JP7152123B2 - サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 - Google Patents
サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 Download PDFInfo
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- JP7152123B2 JP7152123B2 JP2021033282A JP2021033282A JP7152123B2 JP 7152123 B2 JP7152123 B2 JP 7152123B2 JP 2021033282 A JP2021033282 A JP 2021033282A JP 2021033282 A JP2021033282 A JP 2021033282A JP 7152123 B2 JP7152123 B2 JP 7152123B2
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- C—CHEMISTRY; METALLURGY
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- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
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- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C22B11/042—Recovery of noble metals from waste materials
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- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/42—Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
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- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/02—Electrolytic production, recovery or refining of metals by electrolysis of solutions of light metals
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
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- C25C1/06—Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/16—Electrolytic production, recovery or refining of metals by electrolysis of solutions of zinc, cadmium or mercury
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- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
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- C25C7/06—Operating or servicing
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- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
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- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
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- C25D3/00—Electroplating: Baths therefor
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- Automation & Control Theory (AREA)
- Hydrology & Water Resources (AREA)
- Manufacture And Refinement Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Treatment Of Water By Ion Exchange (AREA)
- Water Treatment By Sorption (AREA)
- Heat Treatment Of Water, Waste Water Or Sewage (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022153249A JP2022191277A (ja) | 2020-03-04 | 2022-09-27 | 有用材料サイクルにおけるサーキットボードおよび/または基板の製造 |
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20160862 | 2020-03-04 | ||
| EP20160862 | 2020-03-04 | ||
| EP20172923.3A EP3875638A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum aufbereiten eines fremdmetall- und metallsalz-haltigen mediums aus der leiterplatten- und/oder substrat-herstellung |
| EP20172960.5A EP3875640A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum aufbereiten eines metallsalz-haltigen mediums aus teilströmen der leiterplatten- und/oder substrat-herstellung |
| EP20172906.8A EP3875637A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum rückgewinnen eines elementaren metalls aus der leiterplatten- und/oder substrat-herstellung |
| EP20172960 | 2020-05-05 | ||
| EP20172923 | 2020-05-05 | ||
| EP20172981.1A EP3875642A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum aufbereiten eines spülwassers aus der leiterplatten- und/oder substrat-herstellung |
| EP20172906 | 2020-05-05 | ||
| EP20172928 | 2020-05-05 | ||
| EP20172928.2A EP3875639A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum herstellen von leiterplatten- und/oder substraten innerhalb eines wertstoffkreislaufs |
| EP20172981 | 2020-05-05 | ||
| EP20172971.2A EP3875641A1 (de) | 2020-03-04 | 2020-05-05 | Verfahren zum aufbereiten eines metallsalz-haltigen mediums aus einem ätzprozess der leiterplatten- und/oder substrat-herstellung |
| EP20172971 | 2020-05-05 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022153249A Division JP2022191277A (ja) | 2020-03-04 | 2022-09-27 | 有用材料サイクルにおけるサーキットボードおよび/または基板の製造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021137804A JP2021137804A (ja) | 2021-09-16 |
| JP7152123B2 true JP7152123B2 (ja) | 2022-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021033282A Active JP7152123B2 (ja) | 2020-03-04 | 2021-03-03 | サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 |
| JP2022153249A Pending JP2022191277A (ja) | 2020-03-04 | 2022-09-27 | 有用材料サイクルにおけるサーキットボードおよび/または基板の製造 |
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| JP2022153249A Pending JP2022191277A (ja) | 2020-03-04 | 2022-09-27 | 有用材料サイクルにおけるサーキットボードおよび/または基板の製造 |
Country Status (5)
| Country | Link |
|---|---|
| EP (6) | EP3875638A1 (enExample) |
| JP (2) | JP7152123B2 (enExample) |
| KR (2) | KR102558446B1 (enExample) |
| CN (2) | CN113355676B (enExample) |
| TW (2) | TWI795737B (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7752087B2 (ja) * | 2022-04-04 | 2025-10-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| EP4339165A1 (en) * | 2022-09-16 | 2024-03-20 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Separating a foreign metal from a process fluid, method and apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003501256A (ja) | 1999-06-15 | 2003-01-14 | ロディア・ポリアミド・インターミーディエッツ | 鉄を他の金属イオンから分離する方法、並びにアルコール及びケトンを酸化してカルボン酸にする反応において触媒を循環させる方法 |
| JP2003535223A (ja) | 2000-05-25 | 2003-11-25 | マイクロリス・コーポレイシヨン | メッキ浴の再生 |
| JP2004025133A (ja) | 2002-06-28 | 2004-01-29 | Matsushita Environment Airconditioning Eng Co Ltd | 排水処理装置及び排水処理方法 |
| US20060243604A1 (en) | 2003-04-30 | 2006-11-02 | Sota Nakagawa | Method and apparatus for treating waste water |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120012B2 (enExample) * | 1971-11-08 | 1976-06-22 | ||
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| DE2434305C2 (de) * | 1974-07-17 | 1983-09-29 | Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg | Ätzanlage |
| JPS5124537A (en) * | 1974-08-26 | 1976-02-27 | Hitachi Ltd | Etsuchinguyokuno saiseihoho |
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2020
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- 2021-03-02 KR KR1020210027371A patent/KR102558446B1/ko active Active
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Also Published As
| Publication number | Publication date |
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| EP3875639A1 (de) | 2021-09-08 |
| KR102558446B1 (ko) | 2023-07-20 |
| EP3875637A1 (de) | 2021-09-08 |
| JP2021137804A (ja) | 2021-09-16 |
| EP3875641A1 (de) | 2021-09-08 |
| KR20210113059A (ko) | 2021-09-15 |
| TW202219282A (zh) | 2022-05-16 |
| CN113355676B (zh) | 2024-05-24 |
| TWI795737B (zh) | 2023-03-11 |
| EP3875638A1 (de) | 2021-09-08 |
| TW202321471A (zh) | 2023-06-01 |
| JP2022191277A (ja) | 2022-12-27 |
| EP3875642A1 (de) | 2021-09-08 |
| KR20230113249A (ko) | 2023-07-28 |
| EP3875640A1 (de) | 2021-09-08 |
| CN113355676A (zh) | 2021-09-07 |
| TWI871576B (zh) | 2025-02-01 |
| CN118422201A (zh) | 2024-08-02 |
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