JP2021007163A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2021007163A5 JP2021007163A5 JP2020162548A JP2020162548A JP2021007163A5 JP 2021007163 A5 JP2021007163 A5 JP 2021007163A5 JP 2020162548 A JP2020162548 A JP 2020162548A JP 2020162548 A JP2020162548 A JP 2020162548A JP 2021007163 A5 JP2021007163 A5 JP 2021007163A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- land
- board according
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020162548A JP7155214B2 (ja) | 2020-09-28 | 2020-09-28 | プリント回路板及び電子機器 |
| JP2022157780A JP7350960B2 (ja) | 2020-09-28 | 2022-09-30 | プリント回路板及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020162548A JP7155214B2 (ja) | 2020-09-28 | 2020-09-28 | プリント回路板及び電子機器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018188696A Division JP6772232B2 (ja) | 2018-10-03 | 2018-10-03 | プリント回路板及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022157780A Division JP7350960B2 (ja) | 2020-09-28 | 2022-09-30 | プリント回路板及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021007163A JP2021007163A (ja) | 2021-01-21 |
| JP2021007163A5 true JP2021007163A5 (enrdf_load_stackoverflow) | 2021-11-25 |
| JP7155214B2 JP7155214B2 (ja) | 2022-10-18 |
Family
ID=74165396
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020162548A Active JP7155214B2 (ja) | 2020-09-28 | 2020-09-28 | プリント回路板及び電子機器 |
| JP2022157780A Active JP7350960B2 (ja) | 2020-09-28 | 2022-09-30 | プリント回路板及び電子機器 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022157780A Active JP7350960B2 (ja) | 2020-09-28 | 2022-09-30 | プリント回路板及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7155214B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022250088A1 (ja) * | 2021-05-26 | 2022-12-01 | 三菱電機株式会社 | プリント基板およびその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519580A (en) | 1994-09-09 | 1996-05-21 | Intel Corporation | Method of controlling solder ball size of BGA IC components |
| JP3211746B2 (ja) * | 1997-09-19 | 2001-09-25 | 株式会社デンソー | 電子部品の実装構造 |
| JPH11297889A (ja) * | 1998-04-16 | 1999-10-29 | Sony Corp | 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法 |
| US6201305B1 (en) | 2000-06-09 | 2001-03-13 | Amkor Technology, Inc. | Making solder ball mounting pads on substrates |
| US7173342B2 (en) | 2002-12-17 | 2007-02-06 | Intel Corporation | Method and apparatus for reducing electrical interconnection fatigue |
| JP2007273564A (ja) | 2006-03-30 | 2007-10-18 | Toshiba Corp | プリント回路板、半導体パッケージ、および電子機器 |
| JP4665827B2 (ja) | 2006-05-10 | 2011-04-06 | 株式会社デンソー | 半導体装置及びその実装構造 |
| JP5207659B2 (ja) | 2007-05-22 | 2013-06-12 | キヤノン株式会社 | 半導体装置 |
| KR101973427B1 (ko) | 2015-11-18 | 2019-04-29 | 삼성전기주식회사 | 전자부품 패키지 및 이를 포함하는 전자기기 |
| JP6750872B2 (ja) * | 2016-09-01 | 2020-09-02 | キヤノン株式会社 | プリント配線板、プリント回路板及び電子機器 |
-
2020
- 2020-09-28 JP JP2020162548A patent/JP7155214B2/ja active Active
-
2022
- 2022-09-30 JP JP2022157780A patent/JP7350960B2/ja active Active