JP7176532B2 - 半導体装置、半導体装置の製造方法及び接着剤 - Google Patents
半導体装置、半導体装置の製造方法及び接着剤 Download PDFInfo
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
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- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H—ELECTRICITY
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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PCT/JP2017/045333 WO2019123518A1 (ja) | 2017-12-18 | 2017-12-18 | 半導体装置、半導体装置の製造方法及び接着剤 |
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Citations (8)
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WO2011007531A1 (ja) | 2009-07-17 | 2011-01-20 | 住友ベークライト株式会社 | 電子部品の製造方法および電子部品 |
JP2013168536A (ja) | 2012-02-16 | 2013-08-29 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
JP2014107355A (ja) | 2012-11-26 | 2014-06-09 | Sekisui Chem Co Ltd | 半導体装置の製造方法 |
JP2014158046A (ja) | 2008-12-24 | 2014-08-28 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
JP2015216317A (ja) | 2014-05-13 | 2015-12-03 | 日東電工株式会社 | 半導体装置の製造方法 |
WO2016148121A1 (ja) | 2015-03-19 | 2016-09-22 | ナミックス株式会社 | フリップチップ実装体の製造方法、フリップチップ実装体、および先供給型アンダーフィル用樹脂組成物 |
JP2016201418A (ja) | 2015-04-08 | 2016-12-01 | 積水化学工業株式会社 | 半導体接合用接着フィルム及び半導体装置の製造方法 |
JP2017162927A (ja) | 2016-03-08 | 2017-09-14 | 日立化成株式会社 | 半導体装置を製造する方法 |
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JP5912611B2 (ja) * | 2004-03-22 | 2016-04-27 | 日立化成株式会社 | フィルム状接着剤 |
JP5217260B2 (ja) | 2007-04-27 | 2013-06-19 | 住友ベークライト株式会社 | 半導体ウエハーの接合方法および半導体装置の製造方法 |
JP5263158B2 (ja) * | 2007-12-03 | 2013-08-14 | 日立化成株式会社 | 回路部材接続用接着剤及び半導体装置 |
JP5471163B2 (ja) * | 2009-08-25 | 2014-04-16 | 住友ベークライト株式会社 | 半導体装置の製造方法 |
JP5564151B1 (ja) * | 2012-08-06 | 2014-07-30 | 積水化学工業株式会社 | 半導体装置の製造方法及びフリップチップ実装用接着剤 |
JP6257303B2 (ja) * | 2013-12-17 | 2018-01-10 | デクセリアルズ株式会社 | 接続体の製造方法、接続方法、及び接続体 |
JP6544146B2 (ja) * | 2015-08-27 | 2019-07-17 | 日立化成株式会社 | 半導体装置及びそれを製造する方法 |
CN108352333B (zh) * | 2015-10-29 | 2021-07-20 | 昭和电工材料株式会社 | 半导体用粘接剂、半导体装置以及制造该半导体装置的方法 |
SG11201809734RA (en) * | 2016-05-09 | 2018-12-28 | Hitachi Chemical Co Ltd | Method for manufacturing semiconductor device |
JP2017220519A (ja) * | 2016-06-06 | 2017-12-14 | 日立化成株式会社 | 半導体装置の製造方法 |
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JP2014158046A (ja) | 2008-12-24 | 2014-08-28 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
WO2011007531A1 (ja) | 2009-07-17 | 2011-01-20 | 住友ベークライト株式会社 | 電子部品の製造方法および電子部品 |
JP2013168536A (ja) | 2012-02-16 | 2013-08-29 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
JP2014107355A (ja) | 2012-11-26 | 2014-06-09 | Sekisui Chem Co Ltd | 半導体装置の製造方法 |
JP2015216317A (ja) | 2014-05-13 | 2015-12-03 | 日東電工株式会社 | 半導体装置の製造方法 |
WO2016148121A1 (ja) | 2015-03-19 | 2016-09-22 | ナミックス株式会社 | フリップチップ実装体の製造方法、フリップチップ実装体、および先供給型アンダーフィル用樹脂組成物 |
JP2016201418A (ja) | 2015-04-08 | 2016-12-01 | 積水化学工業株式会社 | 半導体接合用接着フィルム及び半導体装置の製造方法 |
JP2017162927A (ja) | 2016-03-08 | 2017-09-14 | 日立化成株式会社 | 半導体装置を製造する方法 |
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CN111480218A (zh) | 2020-07-31 |
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