JP7095089B2 - 実装機および実装システム - Google Patents

実装機および実装システム Download PDF

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Publication number
JP7095089B2
JP7095089B2 JP2020526758A JP2020526758A JP7095089B2 JP 7095089 B2 JP7095089 B2 JP 7095089B2 JP 2020526758 A JP2020526758 A JP 2020526758A JP 2020526758 A JP2020526758 A JP 2020526758A JP 7095089 B2 JP7095089 B2 JP 7095089B2
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Japan
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head
rotary head
component
parts
image pickup
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JP2020526758A
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Japanese (ja)
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JPWO2020003385A1 (ja
Inventor
雅史 天野
貴紘 小林
勇太 横井
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2020526758A 2018-06-26 2018-06-26 実装機および実装システム Active JP7095089B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/024224 WO2020003385A1 (ja) 2018-06-26 2018-06-26 実装機および実装システム

Publications (2)

Publication Number Publication Date
JPWO2020003385A1 JPWO2020003385A1 (ja) 2021-07-08
JP7095089B2 true JP7095089B2 (ja) 2022-07-04

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ID=68986883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020526758A Active JP7095089B2 (ja) 2018-06-26 2018-06-26 実装機および実装システム

Country Status (3)

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JP (1) JP7095089B2 (zh)
CN (1) CN112314065B (zh)
WO (1) WO2020003385A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014001939A (ja) 2012-06-15 2014-01-09 Juki Corp 部品検査装置
JP2014154750A (ja) 2013-02-12 2014-08-25 Fuji Mach Mfg Co Ltd 組立機
JP2014165209A (ja) 2013-02-21 2014-09-08 Panasonic Corp 部品実装装置、および、部品実装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5524495B2 (ja) * 2009-03-10 2014-06-18 富士機械製造株式会社 撮像システムおよび電子回路部品装着機
CN105075419B (zh) * 2013-03-12 2018-09-28 富士机械制造株式会社 元件安装机的元件识别系统
US20150029330A1 (en) * 2013-07-25 2015-01-29 Panasonic Corporation Electronic component mounting apparatus and electronic component mounting method
US20160192552A1 (en) * 2013-08-07 2016-06-30 Fuji Machine Mfg, Co., Ltd. Electronic component mounting machine and transfer confirmation method
CN106030769B (zh) * 2014-02-19 2019-07-12 株式会社富士 对基板作业系统及管理对基板作业系统的元件的安装顺序的方法
JP6500100B2 (ja) * 2015-05-29 2019-04-10 株式会社Ｆｕｊｉ 最適化プログラム、および装着作業機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014001939A (ja) 2012-06-15 2014-01-09 Juki Corp 部品検査装置
JP2014154750A (ja) 2013-02-12 2014-08-25 Fuji Mach Mfg Co Ltd 組立機
JP2014165209A (ja) 2013-02-21 2014-09-08 Panasonic Corp 部品実装装置、および、部品実装方法

Also Published As

Publication number Publication date
WO2020003385A1 (ja) 2020-01-02
JPWO2020003385A1 (ja) 2021-07-08
CN112314065A (zh) 2021-02-02
CN112314065B (zh) 2022-03-18

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