JP7155214B2 - プリント回路板及び電子機器 - Google Patents

プリント回路板及び電子機器 Download PDF

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Publication number
JP7155214B2
JP7155214B2 JP2020162548A JP2020162548A JP7155214B2 JP 7155214 B2 JP7155214 B2 JP 7155214B2 JP 2020162548 A JP2020162548 A JP 2020162548A JP 2020162548 A JP2020162548 A JP 2020162548A JP 7155214 B2 JP7155214 B2 JP 7155214B2
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Japan
Prior art keywords
land
circuit board
printed circuit
electronic component
solder
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JP2020162548A
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English (en)
Japanese (ja)
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JP2021007163A (ja
JP2021007163A5 (enrdf_load_stackoverflow
Inventor
光利 長谷川
邦彦 峰岸
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020162548A priority Critical patent/JP7155214B2/ja
Publication of JP2021007163A publication Critical patent/JP2021007163A/ja
Publication of JP2021007163A5 publication Critical patent/JP2021007163A5/ja
Priority to JP2022157780A priority patent/JP7350960B2/ja
Application granted granted Critical
Publication of JP7155214B2 publication Critical patent/JP7155214B2/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
JP2020162548A 2020-09-28 2020-09-28 プリント回路板及び電子機器 Active JP7155214B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020162548A JP7155214B2 (ja) 2020-09-28 2020-09-28 プリント回路板及び電子機器
JP2022157780A JP7350960B2 (ja) 2020-09-28 2022-09-30 プリント回路板及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020162548A JP7155214B2 (ja) 2020-09-28 2020-09-28 プリント回路板及び電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018188696A Division JP6772232B2 (ja) 2018-10-03 2018-10-03 プリント回路板及び電子機器

Related Child Applications (1)

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JP2022157780A Division JP7350960B2 (ja) 2020-09-28 2022-09-30 プリント回路板及び電子機器

Publications (3)

Publication Number Publication Date
JP2021007163A JP2021007163A (ja) 2021-01-21
JP2021007163A5 JP2021007163A5 (enrdf_load_stackoverflow) 2021-11-25
JP7155214B2 true JP7155214B2 (ja) 2022-10-18

Family

ID=74165396

Family Applications (2)

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JP2020162548A Active JP7155214B2 (ja) 2020-09-28 2020-09-28 プリント回路板及び電子機器
JP2022157780A Active JP7350960B2 (ja) 2020-09-28 2022-09-30 プリント回路板及び電子機器

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JP2022157780A Active JP7350960B2 (ja) 2020-09-28 2022-09-30 プリント回路板及び電子機器

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JP (2) JP7155214B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022250088A1 (ja) * 2021-05-26 2022-12-01 三菱電機株式会社 プリント基板およびその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519580A (en) 1994-09-09 1996-05-21 Intel Corporation Method of controlling solder ball size of BGA IC components
US6201305B1 (en) 2000-06-09 2001-03-13 Amkor Technology, Inc. Making solder ball mounting pads on substrates
US20040113285A1 (en) 2002-12-17 2004-06-17 Tay Cheng Siew Method and apparatus for reducing electrical interconnection fatigue
JP2007273564A (ja) 2006-03-30 2007-10-18 Toshiba Corp プリント回路板、半導体パッケージ、および電子機器
JP2007305753A (ja) 2006-05-10 2007-11-22 Denso Corp 半導体装置及びその実装構造
JP2008294014A (ja) 2007-05-22 2008-12-04 Canon Inc 半導体装置
US20170141063A1 (en) 2015-11-18 2017-05-18 Samsung Electro-Mechanics Co., Ltd. Electronic component package and electronic device including the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3211746B2 (ja) * 1997-09-19 2001-09-25 株式会社デンソー 電子部品の実装構造
JPH11297889A (ja) * 1998-04-16 1999-10-29 Sony Corp 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法
JP6750872B2 (ja) * 2016-09-01 2020-09-02 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519580A (en) 1994-09-09 1996-05-21 Intel Corporation Method of controlling solder ball size of BGA IC components
US6201305B1 (en) 2000-06-09 2001-03-13 Amkor Technology, Inc. Making solder ball mounting pads on substrates
US20040113285A1 (en) 2002-12-17 2004-06-17 Tay Cheng Siew Method and apparatus for reducing electrical interconnection fatigue
JP2007273564A (ja) 2006-03-30 2007-10-18 Toshiba Corp プリント回路板、半導体パッケージ、および電子機器
JP2007305753A (ja) 2006-05-10 2007-11-22 Denso Corp 半導体装置及びその実装構造
JP2008294014A (ja) 2007-05-22 2008-12-04 Canon Inc 半導体装置
US20170141063A1 (en) 2015-11-18 2017-05-18 Samsung Electro-Mechanics Co., Ltd. Electronic component package and electronic device including the same

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Publication number Publication date
JP2022173486A (ja) 2022-11-18
JP7350960B2 (ja) 2023-09-26
JP2021007163A (ja) 2021-01-21

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