) | WO2020111751A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230163621A (ko) * | 2022-05-23 | 2023-12-01 | 삼원액트 주식회사 | 초고주파용 저손실 플랫케이블 신호선 , 이를 이용한 가요성인쇄회로기판 및 가요성인쇄회로기판 연속제조장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014062294A (ja) | 2012-09-20 | 2014-04-10 | Think Laboratory Co Ltd | 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT394215B (de) * | 1988-11-15 | 1992-02-25 | Andritz Ag Maschf | Verfahren zur elektrolytischen herstellung einer metallfolie |
JP3015651B2 (ja) * | 1994-02-15 | 2000-03-06 | 新日本製鐵株式会社 | 連続式電気めっき方法 |
JPH0835097A (ja) * | 1994-07-22 | 1996-02-06 | Sumitomo Metal Mining Co Ltd | 縦型連続電気めっき装置のアノード構造 |
EP1225253A1 (en) * | 2001-01-22 | 2002-07-24 | DSL Dresden Material-Innovation GmbH | A continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process |
WO2003106740A1 (ja) * | 2002-06-17 | 2003-12-24 | 東レ株式会社 | めっき被膜付きフィルムの製造方法、めっき用 陰極ロール、ならびに、回路基板の製造方法 |
US7926758B2 (en) * | 2006-07-31 | 2011-04-19 | Industrial Technology Research Institute | Apparatus and system for roll-to-roll processing |
JP2009071225A (ja) * | 2007-09-18 | 2009-04-02 | Konica Minolta Holdings Inc | 透明電磁波遮断フィルムの製造方法、透明電磁波遮断フィルム及びプラズマディスプレイパネル |
KR101132339B1 (ko) * | 2009-09-28 | 2012-04-05 | (주)이모트 | 금속메쉬 연속제조 장치 및 방법 |
KR101606724B1 (ko) | 2014-12-03 | 2016-03-28 | 주식회사 에스아이 플렉스 | 인쇄회로기판의 롤투롤 제조 방법 |
JP5941525B2 (ja) * | 2014-12-19 | 2016-06-29 | 東洋鋼鈑株式会社 | 表面処理鋼板の製造方法 |
-
2018
- 2018-11-29 KR KR1020180150906A patent/KR102152892B1/ko active IP Right Grant
-
2019
- 2019-11-27 JP JP2021531027A patent/JP7178749B2/ja active Active
- 2019-11-27 EP EP19889068.3A patent/EP3890458A4/en not_active Withdrawn
- 2019-11-27 WO PCT/KR2019/016410 patent/WO2020111751A1/ko unknown
- 2019-11-27 US US17/295,007 patent/US20220010445A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014062294A (ja) | 2012-09-20 | 2014-04-10 | Think Laboratory Co Ltd | 連続パターンメッキ転写システム及び連続パターンメッキ転写物製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220010445A1 (en) | 2022-01-13 |
EP3890458A4 (en) | 2022-09-14 |
WO2020111751A1 (ko) | 2020-06-04 |
JP2022510952A (ja) | 2022-01-28 |
KR102152892B1 (ko) | 2020-09-07 |
EP3890458A1 (en) | 2021-10-06 |
KR20200064614A (ko) | 2020-06-08 |
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