JP7154159B2 - 成膜方法および成膜装置 - Google Patents
成膜方法および成膜装置 Download PDFInfo
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- JP7154159B2 JP7154159B2 JP2019048532A JP2019048532A JP7154159B2 JP 7154159 B2 JP7154159 B2 JP 7154159B2 JP 2019048532 A JP2019048532 A JP 2019048532A JP 2019048532 A JP2019048532 A JP 2019048532A JP 7154159 B2 JP7154159 B2 JP 7154159B2
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Description
金属または半導体である第1材料が露出する第1領域、およびOH基を有する絶縁材料である第2材料が露出する第2領域を有する基板を準備する工程と、
前記第1領域および前記第2領域のうちの前記第2領域に選択的に自己組織化単分子膜を形成する工程と、
前記第2領域に形成した前記自己組織化単分子膜を用いて、前記第1領域および前記第2領域のうちの前記第1領域に選択的に所望の対象膜を形成する工程と、
前記基板に対してClF3ガスを供給することにより、前記対象膜の形成時に前記第2領域に生じた生成物を除去する工程とを含む。
実施例1では、図2(a)に示す基板10を用意した。用意した基板10は、Low-k材料製の絶縁膜12のトレンチにRu製の導電膜11を形成し、導電膜11と絶縁膜12とをCMPによって平坦化したものであった。
参考例1~4では、膜厚24.8nmのRu膜20を、下地基板14であるシリコン単結晶基板の表面全体にCVD法で形成した基板を用意し、表1に示す条件以外、同一の条件でClF3ガスによってRu膜20をエッチングした。エッチング条件と、エッチング後のRu膜20の膜厚と、Ru膜20のエッチング速度とを表1にまとめて示す。
参考例5~10では、参考例1~4と同様に、膜厚24.8nmのRu膜20を、下地基板14であるシリコン単結晶基板の表面全体にCVD法で形成した基板を用意し、表2に示す条件以外、同一の条件でO3ガスによってRu膜20をエッチングした。エッチング条件を表2にまとめて示す。
参考例11では、導電膜40であるTiN膜を、下地基板14であるシリコン単結晶基板の表面全体にALD法で形成した基板を用意し、図4に示す方法でTiN膜をエッチングした。図4に示す工程S301~S302において、処理容器120の内部の気圧は533a(4Torr)であり、基板の温度は100℃であった。ClF3ガスの供給(工程S301)において、ClF3ガスの流量は20sccmであり、希釈ガスである窒素ガスの流量は2000sccmであり、ClF3ガスの分圧は5Pa(0.04Torr)であった。ClF3ガスの排出(工程S302)において、パージガスである窒素ガスの流量は2020sccmであった。1サイクル中、ClF3ガスの供給時間T1は2秒であり、ClF3ガスの排出時間T2は5秒であった。つまり、1サイクルの時間T(T=T1+T2)は7秒であり、1サイクルの時間Tに占めるClF3ガスの供給時間T1の割合(T1/T)は0.29であった。サイクルの目標回数N2は5回であった。
11 導電膜
12 絶縁膜
14 下地基板
20 Ru膜
21 生成物
30 SAM(自己組織化単分子膜)
40 導電膜
41 生成物
100 成膜装置
110 処理ユニット
120 処理容器
130 基板保持部
140 加熱器
150 ガス供給装置
160 ガス排出装置
170 搬送装置
180 制御装置
Claims (5)
- 金属または半導体である第1材料が露出する第1領域、およびOH基を有する絶縁材料である第2材料が露出する第2領域を有する基板を準備する工程と、
前記第1領域および前記第2領域のうちの前記第2領域に選択的に自己組織化単分子膜を形成する工程と、
前記第2領域に形成した前記自己組織化単分子膜を用いて、前記第1領域および前記第2領域のうちの前記第1領域に選択的に所望の対象膜を形成する工程と、
前記基板に対してClF3ガスを供給することにより、前記対象膜の形成時に前記第2領域に生じた生成物を除去する工程とを含む、成膜方法。 - 前記自己組織化単分子膜の形成前に、前記第1材料の水素終端処理を実施する工程を含む、請求項1に記載の成膜方法。
- 前記生成物を除去する工程は、前記基板を収容した処理容器の内部に前記ClF3ガスを供給することと、前記処理容器の内部への前記ClF3ガスの供給を停止した状態で前記処理容器の内部から前記ClF3ガスを排出することとを交互に繰り返し実施することを含む、請求項1又は2に記載の成膜方法。
- 前記対象膜の膜厚が目標膜厚になるまで、前記対象膜を形成する工程と前記生成物を除去する工程とが交互に繰り返される、請求項1~3のいずれか1項に記載の成膜方法。
- 処理容器と、
前記処理容器の内部で前記基板を保持する基板保持部と、
前記基板保持部で保持されている前記基板を加熱する加熱器と、
前記処理容器の内部にガスを供給するガス供給装置と、
前記処理容器の内部からガスを排出するガス排出装置と、
前記処理容器に対して前記基板を搬入出する搬送装置と、
請求項1~4のいずれか1項に記載の成膜方法を実施するように、前記加熱器、前記ガス供給装置、前記ガス排出装置および前記搬送装置を制御する制御装置とを備える、成膜装置。
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