JP7111916B1 - 再転写方法及びリフト方法 - Google Patents

再転写方法及びリフト方法 Download PDF

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Publication number
JP7111916B1
JP7111916B1 JP2021572954A JP2021572954A JP7111916B1 JP 7111916 B1 JP7111916 B1 JP 7111916B1 JP 2021572954 A JP2021572954 A JP 2021572954A JP 2021572954 A JP2021572954 A JP 2021572954A JP 7111916 B1 JP7111916 B1 JP 7111916B1
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substrate
photomask
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Japanese (ja)
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JPWO2023002555A1 (https=
JPWO2023002555A5 (https=
Inventor
裕 山岡
悟基 仲田
健人 宇佐美
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2022096305A priority Critical patent/JP7255000B2/ja
Priority to JP2022096264A priority patent/JP7819043B2/ja
Priority to JP2022096303A priority patent/JP7382453B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/03—Manufacture or treatment using mass transfer of LEDs, e.g. by using liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lasers (AREA)
JP2021572954A 2021-07-20 2021-07-20 再転写方法及びリフト方法 Active JP7111916B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022096305A JP7255000B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法、リフト方法、フォトマスク及びリフトシステム
JP2022096264A JP7819043B2 (ja) 2021-07-20 2022-06-15 リフト方法、再転写方法及びディスプレイの製造方法
JP2022096303A JP7382453B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/027082 WO2023002555A1 (ja) 2021-07-20 2021-07-20 走査型縮小投影光学系及びこれを用いたレーザ加工装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2022096264A Division JP7819043B2 (ja) 2021-07-20 2022-06-15 リフト方法、再転写方法及びディスプレイの製造方法
JP2022096305A Division JP7255000B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法、リフト方法、フォトマスク及びリフトシステム
JP2022096303A Division JP7382453B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法

Publications (3)

Publication Number Publication Date
JP7111916B1 true JP7111916B1 (ja) 2022-08-02
JPWO2023002555A1 JPWO2023002555A1 (https=) 2023-01-26
JPWO2023002555A5 JPWO2023002555A5 (https=) 2023-06-27

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JP2021572954A Active JP7111916B1 (ja) 2021-07-20 2021-07-20 再転写方法及びリフト方法
JP2022096303A Active JP7382453B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法
JP2022096264A Active JP7819043B2 (ja) 2021-07-20 2022-06-15 リフト方法、再転写方法及びディスプレイの製造方法

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JP2022096303A Active JP7382453B2 (ja) 2021-07-20 2022-06-15 不良箇所の除去方法
JP2022096264A Active JP7819043B2 (ja) 2021-07-20 2022-06-15 リフト方法、再転写方法及びディスプレイの製造方法

Country Status (6)

Country Link
US (1) US20240246172A1 (https=)
EP (1) EP4375002A4 (https=)
JP (3) JP7111916B1 (https=)
KR (1) KR20240031297A (https=)
CN (1) CN117677888A (https=)
WO (1) WO2023002555A1 (https=)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2024057755A1 (ja) * 2022-09-13 2024-03-21 デクセリアルズ株式会社 個片フィルムの製造方法及び個片フィルム、並びに表示装置の製造方法及び表示装置
WO2024158043A1 (ja) * 2023-01-26 2024-08-02 信越エンジニアリング株式会社 移送方法、基板、及びリペア方法
KR20250128973A (ko) 2022-12-27 2025-08-28 신에츠 엔지니어링 가부시키가이샤 이송 장치 및 이송 방법

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WO2024218918A1 (ja) * 2023-04-19 2024-10-24 信越エンジニアリング株式会社 レーザ照射装置、レーザ加工装置、レーザ加工方法、レーザ露光装置、レーザ露光方法、マスクの設置方法、レーザ加工装置の設置方法、レーザ露光装置の設置方法、マスク及びレーザ照射システム
JP2026043509A (ja) * 2024-08-28 2026-03-12 沖電気工業株式会社 レンズユニット、受光装置及び読取装置

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JP2008110384A (ja) * 2006-10-31 2008-05-15 Sumitomo Electric Ind Ltd 多孔質樹脂膜とその穿孔方法、その樹脂膜を用いた異方性導電シート、電気検査方法及び回路接続方法
JP2012123127A (ja) * 2010-12-07 2012-06-28 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2015534903A (ja) * 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置
JP2018027551A (ja) * 2016-08-17 2018-02-22 株式会社フォーサイトテクノ 共焦点型ビームプロファイラー
WO2019244362A1 (ja) * 2018-06-20 2019-12-26 丸文株式会社 リフト装置及び使用方法

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Publication number Priority date Publication date Assignee Title
WO2000009993A1 (fr) * 1998-08-10 2000-02-24 Mitsubishi Denki Kabushiki Kaisha Dispositif de verification de cartes a circuit imprime
JP2006309994A (ja) * 2005-04-27 2006-11-09 Sony Corp 転写用基板および転写方法ならびに表示装置の製造方法
JP2008110384A (ja) * 2006-10-31 2008-05-15 Sumitomo Electric Ind Ltd 多孔質樹脂膜とその穿孔方法、その樹脂膜を用いた異方性導電シート、電気検査方法及び回路接続方法
JP2012123127A (ja) * 2010-12-07 2012-06-28 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2015534903A (ja) * 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置
JP2018027551A (ja) * 2016-08-17 2018-02-22 株式会社フォーサイトテクノ 共焦点型ビームプロファイラー
WO2019244362A1 (ja) * 2018-06-20 2019-12-26 丸文株式会社 リフト装置及び使用方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024057755A1 (ja) * 2022-09-13 2024-03-21 デクセリアルズ株式会社 個片フィルムの製造方法及び個片フィルム、並びに表示装置の製造方法及び表示装置
KR20250128973A (ko) 2022-12-27 2025-08-28 신에츠 엔지니어링 가부시키가이샤 이송 장치 및 이송 방법
WO2024158043A1 (ja) * 2023-01-26 2024-08-02 信越エンジニアリング株式会社 移送方法、基板、及びリペア方法
WO2024157426A1 (ja) * 2023-01-26 2024-08-02 信越エンジニアリング株式会社 移送方法
KR20250140526A (ko) 2023-01-26 2025-09-25 신에츠 엔지니어링 가부시키가이샤 이송 방법, 기판 및 리페어 방법

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JP2023015997A (ja) 2023-02-01
JPWO2023002555A1 (https=) 2023-01-26
US20240246172A1 (en) 2024-07-25
KR20240031297A (ko) 2024-03-07
WO2023002555A1 (ja) 2023-01-26
EP4375002A4 (en) 2025-07-09
JP7819043B2 (ja) 2026-02-24
JP7382453B2 (ja) 2023-11-16
CN117677888A (zh) 2024-03-08
JP2023015996A (ja) 2023-02-01
EP4375002A1 (en) 2024-05-29

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