JP7152123B2 - サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 - Google Patents

サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 Download PDF

Info

Publication number
JP7152123B2
JP7152123B2 JP2021033282A JP2021033282A JP7152123B2 JP 7152123 B2 JP7152123 B2 JP 7152123B2 JP 2021033282 A JP2021033282 A JP 2021033282A JP 2021033282 A JP2021033282 A JP 2021033282A JP 7152123 B2 JP7152123 B2 JP 7152123B2
Authority
JP
Japan
Prior art keywords
metal salt
metal
solvent
stream
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021033282A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021137804A (ja
Inventor
クロチェク ジョランタ
エブナー クラウディア
フライ ゲーアハルト
シュライ マーティン
レドル アロイス
エビンガー クリストフ
ヘルツォーク ルネ
ザンカー アンドレアス
マンドル トーマス
グロス フリードリッヒ
カーン コンスタンティン
モイツィ ハインツ
Original Assignee
エーティーアンドエス オーストリア テクノロジー アンド システムテクニック アクツィエンゲゼルシャフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エーティーアンドエス オーストリア テクノロジー アンド システムテクニック アクツィエンゲゼルシャフト filed Critical エーティーアンドエス オーストリア テクノロジー アンド システムテクニック アクツィエンゲゼルシャフト
Publication of JP2021137804A publication Critical patent/JP2021137804A/ja
Priority to JP2022153249A priority Critical patent/JP2022191277A/ja
Application granted granted Critical
Publication of JP7152123B2 publication Critical patent/JP7152123B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/04Extraction of metal compounds from ores or concentrates by wet processes by leaching
    • C22B3/06Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F9/00Multistage treatment of water, waste water or sewage
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00Obtaining noble metals
    • C22B11/04Obtaining noble metals by wet processes
    • C22B11/042Recovery of noble metals from waste materials
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/20Treatment or purification of solutions, e.g. obtained by leaching
    • C22B3/42Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/18Acidic compositions for etching copper or alloys thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/02Electrolytic production, recovery or refining of metals by electrolysis of solutions of light metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/06Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/06Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese
    • C25C1/08Electrolytic production, recovery or refining of metals by electrolysis of solutions or iron group metals, refractory metals or manganese of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/14Electrolytic production, recovery or refining of metals by electrolysis of solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/16Electrolytic production, recovery or refining of metals by electrolysis of solutions of zinc, cadmium or mercury
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06Operating or servicing
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/20Regeneration of process solutions of rinse-solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/22Regeneration of process solutions by ion-exchange
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/002Etching of the substrate by chemical or physical means by liquid chemical etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0055After-treatment, e.g. cleaning or desmearing of holes
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/02Treatment of water, waste water, or sewage by heating
    • C02F1/04Treatment of water, waste water, or sewage by heating by distillation or evaporation
    • C02F1/048Purification of waste water by evaporation
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/42Treatment of water, waste water, or sewage by ion-exchange
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/44Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/722Oxidation by peroxides
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/52Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
    • C02F2001/5218Crystallization
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2101/00Nature of the contaminant
    • C02F2101/10Inorganic compounds
    • C02F2101/20Heavy metals or heavy metal compounds
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/16Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/005Processes using a programmable logic controller [PLC]
    • C02F2209/006Processes using a programmable logic controller [PLC] comprising a software program or a logic diagram
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Inorganic Chemistry (AREA)
  • Water Supply & Treatment (AREA)
  • Automation & Control Theory (AREA)
  • Hydrology & Water Resources (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • Water Treatment By Sorption (AREA)
  • Heat Treatment Of Water, Waste Water Or Sewage (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Processing Of Solid Wastes (AREA)
JP2021033282A 2020-03-04 2021-03-03 サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法 Active JP7152123B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022153249A JP2022191277A (ja) 2020-03-04 2022-09-27 有用材料サイクルにおけるサーキットボードおよび/または基板の製造

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
EP20160862 2020-03-04
EP20160862 2020-03-04
EP20172923.3A EP3875638A1 (de) 2020-03-04 2020-05-05 Verfahren zum aufbereiten eines fremdmetall- und metallsalz-haltigen mediums aus der leiterplatten- und/oder substrat-herstellung
EP20172960.5A EP3875640A1 (de) 2020-03-04 2020-05-05 Verfahren zum aufbereiten eines metallsalz-haltigen mediums aus teilströmen der leiterplatten- und/oder substrat-herstellung
EP20172906.8A EP3875637A1 (de) 2020-03-04 2020-05-05 Verfahren zum rückgewinnen eines elementaren metalls aus der leiterplatten- und/oder substrat-herstellung
EP20172960 2020-05-05
EP20172923 2020-05-05
EP20172981.1A EP3875642A1 (de) 2020-03-04 2020-05-05 Verfahren zum aufbereiten eines spülwassers aus der leiterplatten- und/oder substrat-herstellung
EP20172906 2020-05-05
EP20172928 2020-05-05
EP20172928.2A EP3875639A1 (de) 2020-03-04 2020-05-05 Verfahren zum herstellen von leiterplatten- und/oder substraten innerhalb eines wertstoffkreislaufs
EP20172981 2020-05-05
EP20172971.2A EP3875641A1 (de) 2020-03-04 2020-05-05 Verfahren zum aufbereiten eines metallsalz-haltigen mediums aus einem ätzprozess der leiterplatten- und/oder substrat-herstellung
EP20172971 2020-05-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022153249A Division JP2022191277A (ja) 2020-03-04 2022-09-27 有用材料サイクルにおけるサーキットボードおよび/または基板の製造

Publications (2)

Publication Number Publication Date
JP2021137804A JP2021137804A (ja) 2021-09-16
JP7152123B2 true JP7152123B2 (ja) 2022-10-12

Family

ID=69960201

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021033282A Active JP7152123B2 (ja) 2020-03-04 2021-03-03 サーキットボードおよび/または基板製造の部分ストリームからの金属塩含有溶媒を処理する方法
JP2022153249A Pending JP2022191277A (ja) 2020-03-04 2022-09-27 有用材料サイクルにおけるサーキットボードおよび/または基板の製造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022153249A Pending JP2022191277A (ja) 2020-03-04 2022-09-27 有用材料サイクルにおけるサーキットボードおよび/または基板の製造

Country Status (5)

Country Link
EP (6) EP3875638A1 (enExample)
JP (2) JP7152123B2 (enExample)
KR (2) KR102558446B1 (enExample)
CN (2) CN113355676B (enExample)
TW (2) TWI795737B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7752087B2 (ja) * 2022-04-04 2025-10-09 株式会社Screenホールディングス 基板処理装置および基板処理方法
EP4339165A1 (en) * 2022-09-16 2024-03-20 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Separating a foreign metal from a process fluid, method and apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501256A (ja) 1999-06-15 2003-01-14 ロディア・ポリアミド・インターミーディエッツ 鉄を他の金属イオンから分離する方法、並びにアルコール及びケトンを酸化してカルボン酸にする反応において触媒を循環させる方法
JP2003535223A (ja) 2000-05-25 2003-11-25 マイクロリス・コーポレイシヨン メッキ浴の再生
JP2004025133A (ja) 2002-06-28 2004-01-29 Matsushita Environment Airconditioning Eng Co Ltd 排水処理装置及び排水処理方法
US20060243604A1 (en) 2003-04-30 2006-11-02 Sota Nakagawa Method and apparatus for treating waste water

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120012B2 (enExample) * 1971-11-08 1976-06-22
US3784455A (en) * 1971-12-28 1974-01-08 Western Electric Co Methods of electrolytic regenerative etching and metal recovery
DE2434305C2 (de) * 1974-07-17 1983-09-29 Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg Ätzanlage
JPS5124537A (en) * 1974-08-26 1976-02-27 Hitachi Ltd Etsuchinguyokuno saiseihoho
JPS51137604A (en) * 1975-05-24 1976-11-27 Nippon Filter Kk Process for recovery of heavy metals
JPS51145434A (en) * 1975-06-10 1976-12-14 Hitachi Cable Metal pickling and washing system
JPS6019087A (ja) * 1983-07-12 1985-01-31 Toyo Soda Mfg Co Ltd 鉄塩水溶液中の重金属除去方法
US4668864A (en) * 1984-08-22 1987-05-26 Nicolet Instrument Corporation Mass spectrometer
JPS6238247A (ja) * 1985-08-12 1987-02-19 Hitachi Ltd イオン交換樹脂の再生方法
DE3767359D1 (de) * 1986-05-16 1991-02-21 Electroplating Eng Verfahren und geraet zur wiedergewinnung einer edelmetallverbindung.
DE3929121C1 (enExample) * 1989-09-01 1991-02-28 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
JPH0489316A (ja) * 1990-08-01 1992-03-23 Toagosei Chem Ind Co Ltd 塩酸含有塩化銅水溶液から硫酸銅を回収する方法
JP2754925B2 (ja) * 1991-01-14 1998-05-20 オルガノ株式会社 プリント基板洗浄希薄排水からの水の回収方法
US5112491A (en) * 1991-03-01 1992-05-12 E. I. Du Pont De Nemours And Company Management of waste solution containing photoresist materials
DE4109434C2 (de) * 1991-03-22 1993-12-23 Ludwig Mechler Gmbh Verfahren zum Aufarbeiten von chromathaltigen Abwässern und/oder Prozeßlösungen
JP2980421B2 (ja) * 1991-07-18 1999-11-22 株式会社東芝 ニューラルネット・モデルを用いた制御器
DE4200849C2 (de) * 1992-01-15 1994-04-28 Gewerk Keramchemie Verfahren und Vorrichtung zur Aufbereitung des bei der chemischen und/oder elektrolytischen Oberflächenbehandlung von Metallen anfallenden Spülwassers
DE19506297A1 (de) * 1995-02-23 1996-08-29 Schloemann Siemag Ag Verfahren und Anlage zum Regenerieren von Sulfatelektrolyt bei der Stahlband-Verzinkung
JPH08243537A (ja) * 1995-03-15 1996-09-24 Hitachi Ltd 表面処理工場の用・排水の管理方法とその装置
DE19539865A1 (de) * 1995-10-26 1997-04-30 Lea Ronal Gmbh Durchlauf-Galvanikanlage
DE19719020A1 (de) * 1997-05-07 1998-11-12 Km Europa Metal Ag Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen
JP4097753B2 (ja) * 1997-12-24 2008-06-11 ローム・アンド・ハース電子材料株式会社 ポジ型フォトレジスト組成物
DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
US6770184B1 (en) * 2001-02-13 2004-08-03 Advanced Micro Devices, Inc. Integrated de-ionized water pressure monitoring system for solder plating machines
EP1253497B1 (en) * 2001-04-27 2008-04-02 Qimonda Dresden GmbH & Co. oHG Method for adjusting processing parameters of plate-like objects in a processing tool
FR2833719B1 (fr) * 2001-12-13 2004-02-20 Valeo Vision Procede de correction d'image pour un projecteur d'images tete haute, et dispositif mettant en oeuvre le procede
US20040026255A1 (en) * 2002-08-06 2004-02-12 Applied Materials, Inc Insoluble anode loop in copper electrodeposition cell for interconnect formation
DE502005003655D1 (de) * 2005-05-25 2008-05-21 Enthone Verfahren und Vorrichtung zur Einstellung der Ionenkonzentration in Elektrolyten
TW200720445A (en) * 2005-11-17 2007-06-01 Chang Alex Heavy metal recovery system and method for heavy metal recovery
JP5120533B2 (ja) * 2007-02-28 2013-01-16 栗田工業株式会社 めっき液添加剤のカチオン除去装置、及びめっき液添加剤の処理方法
TW200900511A (en) * 2007-06-20 2009-01-01 Hung Yi Co Ltd Recycling of nickel-containing waste
WO2013080326A1 (ja) * 2011-11-30 2013-06-06 不二商事株式会社 めっき液の再生方法
CN103243348B (zh) * 2013-05-03 2014-09-17 广东新大禹环境工程有限公司 回收电镀废水中重金属的方法和设备
DE202015002289U1 (de) * 2015-03-25 2015-05-06 Hartmut Trenkner Zweikammer - Elektrodialysezelle mit Anionen- und Kationenaustauschermembran zur Verwendung als Anode in alkalischen Zink- und Zinklegierungselektrolyten zum Zweck der Metallabscheidung in galvanischen Anlagen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501256A (ja) 1999-06-15 2003-01-14 ロディア・ポリアミド・インターミーディエッツ 鉄を他の金属イオンから分離する方法、並びにアルコール及びケトンを酸化してカルボン酸にする反応において触媒を循環させる方法
JP2003535223A (ja) 2000-05-25 2003-11-25 マイクロリス・コーポレイシヨン メッキ浴の再生
JP2004025133A (ja) 2002-06-28 2004-01-29 Matsushita Environment Airconditioning Eng Co Ltd 排水処理装置及び排水処理方法
US20060243604A1 (en) 2003-04-30 2006-11-02 Sota Nakagawa Method and apparatus for treating waste water
JP2006527067A (ja) 2003-04-30 2006-11-30 株式会社荏原製作所 廃水の処理方法および装置

Also Published As

Publication number Publication date
EP3875639A1 (de) 2021-09-08
KR102558446B1 (ko) 2023-07-20
EP3875637A1 (de) 2021-09-08
JP2021137804A (ja) 2021-09-16
EP3875641A1 (de) 2021-09-08
KR20210113059A (ko) 2021-09-15
TW202219282A (zh) 2022-05-16
CN113355676B (zh) 2024-05-24
TWI795737B (zh) 2023-03-11
EP3875638A1 (de) 2021-09-08
TW202321471A (zh) 2023-06-01
JP2022191277A (ja) 2022-12-27
EP3875642A1 (de) 2021-09-08
KR20230113249A (ko) 2023-07-28
EP3875640A1 (de) 2021-09-08
CN113355676A (zh) 2021-09-07
TWI871576B (zh) 2025-02-01
CN118422201A (zh) 2024-08-02

Similar Documents

Publication Publication Date Title
JP7379351B2 (ja) リチウムの抽出と変換のための統合システム
TWI430964B (zh) 廢水處理系統以及方法(五)
JP2022191277A (ja) 有用材料サイクルにおけるサーキットボードおよび/または基板の製造
JP2022191277A5 (enExample)
WO2005123605A1 (ja) 電解析出処理装置および方法
CN113026003A (zh) 一种化学镀镍老化液还原再生方法
JP7700427B2 (ja) サーキットボード及び/又は基板製造からのエッチング廃棄溶媒を処理する方法、及び、サーキットボード及び/又は基板製造産業プラント
WO2004056712A1 (en) Method and device for electrolytically removing and recovering metal ions from waste water
CN1072737A (zh) 处理蚀刻剂的方法
CN112624483A (zh) 一种电路板生产喷淋塔废水的处理系统及处理方法
Chang et al. Alternative waste minimization analyses for the printed circuit board industry: Examples for small and large manufacturers
EP3875643A2 (en) A method of processing an etching waste medium from circuit board and/or substrate manufacture
JP2006176353A (ja) 銅エッチング廃液から塩酸及び銅を回収する方法
JPH11507700A (ja) 金属アンモニア溶液の再生法
CN1852866A (zh) 含水化学废物的处理
JP2006095391A (ja) 廃水処理装置および方法
KR20070022854A (ko) 액체의 처리장치
Waters ecsvery Process for Complexed Copper-Bearing Rinse Waters

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210402

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220509

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220830

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220927

R150 Certificate of patent or registration of utility model

Ref document number: 7152123

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250